Methods and systems for thermal control

Patent metadata

Field	Value
Publication number	US-10908657-B2
Application number	US-201916277873-A
Country	US
Kind code	B2
Filing date	Feb 15, 2019
Priority date	Feb 15, 2019
Publication date	Feb 2, 2021
Grant date	Feb 2, 2021

Abstract

Described herein are baffles for Input/Output (I/O) devices and I/O devices comprising baffles configured to redirect incoming pre-heated air around downstream electrical components and/or their respective heat sinks to prevent overheating. Providing an isolated fresh airflow path from a fluid inlet to such downstream electrical devices reducing such overheating, which prevents malfunctions and increases the I/O efficiency, speed, and lifetime of I/O devices.

First claim

What is claimed is:

1. An input/output (I/O) device comprising:
(a) an upstream electrical device comprising a first heatsink that emits heat;
(b) a downstream electrical device comprising a second heatsink; and
(c) a baffle for redirecting a predetermined portion of a fluid entering the I/O device around the upstream electrical device and the first heatsink through the downstream electrical device and the second heatsink and to an exhaust, the baffle comprising:
(i) a first portion comprising a fluid inlet, wherein at least a portion of the fluid inlet is upstream of the upstream electrical device and the first heatsink; and
(ii) a second portion comprising a fluid outlet, wherein at least a portion of the fluid outlet surrounds at least a portion of the downstream electrical device and the second heatsink;
wherein the baffle provides an airflow path from the first portion to the second portion such that the downstream electrical device and the second heatsink is isolated from the heat emitted by the upstream electrical device and the first heatsink, and wherein a pressure of the fluid at the fluid inlet is greater than the pressure of the fluid at the fluid outlet.

2. The I/O device of claim 1 , wherein the fluid comprises air, a gas, water, or a liquid.

3. The I/O device of claim 1 , wherein the pressure of the fluid at the fluid inlet is greater than the pressure of the fluid at the fluid outlet by about 0.75 inches of water gauge (iwg) to about 3 iwg.

4. The I/O device of claim 1 , wherein the first portion is offset from the second portion in one or more directions.

5. The I/O device of claim 1 , wherein an interior of at least one of the first portion and the second portion comprises a fluid redirection fin.

6. The I/O device of claim 1 , wherein a temperature of the fluid at the fluid inlet is about 25° C. to about 75° C.

7. The I/O device of claim 1 , wherein an upper surface of the first portion, the second portion or both, comprises a perforation.

8. The I/O device of claim 1 , wherein an upper surface of the first portion, the second portion or both, is removable.

9. The I/O device of claim 1 , having a ratio between an area of the fluid inlet and an area of the fluid outlet is about 0.1:1 to about 10:1.

10. The I/O device of claim 1 , having a ratio between a volume the first portion and a volume the second portion of about 0.1:1 to about 10:1.

11. The I/O device of claim 1 , having a ratio between a height of the fluid inlet and a height of the fluid outlet is about 0.1:1 to about 10:1.

12. The I/O device of claim 1 , wherein the predetermined portion of the fluid entering the I/O device is at least 20%.

13. The I/O device of claim 12 , wherein the predetermined portion of the fluid entering the I/O device is at least 50%.

Assignees

• Pensando Systems Inc

Inventors

• Odisho Victor
• Shen Lin

Classifications

• G06F1/20 Primary

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• H05K7/205

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• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title

• H05K7/20145

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• H05K7/20727

  within server blades for removing heat from heat source · CPC title