Chassis embedded heat pipe

Patent metadata

Field	Value
Publication number	US-10921869-B2
Application number	US-201916455323-A
Country	US
Kind code	B2
Filing date	Jun 27, 2019
Priority date	Jun 27, 2019
Publication date	Feb 16, 2021
Grant date	Feb 16, 2021

Abstract

Particular embodiments described herein provide for an electronic device that can be configured to include one or more heat sources, a heat pipe embedded in a chassis of the electronic device, where the heat pipe is thermally coupled to the one or more heat sources to collect heat from the one or more heat sources, and a thermal cooling device, where the thermal cooling device is thermally coupled to the heat pipe and can dissipate heat collected from the heat pipe using air from outside the chassis. In an example, the heat pipe is an oscillating heat pipe and has a thickness between about two (2) millimeters to about twelve (12) millimeters.

First claim

What is claimed is:

1. An electronic device comprising:
one or more heat sources;
a heat pipe embedded in a chassis of the electronic device, wherein the heat pipe is an oscillating heat pipe with a thickness between about two (2) millimeters to about twelve (12) millimeters and is thermally coupled to the one or more heat sources, wherein the heat pipe comprises a plurality of vapor groove channels integrated into the chassis and a vapor chamber lid secured above the plurality of vapor groove channels to form the heat pipe; and
a thermal cooling device, wherein the thermal cooling device includes a fan and a heat dissipator and the heat dissipator includes fins that are directly coupled to the heat pipe and can dissipate heat collected from the heat pipe.

2. The electronic device of claim 1 , wherein a portion of the chassis that does not include the heat pipe has a first thickness of about 0.8 millimeters and a portion of the chassis where the heat pipe is embedded has a second thickness of about 1.6 millimeters to about 3.5 millimeters.

3. The electronic device of claim 1 , further comprising:
a second heat pipe embedded in the chassis, wherein the second heat pipe is under and perpendicular to the heat pipe.

4. The electronic device of claim 1 , further comprising:
an insulation layer under the heat pipe to insulate an outer surface of the chassis from heat in the heat pipe.

5. The electronic device of claim 1 , wherein the one or more heat sources includes:
a first heat source with a first height; and
a second heat source, with a second height that is shorter than the first height, wherein the electronic device further comprises:
a pedestal on the heat pipe to accommodate a height difference between the first heat source and the second heat source.

6. The electronic device of claim 1 , further comprising:
a vacuum gap between the heat pipe and an outer surface of the chassis of the electronic device.

7. A chassis comprising:
one or more inlet vents to allow air from outside the chassis to flow into the chassis;
a heat pipe embedded in the chassis, wherein the heat pipe comprises a plurality of vapor groove channels integrated into the chassis and a vapor chamber lid secured above the plurality of vapor groove channels to form the heat pipe; and
a plurality of walls, wherein the plurality of walls define a chassis cavity, wherein the chassis cavity includes:
one or more heat sources, wherein the heat pipe has a thickness between about two (2) millimeters to about twelve (12) millimeters and is thermally coupled to the one or more heat sources to collect heat from the one or more heat sources; and
a thermal cooling device, wherein the thermal cooling device includes a fan and a heat dissipator and the heat dissipator includes fins that are directly coupled to the heat pipe and can dissipate heat collected from the heat pipe using air from outside the chassis that passed into the chassis through the one or more inlet vents.

8. The chassis of claim 7 , wherein the heat pipe is an oscillating heat pipe.

9. The chassis of claim 7 , wherein a portion of the chassis that does not include the heat pipe has a thickness of about 0.8 millimeters and a portion of the chassis where the heat pipe is embedded has a thickness of about 1.8 millimeters to about two (2) millimeters.

10. The chassis of claim 7 , wherein the chassis is part of a clamshell computer.

11. A method comprising:
creating grooved vapor channels in a chassis of a housing of an electronic device;
securing a vapor chamber lid over the grooved vapor channels to create a heat pipe in the chassis of the housing of the electronic device;
coupling one or more heat sources to the heat pipe, wherein the heat pipe is thermally coupled to the one or more heat sources to collect heat from the one or more heat sources; and
coupling a thermal cooling device to the heat pipe, wherein the thermal cooling device includes a fan and a heat dissipator and the heat dissipator includes fins that are directly coupled to the heat pipe and can dissipate heat collected from the heat pipe using air from outside the chassis.

12. The method of claim 11 , wherein the heat pipe is an oscillating heat pipe.

13. The method of claim 11 , wherein the heat pipe has a thickness between about two (2) millimeters to about twelve (12) millimeters.

14. The method of claim 11 , wherein a portion of the chassis that does not include the heat pipe has a thickness of about 0.8 millimeters and a portion of the chassis where the heat pipe is embedded has a thickness of about 1.6 millimeters to about 3.5 millimeters.

15. The method of claim 11 , wherein the heat pipe includes a second grooved vapor chamber that has second grooved vapor channels that are perpendicular to the grooved vapor channels.

16. The method of claim 15 , wherein the heat pipe includes a third grooved vapor chamber that has third grooved vapor channels that are perpendicular to the second grooved vapor channels in second grooved vapor chamber.

Assignees

• Intel Corp

Inventors

• Carbone Mark
• Paavola Juha Tapani
• Weber Nicholas R

Classifications

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H05K7/20172

  Fan mounting or fan specifications · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• G06F1/1616

  with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position · CPC title

• H05K7/20163

  the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels · CPC title