Photosensitive resin composition, photosensitive resin layer using the same, and color filter

Patent metadata

Field	Value
Publication number	US-10921709-B2
Application number	US-201816190739-A
Country	US
Kind code	B2
Filing date	Nov 14, 2018
Priority date	Feb 6, 2018
Publication date	Feb 16, 2021
Grant date	Feb 16, 2021

Abstract

A photosensitive resin composition for producing a photosensitive resin film is provided, along with the manufactured photosensitive resin film and a color filter including the photosensitive resin layer. The photosensitive resin composition includes: (A) a quantum dot; (B) a binder resin having a weight average molecular weight of about 2,000 g/mol to about 12,000 g/mol; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; and (E) a solvent.

First claim

What is claimed is:

1. A photosensitive resin composition, comprising:
(A) a quantum dot;
(B) a binder resin including a structural unit represented by Chemical Formula 1-1, a structural unit represented by Chemical Formula 1-2, a structural unit represented by Chemical Formula 1-3, and structural units represented by Chemical Formula 2 at terminal ends of the binder resin;
(C) a photopolymerizable monomer;
(D) a photopolymerization initiator; and
(E) a solvent,
wherein the binder resin has a weight average molecular weight of about 2,000 g/mol to about 12,000 g/mol:

wherein, in Chemical Formula 1-1, Chemical Formula 1-2, Chemical Formula 1-3 and Chemical Formula 2,
R 1 is a substituted or unsubstituted acrylate group;
R 2 is a substituted or unsubstituted C6 to C20 thioaryl group;
R 3 and R 4 are each a substituted or unsubstituted C6 to C20 thioaryl group;
X 1 is a substituted or unsubstituted tetravalent organic group; and
X 2 is a substituted or unsubstituted divalent organic group.

2. The photosensitive resin composition of claim 1 , wherein X 1 is represented by one of Chemical Formula X-1 to Chemical Formula X-3:

wherein, in Chemical Formula X-1,
L 1 is a single bond, an oxygen atom, a sulfur atom, *—C(═O)—* or *—CR a1 R a2 —*, and
wherein R a1 and R a2 are independently a halogen-substituted or unsubstituted C1 to C10 alkyl group.

3. The photosensitive resin composition of claim 1 , wherein X 2 is represented by one of Chemical Formula X-4 to Chemical Formula X-10:

wherein, in Chemical Formula X-4, R b and R c are each independently a hydrogen atom, a substituted or unsubstituted C1 to C20 alkyl group, an ester group, or an ether group, and
wherein, in Chemical Formula X-8, R d is O, S, NH, a substituted or unsubstituted C1 to C20 alkylene group, a C1 to C20 alkylamine group, or a C2 to C20 alkenylamine group.

4. The photosensitive resin composition of claim 1 , wherein the photosensitive resin composition further comprises a scatterer.

5. The photosensitive resin composition of claim 4 , wherein the scatterer comprises barium sulfate, calcium carbonate, titanium dioxide, zirconia, or a combination thereof.

6. The photosensitive resin composition of claim 1 , wherein the photosensitive resin composition further comprises a thiol-based additive.

7. The photosensitive resin composition of claim 6 , wherein the thiol-based additive comprises at least two functional groups represented by Chemical Formula 3 at a terminal end of the thiol-based additive:

wherein, in Chemical Formula 3,
L 7 and L 8 are each independently a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C6 to C20 arylene group, or a substituted or unsubstituted C2 to C20 heteroarylene group.

8. The photosensitive resin composition of claim 1 , wherein the quantum dot is to absorb light of about 360 nm to about 780 nm and is to emit fluorescence of about 500 nm to about 700 nm.

9. The photosensitive resin composition of claim 1 , wherein the photosensitive resin composition further comprises a polymerization inhibitor.

10. The photosensitive resin composition of claim 9 , wherein the polymerization inhibitor is included in an amount of about 0.01 wt % to about 2 wt % based on a total solid amount of the photosensitive resin composition.

11. The photosensitive resin composition of claim 9 , wherein the polymerization inhibitor comprises a hydroquinone-based compound, a catechol-based compound, or a combination thereof.

12. The photosensitive resin composition of claim 1 , wherein the photosensitive resin composition comprises:
about 1 wt % to about 20 wt % of (A) the quantum dot;
about 1 wt % to about 30 wt % of (B) the binder resin;
about 1 wt % to about 15 wt % of (C) the photopolymerizable monomer;
about 0.1 wt % to about 5 wt % of (D) the photopolymerization initiator; and
a balance amount of (E) the solvent based on a total amount of the photosensitive resin composition.

13. The photosensitive resin composition of claim 1 , wherein the photosensitive resin composition further comprises malonic acid; 3-amino-1,2-propanediol; a silane-based coupling agent; a leveling agent; a fluorine-based surfactant; or a combination thereof.

14. A photosensitive resin film manufactured using the photosensitive resin composition of claim 1 .

15. A color filter comprising the photosensitive resin film of claim 14 .

16. A display device comprising the color filter of claim 15 .

Assignees

• Samsung Sdi Co Ltd

Inventors

• Paek Hojeong
• Kim Jonggi
• Park Minjee
• Shin Woo Jung
• Youn Jinsuop
• LEE Bumjin
• Yim Jihyeon
• Jang Young Woong

Classifications

• G03F7/0388

  with ethylenic or acetylenic bands in the side chains of the photopolymer · CPC title

• G03F7/0047

  characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing · CPC title

• G03F7/0007 Primary

  Filters, e.g. additive colour filters; Components for display devices · CPC title

• G03F7/032 Primary

  with binders · CPC title

• G03F7/0275

  with dithiol or polysulfide compounds · CPC title