Semiconductor device with air gap and method for fabricating the same

Patent metadata

Field	Value
Publication number	US-10923390-B2
Application number	US-202016807901-A
Country	US
Kind code	B2
Filing date	Mar 3, 2020
Priority date	Sep 29, 2017
Publication date	Feb 16, 2021
Grant date	Feb 16, 2021

Abstract

A method for fabricating a semiconductor device includes: forming a plurality of bit line structures over a semiconductor substrate; forming a line-type opening between the bit line structures; forming a sacrificial spacer on both sidewalls of the line-type opening; forming a line-type plug filling the line-type opening over the sacrificial spacer; forming a plurality of plug isolation openings that expose the sacrificial spacer by etching a portion of the line-type plug in a direction crossing the bit line structures; forming a plurality of air gaps by removing the exposed sacrificial spacer; removing a remaining line-type plug below the plug isolation openings to form a plurality of island-type plugs; and forming a plug isolation layer inside the plug isolation openings to isolate neighboring island-type plugs from each other.

First claim

What is claimed is:

1. A semiconductor device, comprising:
a plurality of bit line structures formed over a semiconductor substrate to be spaced apart from each other;
a bit line spacer formed on both sidewalls of each of the bit line structures;
a plurality of island-type plugs formed between the bit line structures to contact the semiconductor substrate;
a plug isolation layer formed between the island-type plugs; and
a plurality of air gaps formed between the island-type plugs and the bit line spacer,
wherein each of the air gaps are isolated-type air gaps disposed between the bit line structures and the island-type plugs,
wherein each of the island-type plugs is comprising a head portion directly capping an upper portion of the air gaps, and
wherein an upper surface of the head portion is disposed at a lower level than upper surfaces of the bit line structures.

2. The semiconductor device of claim 1 , wherein each of the bit line structures includes:
a bit line contact plug over the semiconductor substrate;
a bit line over the bit line contact plug; and
a bit line hard mask layer over the bit line.

3. The semiconductor device of claim 2 , wherein each of the air gaps is formed between the bit line and the island-type plugs to be extended to be disposed between the bit line contact plug and the island-type plugs.

4. The semiconductor device of claim 3 , wherein each of the island-type plugs further comprises:
a bottom portion which is adjacent to the bit line contact plug with the air gaps therebetween; and
a middle portion which is disposed over the bottom portion to be adjacent to the bit line with the air gaps therebetween,
wherein the head portion is disposed over the middle portion to contact the bit line spacer while capping the upper portion of the air gaps.

5. The semiconductor device of claim 1 , wherein the island-type plugs include a polysilicon layer.

6. The semiconductor device of claim 1 , further comprising:
an ohmic contact layer formed on the head portion of the island-type plugs; and
a metal plug formed over the ohmic contact layer, and
a surrounding spacer suitable for surrounding sidewalls of the metal plug,
wherein an upper surface of the metal plug and the upper surfaces of the bit line structures are at the same level.

7. The semiconductor device of claim 1 , further comprising:
an isolation layer which is formed to define a plurality of active regions in the semiconductor substrate;
a gate trench which traverses the active regions and the isolation layer; and
a buried word line which is formed inside the gate trench.

Assignees

• Sk Hynix Inc

Inventors

• Yoon Jae-Man

Classifications

• H10W20/0698

  Local interconnections · CPC title

• H10W20/083

  the openings being via holes penetrating underlying conductors · CPC title

• H10W20/072 Primary

  of dielectric parts comprising air gaps · CPC title

• H10W20/069

  by forming self-aligned vias or self-aligned contact plugs · CPC title

• H10W20/46 Primary

  comprising air gaps · CPC title