Conductive Paste and Conductive Film
US-2018308603-A1 · Oct 25, 2018 · US
US10923283B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10923283-B2 |
| Application number | US-201816173254-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 29, 2018 |
| Priority date | Mar 2, 2018 |
| Publication date | Feb 16, 2021 |
| Grant date | Feb 16, 2021 |
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A multilayer ceramic electronic component includes a ceramic body including a dielectric and an internal electrode, an electrode layer eletrically connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a graphene platelet, and a base resin.
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What is claimed is: 1. A multilayer ceramic electronic component comprising: a ceramic body including a dielectric layer and an internal electrode; an electrode layer electrically connected to the internal electrode; and a conductive resin layer disposed on the electrode layer and including a conductive metal powder, a graphene platelet, and a base resin, wherein the graphene platelet has a planar shape. 2. The multilayer ceramic electronic component of claim 1 , wherein the graphene platelet includes a plurality of layered planar structures. 3. The multilayer ceramic electronic component of claim 1 , wherein a length of the graphene platelet along a major axis is within a range from 0.2 nm to 10 μm. 4. The multilayer ceramic electronic component of claim 1 , wherein a length of the graphene platelet along a minor axis is within a range from 0.2 nm to 10 μm. 5. The multilayer ceramic electronic component of claim 1 , wherein the conductive resin layer is formed of a paste including the graphene platelet and the conductive metal powder, and a content of the graphene platelet in the paste is within a range from 0.5 to 7.5 parts by weight, based on 100 parts by weight of the conductive metal powder. 6. The multilayer ceramic electronic component of claim 1 , wherein the conductive resin layer includes a plurality of the graphene platelets, and, in a cross section in a length and width direction, at least one of the graphene platelets is disposed within an area of 1 μm×1 μm in the conductive resin layer. 7. The multilayer ceramic electronic component of claim 1 , wherein the conductive resin layer includes a plurality of the graphene platelets which are evenly dispersed in the conductive resin layer. 8. A multilayer ceramic electronic component comprising: a ceramic body including a dielectric layer and an internal electrode; an electrode layer electrically connected to the internal electrode; and a conductive resin layer disposed on the electrode layer and including a conductive metal powder, a graphene platelet, and a base resin, wherein two peaks are detected when a Raman analysis of the conductive resin layer is performed, and wherein the graphene platelet has a planar shape. 9. The multilayer ceramic electronic component of claim 8 , wherein a first peak of the two peaks is detected in a D band, and a second peak of the two peaks is detected in a G band. 10. The multilayer ceramic electronic component of claim 8 , wherein the graphene platelet includes a plurality of layered planar structures. 11. The multilayer ceramic electronic component of claim 8 , wherein a length of the graphene platelet along a major axis is within a range from 0.2 nm to 10 μm. 12. The multilayer ceramic electronic component of claim 8 , wherein a length of the graphene platelet along a minor axis is within a range from 0.2 nm to 10 μm. 13. The multilayer ceramic electronic component of claim 8 , wherein the conductive resin layer is formed of a paste including the graphene platelet and the conductive metal powder, and a content of the graphene platelet in the paste is within a range from 0.5 to 7.5 parts by weight, based on 100 parts by weight of the conductive metal powder. 14. The multilayer ceramic electronic component of claim 8 , wherein the conductive resin layer includes a plurality of the graphene platelets and a density of the plurality of the graphene platelets in the conductive resin layer is greater than or equal to one graphene platelet per cubic μm of the conductive resin layer. 15. The multilayer ceramic electronic component of claim 8 , wherein the conductive resin layer includes a plurality of the graphene platelets which are evenly dispersed in the conductive resin layer. 16. A conductive resin including a base resin, a conductive metal powder and a plurality of graphene platelets having a planar shape, wherein the conductive resin is formed of a paste for an external electrode, and a content of the plurality of graphene platelets in the paste is within a range from 0.5 to 7.5 parts by weight, based on 100 parts by weight of the conductive metal powder. 17. The conductive resin of claim 16 , wherein a content of the base resin in the paste is within a range from 5 to 30 parts by weight, based on 100 parts by weight of the conductive metal powder. 18. The conductive resin of claim 16 , wherein the graphene platelets are evenly dispersed in the conductive resin.
the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title
characterised by the material of the terminals · CPC title
Stacked capacitors (H01G4/33 takes precedence) · CPC title
the conductive material comprising metals or alloys · CPC title
Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title
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