Sealed package and method of forming same

Patent metadata

Field	Value
Publication number	US-10918874-B2
Application number	US-201816021177-A
Country	US
Kind code	B2
Filing date	Jun 28, 2018
Priority date	Jun 28, 2018
Publication date	Feb 16, 2021
Grant date	Feb 16, 2021

Abstract

Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.

First claim

What is claimed is:

1. A hermetically-sealed package, comprising:
a housing that extends along a housing axis between a first end and a second end, wherein the housing comprises first and second opaque portions and a transparent portion disposed between the first and second opaque portions, wherein the first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion, wherein at least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring;
a power source disposed within the housing; and
an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.

2. The package of claim 1 , wherein the first opaque portion is hermetically sealed to the first end of the transparent portion by a first weld ring and the second opaque portion is hermetically sealed to the second end of the transparent portion by a second weld ring.

3. The package of claim 2 , wherein at least one of the first and second weld rings is diffusion bonded to the transparent portion of the housing.

4. The package of claim 3 , wherein at least one of the first and second weld rings is laser diffusion bonded to the transparent portion of the housing.

5. The package of claim 2 , wherein at least one of the first and second weld rings is compression bonded to the transparent portion of the housing.

6. The package of claim 1 , wherein the transparent portion of the housing is substantially transmissive to electromagnetic radiation having a frequency in a range of 10 kHz to 20 MHz.

7. The package of claim 1 , wherein the inductive coil is disposed on an inner surface of the transparent portion of the housing.

8. The package of claim 1 , wherein the first opaque portion of the housing comprises an external contact adapted to provide an electrical signal to tissue of a patient.

9. The package of claim 1 , wherein the housing comprises an elliptical cross-section in a plane orthogonal to the housing axis.

10. The package of claim 1 , further comprising an external contact hermetically sealed to the second opaque portion of the housing.

11. The package of claim 1 , further comprising a tine connected to the first opaque portion of the housing adjacent to the first end of the housing.

12. The package of claim 1 , wherein the transparent portion of the housing comprises a ceramic material.

13. The package of claim 1 , wherein at least one of the first and second opaque portions of the housing comprises a ceramic material.

14. A method of forming a hermetically-sealed package comprising a housing that extends along a housing axis between a first end and a second end, the method comprising:
compression bonding a weld ring to an outer surface of a transparent portion of the housing at a first end of the transparent portion, wherein compression bonding the weld ring comprises:
heating the weld ring;
disposing the weld ring over the outer surface of the transparent portion of the housing; and
cooling the weld ring;

hermetically sealing a first opaque portion to the first end of the transparent portion utilizing the weld ring; and
hermetically sealing a second opaque portion to a second end of the transparent portion such that the transparent portion is disposed between the first and second opaque portions.

15. The method of claim 14 , wherein bonding the weld ring to the transparent portion of the housing further comprises disposing a metal layer on the outer surface of the transparent portion of the housing prior to disposing the weld ring over the outer surface of the transparent portion of the housing such that the metal layer is disposed between the weld ring and the outer surface of the transparent portion of the housing.

16. The method of claim 14 , further comprising compression bonding a second weld ring to the outer surface of the transparent portion of the housing at the second end of the transparent portion, wherein compression bonding the second weld ring comprises:
heating the second weld ring;
disposing the second weld ring over the outer surface of the transparent portion of the housing; and
cooling the second weld ring.

17. The method of claim 16 , wherein bonding the second weld ring to the transparent portion of the housing further comprises disposing a metal layer on the outer surface of the transparent portion of the housing prior to disposing the second weld ring over the outer surface of the transparent portion of the housing such that the metal layer is disposed between the second weld ring and the outer surface of the transparent portion of the housing.

18. The method of claim 14 , wherein hermetically sealing the second opaque portion to the second end of the transparent portion comprises welding the second opaque portion to the second weld ring.

19. The method of claim 14 , wherein hermetically sealing the first opaque portion to the first end of the transparent portion comprises welding the first opaque portion to the weld ring.

20. The method of claim 14 , further comprising disposing an inductive coil on an inner surface of the transparent portion of the housing.

Assignees

• Medtronic Inc

Inventors

• Thom Andrew J
• Iyer Rajesh V
• Munns Gordon O
• Nielsen Christian S
• Ries Andrew J

Classifications

• H02J7/42

  with electronic devices having internal batteries, e.g. mobile phones · CPC title

• H02J2105/46

  Medical devices, medical implants or life supporting devices · CPC title

• A61N1/3758 Primary

  Packaging of the components within the casing · CPC title

• A61N1/37223 Primary

  Circuits for electromagnetic coupling · CPC title

• H02J50/005

  Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices · CPC title