Two-dimensional conformal optically-fed phased array and methods of manufacturing the same

Patent metadata

Field	Value
Publication number	US-10908499-B2
Application number	US-201815909798-A
Country	US
Kind code	B2
Filing date	Mar 1, 2018
Priority date	Mar 1, 2017
Publication date	Feb 2, 2021
Grant date	Feb 2, 2021

Abstract

This disclosure is directed to two-dimensional conformal optically-fed phased arrays and methods for manufacturing the same. The method includes providing a wafer substrate, depositing a first cladding layer on the wafer substrate, and depositing a core layer on the first cladding layer. The method further includes photolithographically patterning the core layer to provide a plurality of optical waveguide cores, and depositing a second cladding layer on the core layer to cover the plurality of optical waveguide cores to provide a plurality of optical waveguides. In addition, the method includes forming a plurality of antennas on the second cladding layer, each antenna of the plurality of antennas located near a termination of a corresponding optical waveguide of the plurality of optical waveguides, and providing a plurality of photodiodes on the second cladding layer, each photodiode of the plurality of photodiodes connected to a corresponding antenna.

First claim

What is claimed is:

1. A method of manufacturing an optical waveguide module, comprising:
providing a wafer substrate;
depositing a first cladding layer on the wafer substrate;
depositing a core layer on the first cladding layer;
photolithographically patterning the core layer to provide a plurality of optical waveguide cores;
depositing a second cladding layer on the core layer to cover the plurality of optical waveguide cores to provide a plurality of optical waveguides;
patterning a plurality of openings, each opening of the plurality of openings extending into each of the first cladding layer, the core layer, and the second cladding layer;
forming a plurality of antennas on the second cladding layer, each antenna of the plurality of antennas located near a termination of a corresponding optical waveguide of the plurality of optical waveguides; and
providing a plurality of photodiodes on the second cladding layer, each photodiode of the plurality of photodiodes connected to a corresponding antenna,
wherein each of the plurality of openings is provided at a location corresponding to one of the plurality of photodiodes.

2. The method of claim 1 , further comprising:
integrating an input fiber array with the plurality of optical waveguides.

3. The method of claim 1 , wherein the wafer substrate is a quartz substrate.

4. The method of claim 1 , wherein the first cladding layer includes a silicon oxide.

5. The method of claim 1 , wherein the first cladding layer has a thickness less than 5 μm.

6. The method of claim 1 , wherein the core layer includes a silicon nitride.

7. The method of claim 1 , wherein the core layer has a thickness less than 0.4 μm.

8. The method of claim 1 , wherein the second cladding layer includes a silicon oxide.

9. The method of claim 1 , wherein the second cladding layer has a thickness of less than 6 μm.

10. The method of claim 1 , further comprising:
providing a plurality of micro-bends, each micro-bend being provided in a corresponding one of the plurality of openings,
wherein each of the plurality of openings is provided at a location corresponding to one of the plurality of photodiodes.

11. The method of claim 10 , wherein the micro-bend is a microprism.

12. The method of claim 10 , wherein the micro-bend is a photoresist mirror.

13. The method of claim 10 , wherein the micro-bend is wet-etch silicon Si mirror.

14. The method of claim 10 , wherein the micro-bend is an epitaxially-grown microprism.

15. A method of manufacturing an optical waveguide module, comprising:
providing a wafer substrate;
depositing a first cladding layer on the wafer substrate;
depositing a core layer on the first cladding layer;
depositing a second cladding layer on the core layer;
patterning a plurality of openings in a stack consisting of the first cladding layer, the core layer, and the second cladding layer, each of the plurality of openings exposing a top surface of the wafer substrate;
providing a plurality of micro-bends, each micro-bend provided in a corresponding one of the plurality of openings;
forming a plurality of antennas on the second cladding layer, each antenna of the plurality of antennas located near a corresponding one of the plurality of micro-bends; and
providing a plurality of photodiodes on the second cladding layer, each photodiode of the plurality of photodiodes connected to a corresponding antenna and located above the corresponding micro-bend.

16. The method of claim 15 , further comprising:
photolithographically patterning the core layer to provide a plurality of optical waveguides.

17. The method of claim 16 , further comprising:
integrating an input fiber array with the plurality of optical waveguides.

18. The method of claim 15 , wherein the plurality of micro-bends include wet-etch silicon Si mirrors.

19. The method of claim 15 , wherein the wafer substrate is a quartz substrate.

20. The method of claim 15 , wherein the first cladding layer includes a silicon oxide.

21. The method of claim 15 , wherein the first cladding layer has a thickness less than 5 μm.

22. The method of claim 15 , wherein the core layer includes a silicon nitride and has a thickness less than 0.4 μm.

23. The method of claim 15 , wherein the second cladding layer includes a silicon oxide and has a thickness less than 6 μm.

24. The method of claim 15 , wherein the micro-bend includes at least one of a microprism, a photoresist mirror, and an epitaxially-grown microprism.

25. A method of manufacturing an optical waveguide module, comprising:
providing a wafer substrate;
depositing a first cladding layer on the wafer substrate;
depositing a core layer on the first cladding layer;
photolithographically patterning the core layer to provide a plurality of optical waveguide cores;
depositing a second cladding layer on the core layer to cover the plurality of optical waveguide cores to provide a plurality of optical waveguides;
forming a plurality of antennas on the second cladding layer, each antenna of the plurality of antennas located near a termination of a corresponding optical waveguide of the plurality of optical waveguides; and
providing a plurality of photodiodes on the second cladding layer, each photodiode of the plurality of photodiodes connected to a corresponding antenna,
wherein the photolithographically patterning the core layer includes:
providing a plurality of grating couplings,
wherein each grating coupling of the plurality of grating couplings is provided at a location corresponding to a corresponding one of the plurality of photodiodes, and
wherein each grating coupling of the plurality of grating couplings is cut fully through the core layer such that a height of the grating coupling in a vertical direction is the same as a height of the core layer in the vertical direction, the vertical direction being a direction perpendicular to a top surface of the wafer substrate.

26. The method of claim 25 , further comprising:
integrating an input fiber array with the plurality of optical waveguides.

27. The method of claim 25 ,
wherein the wafer substrate is a quartz substrate,
wherein the first cladding layer includes a silicon oxide and has a thickness less than 5 μm,
wherein the core layer includes a silicon nitride and has a thickness less than 0.4 μm, and
wherein the second cladding layer includes a silicon oxide, and has a thickness of less than 6 μm.

28. The method of claim 25 ,
wherein each of the plurality of grating couplings includes gratings and spaces between the gratings, and
wherein heights of the gratings and spaces in the vertical direction is the same as the height of the core layer in the vertical direction.

Assignees

• Phase Sensitive Innovations Inc

Inventors

• Shi Shouyuan
• Prather Dennis
• Yao Peng
• Murakowski Janusz

Classifications

• H01Q3/2676 Primary

  Optically controlled phased array · CPC title

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01Q21/062

  using dipole aerials; (H01Q21/067, H01Q21/068 take precedence) · CPC title

• G03F7/0005 Primary

  Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor · CPC title

• H01Q21/065

  Patch antenna array · CPC title