Liquid supply member and manufacturing method of liquid supply member

US10926441B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10926441-B2
Application numberUS-201715649472-A
CountryUS
Kind codeB2
Filing dateJul 13, 2017
Priority dateJul 29, 2016
Publication dateFeb 23, 2021
Grant dateFeb 23, 2021

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

There is provided a liquid supply member capable of suppressing deformation of a liquid supply path and decrease in sealing property of a liquid supply path, during molding, and a manufacturing method of the liquid supply member. For that purpose, in die-slide injection molding that combines two components, a protection portion that protects a part of one component easily affected by heat and pressure, is provided on the other component.

First claim

Opening claim text (preview).

What is claimed is: 1. A manufacturing method of a liquid supply member, the method comprising: a primary molding process of molding, at different positions in a same die, a first member including a part of a flow path capable of causing liquid to flow and a second member including a member that forms the flow path by being combined with the part of the flow path of the first member; a secondary molding process of joining the first member and the second member with a molten resin by relatively moving a first pattern and a second pattern of the die to cause the first member and the second member to face each other and by molding the first member and the second member in an overlapped manner; a process of forming a liquid supply wall constituting the flow path on an end portion side of an inflow path of the second member in which the molten resin flows, and a process of forming a convex-shaped protection portion on the end portion side of the inflow path of the first member, in the primary molding process, the liquid supply wall including a thick-wall portion and a thin-wall portion connected to the thick wall portion and having a tapered shape having an inclined surface; and a process of making one side surface of the thin-wall portion and one side surface of the protection portion adjacent and opposed to each other to thereby overlap the first member and the second member, in the secondary molding process, the protection portion being provided at a position corresponding to an entire area of the thin-wall portion, wherein in a state in which the secondary molding process is finished, another side surface of the protection portion, which is a back surface of the one side surface of the protection portion, is in contact with the molten resin. 2. The manufacturing method according to claim 1 , wherein contact between the thin-wall portion and the protection portion prevents contact between the thin-wall portion and the molten resin. 3. The manufacturing method according to claim 1 , further comprising a process of forming a cross-sectional shape of the protection portion to be rectangular, on a surface defined by an axis in a direction in which the molten resin flows into the thin-wall portion and an axis in a direction in which the first member and the second member are caused to abut. 4. The manufacturing method according to claim 1 , further comprising a process of forming a width of the protection portion in a direction in which the molten resin flows to be larger than a width of the thin-wall portion in the direction in which the molten resin flows. 5. The manufacturing method according to claim 1 , wherein connection between the first member and the second member causes the flow path and a supply path to be connected. 6. The manufacturing method according to claim 1 , wherein the method causes the molten resin to flow into the inflow path, and causes the molten resin to flow toward the other side surface of the protection portion, in the secondary molding process. 7. The manufacturing method according to claim 1 , wherein a back side of the one side surface of the thin-wall portion is a part of a supply path capable of causing liquid to flow. 8. The manufacturing method according to claim 7 , wherein a part of a die is inserted into a part of the supply path, in the secondary molding process. 9. The manufacturing method according to claim 8 , wherein the protection portion prevents contact between the thin-wall portion of a portion of the supply path in which the die is not inserted, and the molten resin. 10. The manufacturing method according to claim 8 , further comprising a process of forming a cross-sectional shape of the protection portion to be a shape that tapers toward a tip from a base, on a surface defined by an axis in a direction in which the molten resin flows into the thin-wall portion and an axis in a direction in which the first member and the second member are caused to abut.

Assignees

Inventors

Classifications

  • Joined by injection moulding · CPC title

  • Ink or toner cartridges · CPC title

  • facing before assembling, i.e. bringing the parts opposite to each other before assembling · CPC title

  • Ink connection · CPC title

  • Mounting within the printer · CPC title

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Frequently asked questions

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What does patent US10926441B2 cover?
There is provided a liquid supply member capable of suppressing deformation of a liquid supply path and decrease in sealing property of a liquid supply path, during molding, and a manufacturing method of the liquid supply member. For that purpose, in die-slide injection molding that combines two components, a protection portion that protects a part of one component easily affected by heat and p…
Who is the assignee on this patent?
Canon Kk
What technology area does this patent fall under?
Primary CPC classification B29C45/0062. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 23 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).