Buffer Chamber Wafer Heating Mechanism And Supporting Robot
US-2016307782-A1 · Oct 20, 2016 · US
US10903059B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10903059-B2 |
| Application number | US-201816123709-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 6, 2018 |
| Priority date | Sep 7, 2017 |
| Publication date | Jan 26, 2021 |
| Grant date | Jan 26, 2021 |
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Official abstract text for this publication.
A film formation apparatus includes a chamber which has an interior capable of being vacuumed, and which includes a lid that is openable and closable on the upper part of the chamber, a rotation table which is provided in the chamber and which and carries a workpiece in the circular trajectory, a film formation unit that deposits film formation materials by sputtering on the workpiece carried by the rotation table to form films, a shielding member which is provided with an opening at the side which the workpiece passes through, and which forms a film formation room where the film formations by the film formation units are performed, and a support which supports the shielding member, and which is independent relative to the chamber and is independent from the lid.
Opening claim text (preview).
What is claimed is: 1. A film formation apparatus comprising: a chamber which has an interior capable of being vacuumed, and which comprises a lid that is openable and closable on an upper part of the chamber; a carrying unit which is provided in the chamber and which comprises a rotation table holding workpieces and a rotation shaft that carries the workpieces in a circular trajectory while rotating around the rotation shaft as a center; a film formation unit that deposit a film formation material by sputtering on the workpiece carried by the carrying unit to form a film; a shielding member which is provided with an opening at a side which the workpiece passes through, and which forms a film formation room where the film formation by the film formation unit is performed; and a support which supports the shielding member, and which is immovable relative to the chamber and independent from the lid, wherein the support includes an outer-circumference support and an inner-circumference support, the outer-circumference support that supports the shielding member at an outer circumference side of the rotation of the carrying unit, the inner-circumference support that supports the shielding member at an inner circumference side of the rotation of the carrying unit, the inner-circumference support includes a supporting pillar which supports the rotation shaft, and which is immovable relative to the chamber, and a clearance that allows the workpiece on the rotating rotation table to pass through is formed between lower ends of the opening of the shielding member and the rotation table. 2. The film formation apparatus according to claim 1 , further comprising a first vibration absorber provided between the shielding member and the support. 3. The film formation apparatus according to claim 1 , further comprising a second vibration absorber provided between the shielding member and the lid. 4. The film formation apparatus according to claim 1 , further comprising a heat dissipating member provided between the shielding member and the lid. 5. The film formation apparatus according to claim 1 , wherein the shielding member comprises: a ceiling attached to the lid; and a side surface provided separately from the ceiling. 6. The film formation apparatus according to claim 1 , further comprising an adjusting member which is freely detachably attached to the shielding member, and which adjusts a clearance between the shielding member and the workpiece. 7. The film formation apparatus according to claim 6 , wherein the adjusting member comprises a combination of a plurality of divided components. 8. The film formation apparatus according to claim 1 , further comprising a correction plate which is freely detachably attached to the shielding member, and which adjusts a film thickness distribution of a film to be formed. 9. The film formation apparatus according to claim 1 , wherein the rotation shaft passes through the bottom of the chamber and stands in the chamber.
Formation by plasma treatments, e.g. plasma oxidation of the substrate · CPC title
of a metallic layer · CPC title
Physical vapour deposition [PVD] · CPC title
characterised by supporting two or more semiconductor substrates · CPC title
characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title
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