Manufacturing method of liquid supply member

US10906221B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10906221-B2
Application numberUS-201715649482-A
CountryUS
Kind codeB2
Filing dateJul 13, 2017
Priority dateJul 29, 2016
Publication dateFeb 2, 2021
Grant dateFeb 2, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

There is provided a manufacturing method of a liquid supply member capable of suppressing decrease in sealing property of a liquid supply path and deformation of the liquid supply path or the external shape. For that purpose, a manufacturing process of a liquid supply member prevents inflow of a molten resin into a concave portion of a portion other than a liquid supply flow path in a liquid supply member.

First claim

Opening claim text (preview).

What is claimed is: 1. A manufacturing method of a liquid supply member, the method comprising: a primary molding process of molding, at different positions in a same die, a first member including a concave portion and a groove portion that causes liquid to flow such that a first part of the die is inside the concave portion, and a second member having a lid portion capable of closing a lid of the groove portion in combination with the first member, and an opening such that a second part of the die, which is different from the first part of the die, is inside the opening; a mold opening process of pulling out the first part of the die from the inside of the concave portion of the first member; and a secondary molding process of connecting the first member and the second member with a molten resin by relatively moving a first pattern and a second pattern of the die to thereby cause the first member and the second member to face each other and by molding the first member and the second member in an overlapped manner, wherein the secondary molding process includes an inflow prevention process of preventing inflow of the molten resin into the concave portion provided at a position different from the groove portion in the first member by inserting the second part of the die into the concave portion so that the molten resin contacts the second part of the die. 2. The manufacturing method according to claim 1 , wherein the second part of the die is provided with a gas vent for removing gas from the inside of the concave portion. 3. The manufacturing method according to claim 1 , wherein the secondary molding process inserts the second part of the die into the concave portion of the first member, via the opening of the second member. 4. The manufacturing method according to claim 3 , wherein an opening diameter of the opening is larger than an opening diameter of the concave portion, in the secondary molding process. 5. The manufacturing method according to claim 3 , wherein, in the secondary molding process, an opening diameter of an opening formed by the molten resin provided between the opening of the second member and the concave portion of the first member is smaller than an opening diameter of the opening of the second member.

Assignees

Inventors

Classifications

  • Joined by injection moulding · CPC title

  • facing before assembling, i.e. bringing the parts opposite to each other before assembling · CPC title

  • Ink connection · CPC title

  • Details of contacts on the cartridge, e.g. protection of contacts · CPC title

  • Mounting within the printer · CPC title

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Frequently asked questions

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What does patent US10906221B2 cover?
There is provided a manufacturing method of a liquid supply member capable of suppressing decrease in sealing property of a liquid supply path and deformation of the liquid supply path or the external shape. For that purpose, a manufacturing process of a liquid supply member prevents inflow of a molten resin into a concave portion of a portion other than a liquid supply flow path in a liquid su…
Who is the assignee on this patent?
Canon Kk
What technology area does this patent fall under?
Primary CPC classification B29C45/0062. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 02 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).