Device for cooling electrical components

Patent metadata

Field	Value
Publication number	US-10930577-B2
Application number	US-201615754925-A
Country	US
Kind code	B2
Filing date	Jun 21, 2016
Priority date	Aug 24, 2015
Publication date	Feb 23, 2021
Grant date	Feb 23, 2021

Abstract

A device for cooling a plurality of electrical components, each having a component cooling surface to be cooled, includes a first heat sink, a second heat sink, and a plurality of fasteners. The first heat sink has a first heat-sink cooling surface, and the second heat sink has a second heat-sink cooling surface. The first and second heat-sink cooling surfaces are positioned in a planar arrangement such that the first and second heat-sink cooling surfaces face each other. The first heat-sink cooling surface is configured to receive a first sub-set of the component cooling surfaces of the plurality of electrical components, and the second heat-sink cooling surface is configured to receive a second sub-set of the component cooling surfaces. The fasteners are configured to fasten the first and second heat-sink cooling surfaces to the corresponding component cooling surfaces of the plurality of electrical components to be applied.

First claim

The invention claimed is:

1. A device for cooling a plurality of electrical components each component having a cooling component cooling surface, the device comprising:
a first cooling body including a first cooling body cooling surface configured receive a first sub-set of the component cooling surfaces of the plurality of electrical components; and
a second cooling body including a second cooling body cooling surface,
the second cooling body positioned in a planar arrangement with the first cooling body such that the first cooling body cooling surface and the second cooling body cooling surface are opposite each other, and
the second cooling body cooling surface configured to receive a second sub-set of the component cooling surfaces of the plurality of electrical components; and

a fastening mechanism configured to fasten the first and second sub-sets of the component cooling surfaces to the first and second cooling body cooling surfaces, respectively,
wherein each of the first and second the cooling body cooling surfaces is further configured to receive the first and second sub-sets of component cooling surfaces of the plurality of electrical components, respectively, in positions such that the electrical components on each of the first and second cooling body surfaces are positioned adjacent to each other along a straight line in one plane, and such that a component cooling surface of a first electrical component is attached to the first cooling body cooling surface and a component cooling surface of a further electrical component is-attached to the second cooling body cooling surface.

2. The device as claimed in claim 1 , wherein at least one of the first and second cooling body cooling surfaces is configured as a planar surface, at least in part.

3. The device as claimed in claim 1 , wherein the first and second cooling body cooling surfaces are configured to receive approximately half of the plurality of electrical components.

4. The device as claimed in claim 1 , wherein fastening mechanism includes a resilient element.

5. The device as claimed in claim 3 , wherein the fastening mechanism is configured such that in a fastened position, the fastening mechanism is:
supported on a first component surface of an electronic component, the first component surface lying opposite the first and second component cooling surfaces;
supported on a one of the cooling body cooling surfaces that is lying opposite the first component element;
supported on a second component surface of a further electrical component, the second component surface lying opposite the first component surface; or
supported on a mechanical fixing point that lies opposite the first component surface.

6. The device as claimed in claim 1 , wherein the fastening mechanism is further configured to clamp the first and second sub-sets of component cooling surface of the electronic component and the first and second cooling body cooling surface against each other, respectively.

7. The device as claimed in claim 1 , wherein the fastening mechanism includes a screw or a rivet.

Assignees

• Bosch Gmbh Robert

Inventors

• Taufer Peter
• Butzmann Stefan
• Eckert Bernd

Classifications

• H10W40/625

  Clamping parts not primarily conducting heat · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W72/874

  On different surfaces · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W90/00

  Package configurations · CPC title