Device for inspecting a bump height surrounded by resist, device for processing a substrate, method for inspecting a bump height, and storage medium

Patent metadata

Field	Value
Publication number	US-10910334-B2
Application number	US-201916401760-A
Country	US
Kind code	B2
Filing date	May 2, 2019
Priority date	May 11, 2018
Publication date	Feb 2, 2021
Grant date	Feb 2, 2021

Abstract

A device for inspecting a bump height includes an illumination device, an imaging device, and a control device. The illumination device irradiates a substrate with light. The substrate includes a resist and a bump formed on an opening portion of the resist. The imaging device images a pattern of the resist and the bump. The control device evaluates a height of the bump based on a luminance value of image data of the pattern obtained by the imaging device.

First claim

What is claimed is:

1. A device for inspecting a bump height comprising:
an illumination device that irradiates a substrate with light, the substrate including a resist and a plurality of bumps formed on a plurality of opening portions of the resist;
an imaging device that images a pattern of the resist and the plurality of bumps, a luminance of the resist being different from a luminance of the bump; and
a control device that detects an abnormality of heights of the plurality of bumps based on a luminance value of image data of the pattern obtained by the imaging device.

2. The device for inspecting a bump height according to claim 1 , wherein
the control device detects an abnormality of the heights of the plurality of bumps based on a rate of an area of a region having a luminance value in a predetermined range in the image data.

3. The device for inspecting a bump height according to claim 1 , wherein
the control device detects an abnormality of the heights of the plurality of bumps based on a rate of an area of a region having a luminance value at a predetermined value or more in the image data.

4. The device for inspecting a bump height according to claim 1 , wherein
the control device sets image data of a prior pattern having normal bump heights as reference data and detects an abnormality of the heights of the plurality of bumps with image matching that compares the image data of the pattern obtained by the imaging device with the reference data.

5. The device for inspecting a bump height according to claim 1 , further comprising
an adjustment mechanism that adjusts an angle with respect to the substrate of the imaging device depending on a type of the substrate.

6. The device for inspecting a bump height according to claim 1 , wherein
the imaging device images the pattern at an outer peripheral portion of the substrate, and
the evaluation of the heights of the plurality of bumps is performed based on only image data of the pattern of the outer peripheral portion.

7. The device for inspecting a bump height according to claim 6 , wherein
the imaging device and the substrate are relatively rotated by one or more of predetermined angles by a first rotation mechanism that rotates the substrate or a second rotation mechanism that rotates the imaging device around the substrate, such that the imaging device images the outer peripheral portion of the substrate over a whole circumference.

8. The device for inspecting a bump height according to claim 1 , further comprising
a scanning mechanism that moves the imaging device such that the imaging device images a whole region of the substrate.

9. The device for inspecting a bump height according to claim 1 , wherein the control device detects an abnormality in response to a determination that the luminance value obtained by the imaging device is outside a predetermined range of luminance values.

10. The device for inspecting a bump height according to claim 1 , wherein
an irradiation angle at which the plurality of bumps is irradiated with light from the illumination device is different from an imaging angle at which the light is reflected on the plurality of bumps to reach the imaging device.

11. The device for inspecting a bump height according to claim 1 , wherein
the imaging device images the pattern from a direction oblique to a surface of the substrate.

12. A device for processing a substrate comprising:
a substrate processing portion that includes one or a plurality of substrate processing units that process a substrate;
a drying device that dries the substrate after the substrate process;
a device for inspecting a bump height provided to the drying device; and
a control device that controls the substrate processing portion, the drying device, and the device for inspecting a bump height, wherein
the device for inspecting a bump height includes:
an illumination device that irradiates the substrate with light; and
an imaging device that images a pattern of a resist and a plurality of bumps on substrate, a luminance of the resist being different from a luminance of the bumps, and

the control device detects an abnormality of heights of the plurality of bumps based on a luminance value of image data of the pattern obtained by the imaging device.

13. The device for processing a substrate according to claim 12 , wherein
the control device detects an abnormality of the heights of the plurality of bumps based on a rate of an area of a region having a luminance value in a predetermined range in the image data.

14. The device for processing a substrate according to claim 12 , wherein
the control device detects an abnormality of the heights of the plurality of bumps based on a rate of an area of a region having a luminance value at a predetermined value or more in the image data.

15. The device for processing a substrate according to claim 12 , wherein
the control device sets image data of a prior pattern having normal bump heights as reference data and detects an abnormality of the heights of the plurality of bumps with image matching that compares the image data of the pattern obtained by the imaging device with the reference data.

16. The device for processing a substrate according to claim 12 further comprising
an adjustment mechanism that adjusts an angle of the imaging device with respect to the substrate depending on a type of the substrate.

17. The device for processing a substrate according to claim 12 , wherein
the imaging device images the pattern at an outer peripheral portion of the substrate, and
the evaluation of the heights of the plurality of bumps is performed based on image data of the pattern of the outer peripheral portion.

18. The device for processing a substrate according to claim 17 , wherein
the imaging device and the substrate are relatively rotated by one or more of predetermined angles by a first rotation mechanism that rotates and dries the substrate or a second rotation mechanism that rotates the imaging device around the substrate, such that the imaging device images the outer peripheral portion of the substrate over a whole circumference.

19. The device for processing a substrate according to claim 12 further comprising a scanning mechanism that moves the imaging device such that the imaging device images a whole region of the substrate.

20. The device for processing a substrate according to claim 12 , wherein
the substrate processing portion includes one or a plurality of plating tanks,
the substrate is processed by plating in a state held onto a substrate holding member, and
the control device makes the substrate holding member that holds the substrate and/or plating tank that has performed the plating process on the substrate unused, when detecting an abnormality in the heights of the plurality of bumps of the substrate as a result of an inspection by the device for inspecting a bump height.

21. The device for inspecting a bump height according to claim 12 , wherein
an irradiation angle at which the plurality of bumps is irradiated with light from the illumination device is different from an imaging angle at which the light is reflected on the plurality of bumps to reach the imaging device.

22. The device for inspecting a bump height according to claim 12 , wherein
the imaging device images the pattern from a direction oblique to a surface of the substrate.

23. A method for inspecting a bump height comprising:
irradiati

Assignees

• Ebara Corp

Inventors

• Okuzono Takahisa
• Tomita Masaki
• Fujikata Jumpei

Classifications

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/01255

  by using masks · CPC title

• H10W72/01235

  by plating, e.g. electroless plating or electroplating · CPC title

• G06F18/22

  Matching criteria, e.g. proximity measures · CPC title

• H10P74/238

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title