Thermoforming method and thermoforming apparatus

US10906230B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10906230-B2
Application numberUS-201916560744-A
CountryUS
Kind codeB2
Filing dateSep 4, 2019
Priority dateOct 8, 2015
Publication dateFeb 2, 2021
Grant dateFeb 2, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided is a method of thermoforming a molding material to have a bent portion and a flat portion extending from the bent portion. The method includes: placing the molding material on a bending mold, the bending mold having a curved surface; and forming the bent portion of the molding material by heating a portion of the molding material at least to a fluidization temperature such that the portion of the molding material bends due to the weight of the flat portion of the molding material to form the bent portion according to a shape of the bending mold.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus for thermoforming a molding material to have a bent portion and a flat portion extending from bent portion, the apparatus comprising: a base stage comprising a sliding surface; a bending mold on the base stage, and having a curved upper surface; a temperature controller configured to heat the molding material such that the bent portion is fluidized; a weight coupled to the flat portion; and a magnet beneath the sliding surface and arranged along a rotation path of the flat portion, wherein the fluidized bent portion is configured to be bent due to the weight, wherein when the bent portion bends, the weight slides along the sliding surface, and wherein the weight comprises a magnetic material, and the magnet is configured to apply a force to the weight in a direction away from a center of the bent portion. 2. The apparatus of claim 1 , wherein the flat portion has a first end extending from the bent portion and a second end opposite to the first end, and wherein when the bent portion bends, the second end rotates about the bending mold. 3. The apparatus of claim 2 , further comprising a support member, wherein, in a first state, the support member is under the flat portion in a vertical direction such that the flat portion is supported, and wherein, in a second state, the support member does not overlap the second end in the vertical direction such that the flat portion rotates. 4. The apparatus of claim 1 , wherein the temperature controller is configured to cool the bent portion to a fluidization temperature of the bent portion or lower. 5. The apparatus of claim 1 , wherein the bending mold is non-overlapping with the flat portion when viewed in a plane.

Assignees

Inventors

Classifications

  • B29C53/04Primary

    of plates or sheets {(B29C63/04 takes precedence; bending or folding paper B31F1/0003; folding films B65H45/00)} · CPC title

  • Measuring, controlling or regulating · CPC title

  • by gravity only, e.g. sagging (C03B23/035 takes precedence) · CPC title

  • having movable moulds or mould parts · CPC title

  • B29C51/08Primary

    Deep drawing or matched-mould forming, i.e. using mechanical means only · CPC title

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What does patent US10906230B2 cover?
Provided is a method of thermoforming a molding material to have a bent portion and a flat portion extending from the bent portion. The method includes: placing the molding material on a bending mold, the bending mold having a curved surface; and forming the bent portion of the molding material by heating a portion of the molding material at least to a fluidization temperature such that the por…
Who is the assignee on this patent?
Samsung Display Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C53/04. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 02 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).