Light-emitting module structure

Patent metadata

Field	Value
Publication number	US-10908344-B2
Application number	US-201916373651-A
Country	US
Kind code	B2
Filing date	Apr 3, 2019
Priority date	Apr 19, 2018
Publication date	Feb 2, 2021
Grant date	Feb 2, 2021

Abstract

A light-emitting module structure includes a substrate, a plurality of light-emitting diodes (LEDs) disposed on the substrate, and a light-guiding layer covering the light-emitting diodes. The light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and the recesses are above the light-emitting diodes or between the light-emitting diodes. This light-emitting module structure can improve the brightness and uniformity of the light-emitting module.

First claim

What is claimed is:

1. A light-emitting module structure, comprising:
a substrate;
a plurality of light-emitting diodes disposed on the substrate;
a plurality of crosstalk resistant structures disposed on the substrate, wherein each of the crosstalk resistant structures is between the light-emitting diodes;
a plurality of mirror reflection structures disposed on the substrate, wherein each of the mirror reflection structures is arranged between two adjacent ones of the light-emitting diodes and is arranged between one of the light-emitting diodes and one side of each of the crosstalk resistant structures;
a plurality of scattering structures disposed on the substrate, wherein each of the scattering structures is adjacent to each of the mirror reflection structures; and
a light-guiding layer covering the light-emitting diodes, wherein the light-guiding layer has an upper surface, the upper surface has a plurality of recesses, and each of the recesses is on each of the light-emitting diodes.

2. The light-emitting module structure of claim 1 , wherein the light-emitting diodes are arranged as a regular hexagon, and each of the crosstalk resistant structures is positioned at a center of the regular hexagon.

3. The light-emitting module structure of claim 1 , wherein the crosstalk resistant structures comprise a plurality of cones or a plurality of cylinders, and each of the crosstalk resistant structures has a height that is greater than or equal to a height of each of the light-emitting diodes.

4. The light-emitting module structure of claim 1 , wherein each of the recesses has an opening and a bottom, wherein the opening has a width, the bottoms is aligned with one of the light-emitting diodes, a vertical distance is between the aligned bottom and the light-emitting diode, and a ratio of the width to the vertical distance is about 0.85 to 3.5.

5. The light-emitting module structure of claim 1 , further comprising at least one reflection structure disposed on a part of the upper surface of the light-guiding layer, wherein the reflection structure has a reflection surface immediately neighboring the upper surface, and the reflection surface is a mirror reflection surface.

6. The light-emitting module structure of claim 1 , wherein the recesses comprise cone recesses or cylindrical recesses.

7. The light-emitting module structure of claim 1 , wherein the recesses comprise a plurality of first V-shaped trenches extending along a first direction.

8. The light-emitting module structure of claim 1 , further comprising a phosphor layer or a quantum dot layer on the upper surface of the light-guiding layer.

9. The light-emitting module structure of claim 8 , further comprising a phosphor layer covering at least one of the light-emitting diodes.

10. The light-emitting module structure of claim 1 , wherein the upper surface of the light-guiding layer is a reflection surface or a refraction surface.

11. The light-emitting module structure of claim 1 , further comprising a concave structure disposed between the substrate and each of the light-emitting diodes.

12. The light-emitting module structure of claim 1 , further comprising a transparent glue layer on the upper surface of the light-guiding layer, wherein the transparent glue layer fills the recesses.

13. The light-emitting module structure of claim 12 , wherein the transparent glue layer in the recesses has a protruding glue accumulation portion.

14. The light-emitting module structure of claim 1 , wherein the substrate has at least one cavity, and at least one of the light-emitting diodes is correspondingly disposed in the at least one cavity, wherein the light-emitting diodes are chip size package light-emitting diodes.

15. A light-emitting module structure, comprising:
a substrate;
a plurality of light-emitting diodes disposed on the substrate;
a plurality of crosstalk resistance structures disposed on the substrate, wherein each of the crosstalk resistance structures is between the light-emitting diodes;
a plurality of scattering structures disposed on the substrate, wherein each of the scattering structures is arranged between two adjacent ones of the light-emitting diodes and is arranges between one of the light-emitting diodes and one side of each of the crosstalk resistant structures; and
a light-guiding layer covering the light-emitting diodes, wherein the light-guiding layer has an upper surface, the upper surface has a plurality of recesses, each of the recesses is on each of the light-emitting diodes, wherein the recesses comprise a plurality of first v-shaped trenches extending along a first direction and a plurality of second V-shaped trenches extending along a second direction, the second direction is different from the first direction, and the first V-shaped trenches intersect with the second V-shaped trenches to form a plurality of intersections.

Assignees

• Lextar Electronics Corp

Inventors

• Cai Pei-Song
• Lai Lung-Kuan
• Yeh Shih-Yu
• Chen Guan-Zhi
• Liu hong-zhi
• Chang Kuo-Yen
• Li Ching-Hua

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H20/855

  Optical field-shaping means, e.g. lenses · CPC title

• H10H20/856

  Reflecting means · CPC title

• H10H20/85

  Packages · CPC title

• G02B6/0068

  Arrangements of plural sources, e.g. multi-colour light sources · CPC title