Node with co-printed interconnect and methods for producing same

US10919230B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10919230-B2
Application numberUS-201715619379-A
CountryUS
Kind codeB2
Filing dateJun 9, 2017
Priority dateJun 9, 2017
Publication dateFeb 16, 2021
Grant dateFeb 16, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Some embodiments of the present disclosure relate to an apparatus including an additively manufactured node. The apparatus includes an additively manufactured interconnect co-printed with the node. The interconnect is configured to connect the node to a component.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus, comprising: an additively manufactured node; and an additively manufactured interconnect co-printed with the node, wherein the interconnect is configured to connect the node to a component; wherein the node comprises a channel extending from an exterior surface of the node to a socket for adhesion injection, and a second channel extending from the exterior surface of the node to the socket for enabling at least a partial vacuum environment during adhesion injection. 2. The apparatus of claim 1 , wherein the interconnect is further configured to connect the node to the component comprising a tube. 3. The apparatus of claim 2 , wherein the node comprises a socket and the interconnect comprises a proximal end that together with the socket forms a joint therebetween that provides a range of linear motion between the interconnect and the node. 4. The apparatus of claim 2 , wherein the node comprises a socket and the interconnect comprises a proximal end that together with the socket forms a rotating joint therebetween. 5. The apparatus of claim 4 , wherein the proximal end of the interconnect has a spherical shape. 6. The apparatus of claim 4 , wherein the proximal end of the interconnect has an ellipsoidal shape. 7. The apparatus of claim 2 , wherein the proximal end of the interconnect has a dovetail shape. 8. The apparatus of claim 2 , wherein the interconnect comprises a distal end configured to slide into an end portion of the tube. 9. The apparatus of claim 2 , wherein the interconnect comprises a distal end having an end cap configured to slide over an end portion of the tube. 10. The apparatus of claim 2 , wherein the node comprises a substantially cylindrical socket and the interconnect comprises a shaft connected to an interior surface of the socket opposite a socket opening and a head at a distal end of the shaft, the head being extendable beyond the opening in the socket. 11. The apparatus of claim 10 , wherein the socket comprises a section having an outwardly bulge around a portion of the shaft. 12. The apparatus of claim 11 , further comprising the tube having an end portion positioned over the interconnect. 13. The apparatus of claim 12 , wherein the end portion of the tube comprises a section having an outwardly bulge around said section of the shaft. 14. The apparatus of claim 13 , further comprising hydroforming material in the end portion of the tube between said interior surface of the socket and the head of the interconnect. 15. A method of joining an additively manufactured node to a component, the method comprising: printing a node; and co-printing, with the node, an interconnect, wherein the node and interconnect are co-printed by an additive manufacturing process; receiving a component; and using the interconnect to connect the node to the component. 16. The method of claim 15 , wherein the component comprises a tube, and wherein using the interconnect to connect the node comprises using the interconnect to connect the node to the tube. 17. The method of claim 16 , wherein the interconnect comprises a proximal end, the method further comprising: forming a socket within the node; and forming a joint between the proximal end of the interconnect and the socket that provides a range of linear motion between the interconnect and the node. 18. The method of claim 16 , wherein the interconnect comprises a proximal end, the method further comprising: forming a socket within the node; and forming a rotating joint between the proximal end of the interconnect and the socket. 19. The method of claim 18 , further comprising forming a spherical end at the proximal end of the interconnect. 20. The method of claim 18 , further comprising forming an ellipsoidal end at the proximal end of the interconnect. 21. The method of claim 17 , further comprising forming a dovetail end at the proximal end of the interconnect. 22. The method of claim 16 , where in the interconnect comprises a distal end and the tube comprises an end portion, the method further comprising sliding the distal end of the interconnect into the end portion of the tube. 23. The method of claim 16 , wherein the interconnect comprises a distal end and the tube comprises an end portion, the method further comprising: forming an end cap at the distal end of the interconnect; and sliding the end cap over the end portion of the tube. 24. The method of claim 15 , further comprising forming a first channel extending from an interior surface of the node to a socket for adhesion injection. 25. The method of claim 24 , further comprising: forming a second channel extending from an exterior surface of the node to the socket; enabling, from the second channel, at least a partial vacuum environment during adhesion injection. 26. The method of claim 24 , further comprising: forming an adhesive port connected to the channel at an exterior surface of the node; and attaching a detachable adhesive mixer to the adhesive port. 27. The method of claim 16 , wherein printing the node comprises forming a substantially cylindrical socket, and wherein co-printing the interconnect comprises forming a shaft, wherein the shaft is connected to an interior surface of the socket opposite a socket opening and a head at a distal end of the shaft, the head being extendable beyond the opening in the socket. 28. The method of claim 27 , wherein forming the socket comprises forming a portion of the socket to have an outwardly bulge around a portion of the shaft. 29. The method of claim 28 , further comprising positioning an end portion of the tube over the interconnect. 30. The method of claim 29 , further comprising deforming a section of the end portion of the tube to have an outwardly bulge around said section of the shaft. 31. The method of claim 30 , further comprising applying hydroforming material to the end portion of the tube between said interior surface of the socket and the head of the interconnect. 32. An apparatus, comprising: an additively manufactured node; an additively manufactured interconnect co-printed with the node, wherein the interconnect is configured to connect the node to a component; wherein the node comprises a channel extending from an exterior surface of the node to a socket for adhesion injection, and further comprising an adhesive port connected to the channel at the exterior surface of the node and a detachable adhesive mixer connected to the adhesive port.

Assignees

Inventors

Classifications

  • Process efficiency · CPC title

  • Products made by additive manufacturing · CPC title

  • B29C64/106Primary

    using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material · CPC title

  • Manufacture of ball-joints and parts thereof, e.g. assembly of ball-joints · CPC title

  • by built-up welding · CPC title

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Frequently asked questions

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What does patent US10919230B2 cover?
Some embodiments of the present disclosure relate to an apparatus including an additively manufactured node. The apparatus includes an additively manufactured interconnect co-printed with the node. The interconnect is configured to connect the node to a component.
Who is the assignee on this patent?
Divergent Tech Inc
What technology area does this patent fall under?
Primary CPC classification B29C64/106. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 16 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).