Method of preparing crosslinked pressure-sensitive adhesives using a light-emitting diode for crosslinking

US10920116B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10920116-B2
Application numberUS-201615555592-A
CountryUS
Kind codeB2
Filing dateMar 22, 2016
Priority dateApr 13, 2015
Publication dateFeb 16, 2021
Grant dateFeb 16, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method of preparing a crosslinked pressure-sensitive adhesive is provided, including exposing at least one radiation crosslinkable pressure-sensitive adhesive composition to radiation from at least one light-emitting diode to crosslink the radiation crosslinkable pressure-sensitive adhesive composition. The crosslinked pressure-sensitive adhesive is optionally a hot melt processable pressure-sensitive adhesive. A radiation crosslinked pressure-sensitive adhesive is provided, prepared by the method. Also, an adhesive article is provided including a flexible backing layer and the radiation crosslinked pressure-sensitive adhesive prepared by the method. The crosslinked pressure-sensitive adhesive tends to exhibit high shear without sacrificing peel force or tack.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of preparing a crosslinked pressure-sensitive adhesive comprising selecting one or more radiation wavelengths provided by at least one light-emitting diode, for crosslinking of the pressure-sensitive adhesive, which do not substantially overlap with wavelengths at which a particular tackifier has absorption; and exposing at least one radiation crosslinkable pressure-sensitive adhesive composition to radiation from at least one light-emitting diode to crosslink the radiation crosslinkable pressure-sensitive adhesive composition and thereby form the crosslinked pressure-sensitive adhesive, wherein the crosslinked pressure-sensitive adhesive comprises a hot melt processable pressure-sensitive adhesive; wherein the pressure-sensitive adhesive composition comprises a co-polymerized type (II) photocrosslinker; wherein the co-polymerized type (II) photocrosslinker is a photocrosslinker, which upon irradiation, becomes excited to a higher energy state in which it can abstract a hydrogen atom from a hydrogen-donating molecule, thereby generating on the hydrogen-donating molecule a free radical capable of further reaction; wherein the at least one crosslinkable pressure-sensitive adhesive composition comprises: a) a polymerized reaction product of components comprising: i) at least one alkyl (meth)acrylate monomer; ii) optionally at least one acid-functional ethylenically unsaturated monomer; iii) optionally at least one non-acid-functional ethylenically unsaturated monomer; iv) at least one initiator; and v) optionally at least one radiation-sensitive crosslinker; b) optionally at least one non-photocrosslinkable (co)polymer; c) optionally at least one radiation-sensitive crosslinker; d) optionally at least one adjuvant; and e) at least one tackifier; wherein the pressure-sensitive adhesive composition comprises at least one radiation-sensitive crosslinker; wherein the at least one tackifier is present in an amount greater than 10 parts per weight per 100 parts by weight of total monomer, or in an amount from 40 parts to 70 parts by weight per 100 parts by weight of total monomer. 2. The method of claim 1 , wherein the at least one light-emitting diode provides radiation having a wavelength in the range of 200 to 600 nm. 3. The method of claim 1 , wherein the at least one light-emitting diode provides radiation having a wavelength in the range of 300 to 400 nm. 4. The method of claim 1 , wherein the at least one light-emitting diode provides radiation having a wavelength range of no more than 10 nm. 5. The method of claim 1 , wherein the at least one radiation-sensitive crosslinker comprises a co-polymerized type (II) photocrosslinker. 6. The method of claim 1 , wherein the at least one radiation-sensitive crosslinker is present in an amount of at least 0.05 parts by weight per 100 parts by weight of total monomer. 7. The method of claim 1 , wherein the at least one optional non-acid-functional ethylenically unsaturated monomer is present and comprises a hydrogen-donating monomer. 8. The method of claim 1 , wherein the at least one adjuvant is present and comprises a radiation-crosslinkable additive, a thickener, a particulate filler, an antioxidant, a colorant, a scent, or combinations thereof. 9. The method of claim 8 , wherein the radiation-crosslinkable additive comprises at least one bis(benzophenone). 10. The method of claim 1 , wherein c) is present and comprises a crosslinking polymer. 11. The radiation crosslinked pressure-sensitive adhesive of the method of claim 1 . 12. An adhesive article comprising the radiation crosslinked pressure-sensitive adhesive of claim 1 and a flexible backing layer.

Assignees

Inventors

Classifications

  • for the production of liquid crystal displays · CPC title

  • the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C · CPC title

  • C09J4/06Primary

    {Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond} in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00 · CPC title

  • use of irradiation · CPC title

  • C09J7/385Primary

    Acrylic polymers · CPC title

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What does patent US10920116B2 cover?
A method of preparing a crosslinked pressure-sensitive adhesive is provided, including exposing at least one radiation crosslinkable pressure-sensitive adhesive composition to radiation from at least one light-emitting diode to crosslink the radiation crosslinkable pressure-sensitive adhesive composition. The crosslinked pressure-sensitive adhesive is optionally a hot melt processable pressure-…
Who is the assignee on this patent?
3M Innovative Properties Co
What technology area does this patent fall under?
Primary CPC classification C09J4/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 16 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).