Prepreg and fiber-reinforced composite material

Patent metadata

Field	Value
Publication number	US-10920031-B2
Application number	US-201916572164-A
Country	US
Kind code	B2
Filing date	Sep 16, 2019
Priority date	Mar 24, 2017
Publication date	Feb 16, 2021
Grant date	Feb 16, 2021

Abstract

A prepreg including: a component (A); a component (B); and a component (C), in which the component (A) is a reinforced fiber substrate, the component (B) is an epoxy resin composition, the component (C) is a component (c1) or a component (c2), the component (c1) includes polyamide particles and thermosetting polyimide particles, and the component (c2) includes spherical polyamide particles having a melting point of 140° C. to 175° C.

First claim

What is claimed is:

1. A prepreg comprising:
(A) a reinforced fiber substrate;
(B) an epoxy resin composition comprising an epoxy resin component and a curing agent component; and
(C) a component (c1) comprising spherical polyamide particles having an average particle diameter of 2 to 50 μm and thermosetting polyimide particles having an average particle diameter of 2 to 50 μm, provided that the average particle diameter of the thermosetting polyimide particles is 0.5 to 10 times the average particle diameter of the spherical polyamide particles,
wherein the epoxy resin composition comprises 5 to 70 mass % of an epoxy resin having an oxazolidone ring structure or 60 to 100 mass % of an epoxy resin having a naphthalene structure, with respect to 100 mass % of the entire epoxy resin in (B),
wherein the curing agent component is an aromatic polyamine when the epoxy resin composition comprises 60 to 100 mass % of an epoxy resin having a naphthalene structure, with respect to 100 mass % of the entire epoxy resin in (B), and
wherein (B) and (C), together, account for 25 to 50 mass % of the prepreg.

2. The prepreg according to claim 1 , wherein a mass ratio represented by [spherical polyamide particles]:[thermosetting polyimide particles] is 60:40 to 90:10.

3. The prepreg according to claim 1 , wherein a melting point of the spherical polyamide particles in the component (c1) is 140° C. to 175° C.

4. The prepreg according to claim 1 , wherein the spherical polyamide particles in the component (c1) is crystalline nylon copolymer particles.

5. The prepreg according to claim 1 , wherein the spherical polyamide particles in the component (c1) is spherical particles comprising a copolymer of nylon 12 and nylon 6.

6. The prepreg according to claim 1 , wherein the thermosetting polyimide particles has a chemical structure of General Formula (1) or General Formula (2):

7. The prepreg according to claim 1 , wherein 70 mass % or more of the component (C) is present in a surface of the component (A).

8. The prepreg according to claim 1 , wherein the component (A) comprises a reinforcing fiber, and the reinforcing fiber is a carbon fiber.

9. The prepreg according to claim 1 , wherein the epoxy resin comprises 60 to 100 mass % of an epoxy resin having a naphthalene structure, with respect to 100 mass % of the entire epoxy resin in (B), and the curing agent component is an aromatic polyamine.

10. The prepreg according to claim 1 , wherein a content of the component (C) is 5 to 25 parts by mass with respect to 100 parts by mass of the component (B).

11. A fiber-reinforced composite material obtained by laminating two or more prepregs according to claim 1 and heating the laminated prepregs to a temperature equal to or higher than, a curing temperature of the component (B).

12. A fiber-reinforced composite material comprising:
(A) a reinforced fiber substrate;
(B′) a cured material of an epoxy resin composition comprising an epoxy resin component and a curing agent component; and
(C) a component (c1) comprising spherical polyamide particles having an average particle diameter of 2 to 50 μm and thermosetting polyimide particles having an average particle diameter of 2 to 50 μm, provided that the average particle diameter of the thermosetting polyimide particles is 0.5 to 10 times the average particle diameter of the spherical polyamide particles,
wherein the epoxy resin composition comprises 5 to 70 mass % of an epoxy resin having an oxazolidone ring structure or 60 to 100 mass % of an epoxy resin having a naphthalene structure, with respect to 100 mass % of the entire epoxy resin in (B),
wherein the curing agent component is an aromatic polyamine when the epoxy resin composition comprises 60 to 100 mass % of an epoxy resin having a naphthalene structure, with respect to 100 mass % of the entire epoxy resin in (B),
wherein (B) and (C) together, account for 25 to 50 mass % of the prepreg,
a plurality of the component (A) are laminated, and
the component (C) is present between layers of the components (A).

Assignees

• Mitsubishi Chem Corp

Inventors

• Harada Yukihiro
• Nohara Atsushi

Classifications

• B32B27/38 Primary

  comprising epoxy resins · CPC title

• C08J5/249

  characterised by the additives used in the prepolymer mixture · CPC title

• C08J5/243

  using carbon fibres · CPC title

• C08J2379/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

• C08J2377/02

  Polyamides derived from omega-amino carboxylic acids or from lactams thereof (C08J2377/10 takes precedence) · CPC title