Packaged electronic device having integrated antenna and locking structure

Patent metadata

Field	Value
Publication number	US-10923800-B2
Application number	US-202016740452-A
Country	US
Kind code	B2
Filing date	Jan 12, 2020
Priority date	Nov 3, 2015
Publication date	Feb 16, 2021
Grant date	Feb 16, 2021

Abstract

A packaged electronic device includes an integrated antenna as part of a conductive leadframe. The conductive leadframe includes a die paddle have an elongated conductive beam structure configured as a transmission line, and a ground plane structure disposed surrounding the die paddle. The ground plane includes a gap where the transmission line extends to an edge of the packaged electronic device. In one embodiment, selected leads within the leadframe are configured with conductive connective structures as ground pins, source pins, and/or wave guides. In an alternate embodiment, a portion of the integrated antenna is embedded and partially exposed within the body of the packaged electronic device.

First claim

What is claimed is:

1. An antenna structure, comprising:
an insulative substrate having a first major surface and a second major surface opposite to the first major surface;
conductive traces embedded within the insulative substrate;
a ground plane embedded within the insulative substrate;
a grounding structure positioned proximate to the second major surface electrically coupled to the ground plane;
a conductive patch layer positioned proximate to the first major surface so that the grounding structure and the conductive patch are positioned proximate to opposite sides of the insulative substrate, wherein the conductive patch layer is electrically coupled to the ground plane; and
a conductive feed structure comprising:
a first conductive structure positioned proximate to the second major surface and external to the insulative substrate; and
a second conductive structure comprising a conductive via embedded within the insulative substrate, extending from the second major surface to the first major surface through an opening in the ground plane, and electrically coupled to the conductive patch layer and the first structure.

2. The antenna structure of claim 1 , further comprising:
a conductive signal structure positioned proximate to the second major surface external to the insulative substrate and electrically coupled to one of the conductive traces.

3. The antenna structure of claim 1 , wherein:
the grounding structure comprises:
first solder structures positioned proximate to the second major surface and external to the insulative substrate; and
conductive ground vias extending from the second major surface to the ground plane, wherein each of the conductive ground vias is electrically coupled to at least one of the first solder structures; and

the first conductive structure comprises a second solder structure.

4. The antenna structure of claim 3 , wherein:
the first solder structures surround the second solder structure in a plan view.

5. The antenna structure of claim 4 , wherein:
the first solder structures and the second solder structure are substantially symmetrically centered over the insulative substrate in the plan view.

6. The antenna structure of claim 1 , wherein:
the grounding structure comprises a solder structure attached to the second major surface.

7. The antenna structure of claim 1 , wherein:
the conductive patch layer is electrically coupled to the ground plane with a conductive pin embedded within the insulative substrate.

8. A packaged electronic device having an integrated antenna, comprising:
a lead frame comprising:
a first die pad,
a second die pad spaced apart from the first die pad, and
conductive leads;

a first electronic component coupled to the first die pad and electrically coupled to the conductive leads;
a second electronic component having a first major surface and an opposing second major surface, wherein:
the second major surface is coupled to the second die pad, and
the second electronic component comprises an antenna proximate to the first major surface, and
the first electronic device is electrically coupled to the antenna; and

a package body covering the first electronic component, the second electronic component, and at least a portion of the lead frame.

9. The device of claim 8 , wherein:
the second electronic component comprises a semiconductor integrated passive device.

10. The device of claim 8 , wherein:
the antenna comprises a spiral antenna having a first end electrically coupled to the first electronic device and an opposing second end electrically coupled to the second die pad.

11. The device of claim 8 , wherein:
the second electronic component comprises a conductive ground plane layer over the second major surface and interposed between the second electronic component and the second die pad.

12. The device of claim 8 , further comprising:
a balun device electrically coupled between the first electronic component and the second electronic component.

13. The device of claim 12 , wherein:
the balun device is provided as part of the first electronic device.

14. The device of claim 12 , wherein:
the balun device is disposed on the second die pad.

15. The device of claim 8 , further comprising:
a grounding structure electrically coupled to the antenna and the second die pad.

16. The device of claim 8 , wherein:
the antenna comprises a plated antenna.

17. The device of claim 8 , wherein:
the package body is laterally interposed between the first die pad and the second die pad.

18. The device of claim 8 , wherein:
the antenna is embedded within the package body.

19. A packaged electronic device having an integrated antenna comprising:
a lead frame comprising:
a first die pad,
a second die pad spaced apart from the first die pad, and
conductive leads;

a first electronic component coupled to the first die pad and electrically coupled to the conductive leads;
a second electronic component having a first major surface and an opposing second major surface, wherein:
the second major surface is coupled to the second die pad, and
the second electronic component comprises an antenna proximate to the first major surface,
the antenna comprise a semiconductor integrated passive device, and
the first electronic device is electrically coupled to the antenna; and

a package body covering the first electronic component, the second electronic component, and at least a portion of the lead frame.

20. The device of claim 19 , wherein:
the antenna comprises a spiral antenna having a first end electrically coupled to the first electronic device and an opposing second end electrically coupled to the second die pad; and
the antenna is embedded inside the package body.

Assignees

• Amkor Technology Inc
• Amkor Tech Singapore Holding Pte Ltd

Inventors

• Mangrum Marc Alan

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/5449

  not being orthogonal to a side surface of the chip, e.g. fan-out arrangements · CPC title