Method of manufacturing band-shaped metal wire member including bonded portion

US10919079B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10919079-B2
Application numberUS-201615773333-A
CountryUS
Kind codeB2
Filing dateNov 4, 2016
Priority dateNov 12, 2015
Publication dateFeb 16, 2021
Grant dateFeb 16, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention seeks to enable a band-shaped metal wire member to be stably accommodated within a die. A die is prepared that includes a bottom die provided with a depression and a top die provided with a projection that can be arranged within the depression so as to close off a space above the depression. An inner surface of the depression includes a central die surface formed at a width-direction center of a base of the depression and a pair of curved guide die surfaces provided continuous with two sides of the central die surface and curved so as to project outward. The central die surface is formed as a flat surface or as a surface that curves more gently than the pair of curved guide die surfaces. A bonding process portion of a band-shaped metal wire member is folded in two and arranged within the depression.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of manufacturing a band-shaped metal wire member that includes a bonded portion, the method comprising: (a) preparing a die that includes a first die provided with a depression and a second die provided with a projection that can be arranged within the depression so as to close off a space above the depression, an inner surface of the depression including a central die surface formed at a width-direction center of a base of the depression and a pair of curved guide die surfaces provided continuous with two sides of the central die surface and curved so as to project outward, the central die surface being formed as a flat surface or as a surface with a radius of curvature that is larger than that of the pair of curved guide die surfaces; (b) folding in two a bonding process portion that is on at least a portion of an extension direction of the band-shaped metal wire member; (c) arranging the bonding process portion of the band-shaped metal wire member within the depression such that two side edge portions of the bonding process portion are oriented toward the interior of the depression; (d) inserting the projection into the depression and pressing the bonding process portion within the depression; and (e) bonding metal wires in the bonding process portion together between the projection and the depression. 2. The method of manufacturing the band-shaped metal wire member that includes the bonded portion according to claim 1 , wherein the central die surface is set to a width dimension no more than two times a thickness dimension of the band-shaped metal wire member. 3. The method of manufacturing the band-shaped metal wire member that includes the bonded portion according to claim 1 , wherein the central die surface is a flat surface. 4. A method of manufacturing a terminal-equipped band-shaped metal wire member comprising: (A) manufacturing a band-shaped metal wire member that includes a bonded portion with the method of manufacturing a band-shaped metal wire member that includes a bonded portion according to claim 1 ; and (B) crimping a terminal to the bonded portion in a condition in which a positioning member is inserted into a gap between two side portions of the band-shaped metal wire member, at a location on the band-shaped metal wire member adjacent to the bonded portion. 5. A die that bonds a plurality of metal wires together in at least a portion of an extension direction of a band-shaped metal wire member, the die comprising: a first die provided with a depression; and a second die provided with a projection that can be arranged within the depression so as to close off a space above the depression, the projection including an inner side that includes a pair of curved surfaces at opposing ends of the inner side and that includes a straight surface connecting the pair of curved surfaces, wherein an inner surface of the depression includes a central die surface formed at a width-direction center of a base of the depression and a pair of curved guide die surfaces provided continuous with two sides of the central die surface and curved so as to project outward, and the central die surface is formed as a flat surface or as a surface with a radius of curvature that is larger than that of the pair of curved guide die surfaces. 6. A band-shaped metal wire member comprising: a bonded portion, wherein the bonded portion is formed by bonding a plurality of metal wires together in at least a portion of an extension direction of the band-shaped metal wire member, the band-shaped metal wire member being assembled such that the plurality of metal wires form an elongated band shape, the bonded portion is formed by bonding the plurality of metal wires together in a condition in which two side portions of the band-shaped metal wire member are deformed such that two side edge portions of the band-shaped metal wire member face each other and the two side portions meet on one principal surface side at a width-direction center portion of the band-shaped metal wire member, and an outer circumferential surface of the bonded portion includes a central surface formed at the portion where the two side edge portions of the band-shaped metal wire member face each other, and a pair of curved surfaces that are provided continuous with two sides of the central surface and are curved so as to project outward, the central surface being formed as a flat surface or as a surface with a radius of curvature that is larger than that of the pair of curved surfaces.

Assignees

Inventors

Classifications

  • H01R43/048Primary

    Crimping apparatus or processes (H01R43/042 takes precedence) · CPC title

  • making use of soldering or welding · CPC title

  • by crimping {(H01R4/01, H01R4/2495 take precedence; for coaxial cables H01R9/0518)} · CPC title

  • Ultrasonic-, H.F.-, cold- or impact welding · CPC title

  • without additional connecting elements or material, e.g. by twisting · CPC title

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Frequently asked questions

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What does patent US10919079B2 cover?
The present invention seeks to enable a band-shaped metal wire member to be stably accommodated within a die. A die is prepared that includes a bottom die provided with a depression and a top die provided with a projection that can be arranged within the depression so as to close off a space above the depression. An inner surface of the depression includes a central die surface formed at a widt…
Who is the assignee on this patent?
Sumitomo Wiring Systems
What technology area does this patent fall under?
Primary CPC classification H01R43/048. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 16 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).