Vapor deposition mask, vapor deposition mask production method, and organic semiconductor element production method
US-2019100834-A1 · Apr 4, 2019 · US
US10920311B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10920311-B2 |
| Application number | US-201816081828-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 31, 2018 |
| Priority date | Mar 29, 2016 |
| Publication date | Feb 16, 2021 |
| Grant date | Feb 16, 2021 |
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A deposition mask includes: a mask sheet formed by stacking a metal layer provided with a plurality of through holes on a film layer provided with a plurality of opening patterns, each through hole enclosing at least one of the opening patterns, and by dividing one surface of the mask sheet into a plurality of unit cells each including two or more of the opening patterns and two or more of the through holes; and a support member which is made of metal and has openings corresponding to the unit cells of the mask sheet, the support member supporting the mask sheet by being joined to the metal layer of the mask sheet to which no external tension is applied. This ensures high shape and positional deposition accuracy in forming thin film patterns using the deposition mask.
Opening claim text (preview).
What is claimed is: 1. A deposition mask comprising: a mask sheet formed by stacking a metal layer provided with a plurality of through holes on a film layer provided with a plurality of opening patterns, each through hole enclosing at least one of the opening patterns, and by dividing one surface of the mask sheet into a plurality of unit cells each including two or more of the opening patterns and two or more of the plurality of through holes; and a sheet-shaped support member which is made of metal and has a plurality of openings corresponding to the unit cells of the mask sheet, the support member supporting the mask sheet by being joined to the metal layer of the mask sheet to which no external tension is applied, wherein: the metal layer is formed by plating on the film layer held in close contact by a substrate under such a condition as to generate internal tensile stress to the substrate, and the support member is joined to the metal layer, and the internal tensile stress remains in the metal layer. 2. The deposition mask according to claim 1 , wherein the metal layer of the mask sheet and the support member are joined together by laser spot welding at least at a peripheral portion of each of the plurality of openings. 3. The deposition mask according to claim 2 , wherein the metal layer is provided with a perforation for separating adjacent ones of the unit cells from each other along peripheries of the unit cells. 4. The deposition mask according to claim 2 , wherein a frame is joined to the support member. 5. The deposition mask according to claim 3 , wherein a frame is joined to the support member. 6. The deposition mask according to claim 1 , wherein the metal layer is provided with a perforation for separating adjacent ones of the unit cells from each other along peripheries of the unit cells. 7. The deposition mask according to claim 6 , wherein a frame is joined to the support member. 8. The deposition mask according to claim 1 , wherein a frame is joined to the support member. 9. A method for manufacturing the deposition mask according to claim 1 , comprising the steps of: forming a mask sheet by sequentially stacking, on a transparent substrate, a film layer and a metal layer provided with a plurality of through holes, and by dividing one surface of the mask sheet into a plurality of unit cells each including two or more of the plurality of through holes, the metal layer being formed by plating on the film layer held in close contact by a substrate under such a condition as to generate internal tensile stress to the substrate; joining a sheet-shaped support member to the metal layer of the mask sheet to which no external tension is applied, the support member being made of metal and having a plurality of openings corresponding to the unit cells; forming at least one opening pattern in a portion of the film layer corresponding to each of the plurality of through holes by irradiating with a laser beam; and stripping the transparent substrate from the mask sheet. 10. The method for manufacturing the deposition mask according to claim 9 , wherein the steps of forming the mask sheet, joining the support member to the metal layer of the mask sheet, forming opening pattern in the film layer, and stripping the transparent substrate from the mask sheet are performed in this order. 11. The method for manufacturing the deposition mask according to claim 9 , wherein the steps of forming the opening pattern in the film layer, forming the mask sheet, joining the support member to the metal layer of the mask sheet, and stripping the transparent substrate from the mask sheet are performed in this order. 12. The method for manufacturing the deposition mask according to claim 9 , wherein the steps of forming the mask sheet, joining the support member to the metal layer of the mask sheet, stripping the transparent substrate from the mask sheet, and forming the opening pattern in the film layer are performed in this order. 13. The method for manufacturing the deposition mask according to claim 9 , wherein the step of joining the support member to the metal layer of the mask sheet is performed by laser spot welding at least at a peripheral portion of each of the plurality of openings by irradiating the metal layer with a laser beam through the transparent substrate. 14. The method for manufacturing the deposition mask according to claim 9 , wherein, before the step of stripping the transparent substrate, a frame is joined to a peripheral portion of the support member. 15. A method for repairing the deposition mask according to claim 1 which includes a mask sheet formed by stacking a metal layer provided with a plurality of through holes on a film layer provided with a plurality of opening patterns, each through hole enclosing at least one of the opening patterns, and by dividing one surface of the mask sheet into a plurality of unit cells each including two or more of the opening patterns and two or more of the plurality of through holes; and a sheet-shaped support member which is made of metal and has a plurality of openings corresponding to the unit cells of the mask sheet, the support member supporting the mask sheet by being joined to the metal layer of the mask sheet to which no external tension is applied, wherein the metal layer is provided with a perforation for separating adjacent ones of the unit cells from each other along peripheries of the unit cells, the method comprising the steps of: removing a defective unit cell by cutting out a corresponding portion of the metal layer and the film layer along the perforation on a periphery of the defective unit cell; fitting a unit mask member having a same shape as each of the unit cells into a space from which the defective unit cell has been removed, the unit mask member being formed by sequentially stacking a film layer and a metal layer having a plurality of through holes; and forming an opening pattern within each of the plurality of through holes by irradiating the unit mask member with a laser beam from a surface of the metal layer.
using masks · CPC title
Spot welding · CPC title
by boring or cutting · CPC title
Vacuum evaporation · CPC title
Masking elements, i.e. elements defining uncoated areas on an object to be coated · CPC title
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