Device having a reinforcement layer and method for producing a device

Patent metadata

Field	Value
Publication number	US-10910789-B2
Application number	US-201816471731-A
Country	US
Kind code	B2
Filing date	Mar 12, 2018
Priority date	Mar 13, 2017
Publication date	Feb 2, 2021
Grant date	Feb 2, 2021

Abstract

A device having a reinforcement layer and a method for producing a device are disclosed. In an embodiment a device includes a carrier plate, an electronic component, a shaped body and a reinforcement layer, wherein the electronic component is laterally enclosed by the shaped body, wherein, in a vertical direction, the electronic component is arranged between the carrier plate and the reinforcement layer, wherein the shaped body has a thermal expansion coefficient which is at least three times as large as a thermal expansion coefficient of the carrier plate and at least three times as large as a thermal expansion coefficient of the reinforcement layer, and wherein the carrier plate and the reinforcement layer adjoin the shaped body at least in places and are configured to reduce deformation of the shaped body in an event of temperature fluctuations.

First claim

The invention claimed is:

1. A device comprising:
a carrier plate;
an electronic component;
a shaped body; and
a reinforcement layer,
wherein the electronic component is laterally enclosed by the shaped body,
wherein, in a vertical direction, the electronic component is arranged between the carrier plate and the reinforcement layer,
wherein the shaped body has a thermal expansion coefficient which is at least three times as large as a thermal expansion coefficient of the carrier plate and at least three times as large as a thermal expansion coefficient of the reinforcement layer, and
wherein the carrier plate and the reinforcement layer adjoin the shaped body at least in places and are configured to reduce deformation of the shaped body in an event of temperature fluctuations.

2. The device according to claim 1 , wherein the electronic component is an optoelectronic component, wherein the shaped body has a side surface serving as a light passage surface of the device, and wherein the carrier plate and the reinforcement layer are configured to reduce deformation of the side surface in the event of temperature fluctuations.

3. The device according to claim 1 , wherein the electronic component is a laser diode, and wherein the shaped body has a side surface forming a light-emitting surface of the device.

4. The device according to claim 1 , wherein the carrier plate, the shaped body and the reinforcement layer are formed with respect to their materials in such a way that the coefficient of thermal expansion of the shaped body is at least ten times greater than the coefficient of thermal expansion of the carrier plate or of the reinforcement layer.

5. The device according to claim 1 , wherein the coefficient of thermal expansion of the carrier plate differs by at most 300% from the coefficient of thermal expansion of the reinforcement layer.

6. The device according to claim 1 , wherein the carrier plate and the reinforcement layer are adapted to one another in such a way that a product of a layer thickness and a modulus of elasticity of the carrier plate differs by at most 50% from a product of a layer thickness and a modulus of elasticity of the reinforcement layer.

7. The device according to claim 1 , wherein a product of a layer thickness and a modulus of elasticity of the carrier plate or of the reinforcement layer is at least three times as large as a product of a layer thickness and a modulus of elasticity of the shaped body.

8. The device according to claim 1 , wherein the shaped body is a molded body comprising a radiation-transmissive material.

9. The device according to claim 1 , wherein the shaped body has a layer thickness which is at least three times as large as a layer thickness of the carrier plate or of the reinforcement layer.

10. The device according to claim 1 , wherein the carrier plate is a printed circuit board comprising a plastic base body and electrical conductor tracks arranged thereon.

11. The device according to claim 1 , wherein the reinforcement layer is a metal layer or a metal foil, and wherein, in a plan view of the carrier plate, the reinforcement layer completely covers the electronic component.

12. The device according to claim 1 , wherein in comparison with the carrier plate, the reinforcement layer has a lower layer thickness and a higher modulus of elasticity.

13. The device according to claim 1 , wherein the carrier plate and the reinforcement layer comprise at least in parts the same material, and wherein a layer thickness of the carrier plate differs by at most 50% from a layer thickness of the reinforcement layer.

14. The device according to claim 1 , wherein the reinforcement layer is arranged on the shaped body and spatially delimits the shaped body in the vertical direction.

15. The device according to claim 1 , wherein the reinforcement layer is embedded in the shaped body.

16. The device according to claim 1 , wherein the shaped body has a side surface and, directly on the carrier plate, a step projecting laterally in a lateral direction beyond remaining subregions of the side surface.

17. A method for producing the device according to claim 1 , the method comprising:
applying the shaped body to the carrier plate and to the electronic component by a mold method; and
applying the reinforcement layer to the shaped body or embedding the reinforcement layer in the shaped body.

18. A method for producing the device according to claim 1 , the method comprising:
forming the shaped body by dosing technology or by dispensing technology.

Assignees

• Osram Opto Semiconductors Gmbh
• Osram Oled Gmbh

Inventors

• Pindl Markus
• Stich Bernhard
• Wojcik Andreas

Classifications

• H10H29/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title

• H01S5/02208 Primary

  characterised by the shape of the housings · CPC title

• H10H29/853 Primary

  characterised by their shape · CPC title

• H10H20/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title

• H10H20/853 Primary

  characterised by their shape · CPC title