Method of manufacturing imprint stamp and display apparatus manufactured using the imprint stamp

Patent metadata

Field	Value
Publication number	US-10926564-B2
Application number	US-201715628083-A
Country	US
Kind code	B2
Filing date	Jun 20, 2017
Priority date	Jul 19, 2016
Publication date	Feb 23, 2021
Grant date	Feb 23, 2021

Abstract

A method of manufacturing an imprint stamp including forming an imprint resist only in a second area of a sample substrate including a first area and the second area, pressing the imprint resist with the imprint stamp and curing the imprint resist, in which the imprint stamp includes a fine protrusion pattern that corresponds to the first area and the second area of the sample substrate, and separating the imprint stamp from the sample substrate such that a portion of the fine protrusion pattern corresponding to the second area is separated from the imprint stamp by the cured imprint resist.

First claim

What is claimed is:

1. A method of manufacturing an imprint stamp, the method comprising:
forming an imprint resist only in a second area of a sample substrate, the sample substrate comprising a first area and the second area;
pressing the imprint resist with a preliminary imprint stamp and curing the imprint resist, the preliminary imprint stamp comprising a fine protrusion pattern that corresponds to the first area and the second area of the sample substrate; and
separating the preliminary imprint stamp from the sample substrate, such that a portion of the fine protrusion pattern corresponding to the second area is separated from the preliminary imprint stamp by the cured imprint resist.

2. The method of claim 1 , wherein the fine protrusion pattern has the same pattern as a wire grid pattern.

3. The method of claim 2 , wherein a pitch of the fine protrusion pattern is 50 nm to 150 nm.

4. The method of claim 2 , wherein the sample substrate comprises a sample pattern in the second area.

5. The method of claim 4 , wherein:
the sample substrate comprises a display substrate of a display apparatus; and
the sample pattern comprises a black matrix pattern of the display apparatus.

6. The method of claim 5 , wherein a line width of the sample pattern is at least 10 μm.

7. The method of claim 1 , wherein the imprint resist comprises at least one of thermosetting resin and photocurable resin.

8. The method of claim 7 , wherein the fine protrusion pattern of the imprint stamp is formed by curing the at least one of the thermosetting resin and photocurable resin.

9. The method of claim 8 , wherein the imprint resist and the fine protrusion pattern comprise the same material.

10. The method of claim 1 , wherein in the step of separating the preliminary imprint stamp from the sample substrate, a process condition is set such that a bonding force between the cured imprint resist and the fine protrusion pattern is:
greater than a releasing force between the cured imprint resist and the fine protrusion pattern; and
greater than strength of a structure of the fine protrusion pattern.

11. The method of claim 1 , wherein the imprint resist is formed only in the second area using an inkjet method.

12. The method of claim 11 , wherein the imprint resist contacts the sample substrate.

13. The method of claim 11 , wherein:
a sample pattern is formed in the second area of the sample substrate; and
the imprint resist is disposed on the sample pattern.

Assignees

• Samsung Display Co Ltd

Inventors

• Kim Min-Uk
• An Moonjung
• Lee Dongeon
• Han Kang Soo
• Jo Gugrae

Classifications

• G02B5/3058 Primary

  comprising electrically conductive elements, e.g. wire grids, conductive particles · CPC title

• G03F7/0002

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• B41K1/50 Primary

  Stamping surfaces impregnated with ink, or made of material leaving a mark after stamping contact · CPC title

• B82Y10/00

  Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title

• B82Y40/00

  Manufacture or treatment of nanostructures · CPC title