Chip component having groove formed therein

Patent metadata

Field	Value
Publication number	US-10905015-B2
Application number	US-201815943944-A
Country	US
Kind code	B2
Filing date	Apr 3, 2018
Priority date	May 10, 2017
Publication date	Jan 26, 2021
Grant date	Jan 26, 2021

Abstract

The present disclosure relates to a laminated-type chip component, and more particularly, to a laminated-type chip component which can be more stably bonded by forming a groove filled with solder in a region in which an external electrode terminal of the laminated-type chip is soldered and thereby increasing the area of soldering.

First claim

What is claimed is:

1. A laminated-type chip comprising:
a ceramic main body in which a plurality of dielectric layers are laminated and which comprises an inner electrode; and
an outer electrode terminal on both surfaces in a lengthwise direction of the ceramic main body, a solder joint part being defined on a lower surface of the outer electrode terminal to be soldered to an electrode pad,
wherein one or more soldering grooves are defined in the lower surface of the outer electrode in the lengthwise direction at a portion of the solder joint part, and
wherein each of a length, a width, and a depth of each soldering groove is 1.5 times to 2.5 times a size of a solder particle in the solder joint part.

2. The laminated-type chip of claim 1 , wherein a cross-section of the soldering groove has a rectangular shape including a first bent part and a second bent part which form an angle of 30 degrees or more with a bottom part of the outer electrode terminal.

3. The laminated-type chip of claim 2 , wherein the soldering groove is a hexahedron including the cross-section of the rectangular shape, and each of the lengths of sides of the hexahedron is 1.5 times to 2.5 times the size of the solder particle.

4. The laminated-type chip of claim 1 , wherein a cross-section of the soldering groove has a triangular shape comprising: a first hypotenuse part and a second hypotenuse part which form predetermined internal angles with a bottom part of the outer electrode terminal.

5. The laminated-type chip of claim 4 , wherein the predetermined internal angles are 30 degrees or more.

6. The laminated-type chip of claim 1 , wherein the solder joint part comprises an uneven part formed to comprise a recessed portion and a protruding portion.

7. A laminated-type chip comprising:
a ceramic main body in which a plurality of dielectric layers are laminated and which comprises an inner electrode; and
an outer electrode terminal on both surfaces in a lengthwise direction of the ceramic main body, a solder joint part being defined on a lower surface of the outer electrode terminal to be soldered to an electrode pad,
wherein one or more soldering grooves are defined in the lower surface of the outer electrode in the lengthwise direction at a portion of the solder joint part, and
wherein the length of the soldering groove is smaller than the width of the solder joint part.

8. The laminated-type chip of claim 6 , wherein the solder joint part comprises a plurality of uneven parts.

9. The laminated-type chip of claim 7 , wherein the solder joint part comprises an uneven part formed to comprise a recessed portion and a protruding portion.

10. The laminated-type chip of claim 9 , wherein the solder joint part comprises a plurality of uneven parts.

11. The laminated-type chip of claim 7 , wherein each of a length, a width, and a depth of each soldering groove is 1.5 times to 2.5 times a size of a solder particle in the solder joint part.

12. The laminated-type chip of claim 7 , wherein a cross-section of the soldering groove has a rectangular shape including a first bent part and a second bent part which form an angle of 30 degrees or more with a bottom part of the outer electrode terminal.

13. The laminated-type chip of claim 12 , wherein the soldering groove is a hexahedron including the cross-section of the rectangular shape, and each of the lengths of sides of the hexahedron is 1.5 times to 2.5 times the size of a solder particle in the solder joint part.

14. The laminated-type chip of claim 7 , wherein a cross-section of the soldering groove has a triangular shape comprising: a first hypotenuse part and a second hypotenuse part which form predetermined internal angles with a bottom part of the outer electrode terminal.

15. The laminated-type chip of claim 14 , wherein the predetermined internal angles are 30 degrees or more.

Assignees

• Lg Chemical Ltd

Inventors

• Woo Ga Young
• Son Young Su
• Kim Byeong Geon

Classifications

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W70/68

  Shapes or dispositions thereof · CPC title

• H01G4/232 Primary

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G2/065

  for surface mounting, e.g. chip capacitors · CPC title

• H05K2201/0373

  Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool · CPC title