Modified metal nanoplate and conductive paste comprising the same

Patent metadata

Field	Value
Publication number	US-10913865-B2
Application number	US-201816232925-A
Country	US
Kind code	B2
Filing date	Dec 26, 2018
Priority date	Dec 6, 2018
Publication date	Feb 9, 2021
Grant date	Feb 9, 2021

Abstract

A modified metal nanoplate and a conductive paste including the same are provided. The modified metal nanoplate includes a metal nanoplate, a first protecting agent, and a second protecting agent. The metal nanoplate has an average width of 0.3-20 μm and an average thickness of 10-35 nm. The first protecting agent is disposed on a surface of the metal nanoplate and includes an oxygen-containing polymer. The second protecting agent is disposed on the surface of the metal nanoplate and includes a C6-C12 alkylamine.

First claim

What is claimed is:

1. A modified metal nanoplate, comprising:
a metal nanoplate having an average width of 0.3-20 μm and an average thickness of 10-35 nm;
a first protecting agent disposed on a surface of the metal nanoplate, wherein the first protecting agent comprises an oxygen-containing polymer; and
a second protecting agent disposed on the surface of the metal nanoplate, wherein the second protecting agent comprises a C6-C12 alkylamine,
wherein the C6-C12 alkylamine comprises n-hexylamine, n-octylamine, isooctylamine, n-decylamine, n-dodecylamine, or any combination thereof.

2. The modified metal nanoplate according to claim 1 , wherein the modified metal nanoplate comprises 0.1-5.0 parts by weight of the first protecting agent relative to 100 parts by weight of the metal nanoplate.

3. The modified metal nanoplate according to claim 1 , wherein the modified metal nanoplate comprises 0.01-5.0 parts by weight of the second protecting agent relative to 100 parts by weight of the metal nanoplate.

4. The modified metal nanoplate according to claim 1 , wherein a weight of the second protecting agent is 1-100 wt % of a weight of the first protecting agent.

5. The modified metal nanoplate according to claim 1 , wherein the oxygen-containing polymer comprises polyvinyl pyrrolidone (PVP), polyvinyl alcohol (PVA), polyethylene glycol (PEG), or any combination thereof.

6. The modified metal nanoplate according to claim 1 , wherein the metal nanoplate comprises silver, silver alloy, copper, copper alloy, or any combination thereof.

7. The modified metal nanoplate according to claim 1 , wherein the average width of the metal nanoplate is 1-10 μm.

8. The modified metal nanoplate according to claim 1 , wherein an average length of the metal nanoplate is 0.3-20 μm, wherein an extending direction of the average length is perpendicular to an extending direction of the average thickness, and the extending direction of the average length is perpendicular to an extending direction of the average width.

9. The modified metal nanoplate according to claim 1 , wherein the average thickness of the metal nanoplate is 15-30 nm.

10. A conductive paste, comprising:
a plurality of modified metal nanoplates as claimed in claim 1 ; and
a solvent, wherein the modified metal nanoplates are dispersed in the solvent.

11. The conductive paste according to claim 10 , wherein the solvent comprises isopropanol, diethylene glycol monoethyl ether, diethylene glycol butyl ether, diethylene glycol monoethyl ether acetate, or any combination thereof.

12. The conductive paste according to claim 10 , wherein a solid content of the conductive paste is 5-80 wt %.

13. The conductive paste according to claim 10 , wherein the modified metal nanoplate comprises 0.1-5.0 parts by weight of the first protecting agent relative to 100 parts by weight of the metal nanoplate.

14. The conductive paste according to claim 10 , wherein the modified metal nanoplate comprises 0.01-5.0 parts by weight of the second protecting agent relative to 100 parts by weight of the metal nanoplate.

15. The conductive paste according to claim 10 , wherein a weight of the second protecting agent is 1-100 wt % of a weight of the first protecting agent.

16. The conductive paste according to claim 10 , wherein the oxygen-containing polymer comprises polyvinyl pyrrolidone (PVP), polyvinyl alcohol (PVA), polyethylene glycol (PEG), or any combination thereof.

17. The conductive paste according to claim 10 , wherein the metal nanoplate comprises silver, silver alloy, copper, copper alloy, or any combination thereof.

18. The conductive paste according to claim 10 , wherein an average length of the metal nanoplate is 0.3-20 μm, wherein an extending direction of the average length is perpendicular to an extending direction of the average thickness, and the extending direction of the average length is perpendicular to an extending direction of the average width.

Assignees

• Ind Tech Res Inst

Inventors

• Kuo Shin-Liang
• Chang Hung Ming
• Huang Shu-Jiuan
• Hang Jian-Yi

Classifications

• B22F1/102

  Metallic powder coated with organic material · CPC title

• B22F1/056

  Submicron particles having a size above 100 nm up to 300 nm · CPC title

• B22F1/10

  Metallic powder containing lubricating or binding agents; Metallic powder containing organic material · CPC title

• B22F1/0551

  Flake form nanoparticles · CPC title

• B22F1/054

  Nanosized particles · CPC title