Method for magnetic flux compensation in a directional solidification furnace utilizing an actuated secondary coil
US-2019126344-A1 · May 2, 2019 · US
Multi-layer susceptor design for magnetic flux shielding in directional solidification furnaces
US10907269B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10907269-B2 |
| Application number | US-202016913813-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 26, 2020 |
| Priority date | Oct 30, 2017 |
| Publication date | Feb 2, 2021 |
| Grant date | Feb 2, 2021 |
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- Title
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Abstract
Official abstract text for this publication.
An induction furnace assembly comprising a chamber having a mold; a primary inductive coil coupled to the chamber; a layered susceptor comprising at least two layers of magnetic field attenuating material surrounding the chamber between the primary inductive coil and the mold to nullify the electromagnetic field in the hot zone of the furnace chamber.
First claim
Opening claim text (preview).
What is claimed is: 1. An induction furnace assembly comprising: a chamber having a mold; a primary inductive coil coupled to said chamber; a susceptor comprising a first layer and a second layer enclosing an interior layer of electromagnetic field attenuating material surrounding said chamber between said primary inductive coil and said mold; and said first layer and said second layer are configured for protecting the interior layer from material degradation, said interior layer comprises at least one of a castable nickel-based alloy or Co-based superalloy and castable ferrous alloy. 2. The induction furnace assembly according to claim 1 , wherein the layers of electromagnetic field attenuating material are configured to attenuate the primary induction coil electromagnetic field. 3. The induction furnace assembly according to claim 1 , wherein the first layer and the second layer comprise the same material. 4. The induction furnace assembly according to claim 1 , wherein the interior layer comprises a secondary means for controlling the total primary induction coil electromagnetic field. 5. The induction furnace assembly according to claim 1 , wherein the interior layer comprises material properties configured to attenuate the primary induction coil electromagnetic field at predetermined casting temperatures. 6. The induction furnace assembly according to claim 1 , wherein the first layer and the second layer comprise a ceramic material. 7. The induction furnace assembly according to claim 1 , wherein the first layer and the second layer comprise a refractory material. 8. The induction furnace assembly according to claim 1 , wherein the first layer and the second layer comprise a graphite material. 9. The induction furnace assembly according to claim 1 , wherein said first layer and said second layer each comprise material properties configured to attenuate the primary induction coil electromagnetic field at predetermined casting temperatures.
Assignees
Inventors
Classifications
- F27D11/06Primary
Induction heating, i.e. in which the material being heated, or its container or elements embodied therein, form the secondary of a transformer · CPC title
- C30B11/003Primary
Heating or cooling of the melt or the crystallised material · CPC title
Induction furnaces · CPC title
Use of electric or magnetic effects {(for continuous casting B22D11/015, B22D11/11)} · CPC title
Arrangements of heating devices · CPC title
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- What does patent US10907269B2 cover?
- An induction furnace assembly comprising a chamber having a mold; a primary inductive coil coupled to the chamber; a layered susceptor comprising at least two layers of magnetic field attenuating material surrounding the chamber between the primary inductive coil and the mold to nullify the electromagnetic field in the hot zone of the furnace chamber.
- Who is the assignee on this patent?
- Raytheon Tech Corp
- What technology area does this patent fall under?
- Primary CPC classification F27D11/06. Mapped technology areas include Mechanical Engineering.
- When was this patent published?
- Publication date Tue Feb 02 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).