Electronic device

Patent metadata

Field	Value
Publication number	US-10901566-B2
Application number	US-201916521234-A
Country	US
Kind code	B2
Filing date	Jul 24, 2019
Priority date	Sep 18, 2018
Publication date	Jan 26, 2021
Grant date	Jan 26, 2021

Abstract

An electronic device includes an organic layer disposed in a bendable region and a connection wiring disposed on the organic layer. The connection wiring is connected to the signal lines connected to pixels of a display unit. The organic layer and the connection wiring in the bendable region include the same materials as those in an input sensing unit.

First claim

What is claimed is:

1. An electronic, device comprising:
a base substrate that includes a bendable region capable of being bent about a bending axis that extends along one direction and a non-bendable region adjacent to the bendable region;
a display unit disposed on the base substrate and that includes
a circuit element layer that includes a thin film transistor and a plurality of insulating layers,
a display element layer that includes an organic light emitting element connected to the thin film transistor,
a sealing layer that covers the display element layer, and a
groove formed through some of the insulating layers in the bendable region that exposes a part of the base substrate in the bendable region;

an input sensing unit disposed on the sealing layer and that includes
a first detection insulating layer disposed on the sealing layer,
a first detection pattern disposed on the sealing layer and covered by the first detection insulating layer,
a second detection pattern disposed on the first detection insulating layer,
a first organic layer in the bendable region that covers a part of the exposed base substrate and the groove;
a connection wiring in the bendable region disposed on the first organic layer and connected to at least one of the display unit and the input sensing unit and that includes a same material as at least one of the first and second detection patterns; and

a second organic layer that covers the connection wiring in the bendable region,
wherein the first organic layer and the connection wiring overlap each other in the bendable region.

2. The electronic device of claim 1 , wherein the second detection pattern overlaps the first detection pattern and is connected to the first detection pattern and a second detection insulating layer that covers the first detection insulating layer and the second detection pattern.

3. The electronic device of claim 1 , wherein
the first organic layer comprises a same material as the first detection insulating layer, and
the second organic layer comprises a same material as the second detection insulating layer.

4. The electronic device of claim 1 , wherein the first organic layer comprises a same material as any one of the insulating layers.

5. The electronic device of claim 1 , wherein the second organic layer comprises a same material as the first detection insulating layer.

6. The electronic device of claim 1 , further comprising
an additional organic layer disposed in the bendable region between the first organic layer and the second organic layer and that includes a same material as the first detection insulating layer,
wherein the second organic layer includes a same material as the second detection insulating layer.

7. The electronic device of claim 6 , wherein the connection wiring comprises
a first wiring disposed in the bendable region between the first organic layer and the additional organic layer, and
a second wiring disposed in the bendable region between the additional organic layer and the second organic layer,
wherein the second wiring is connected to the first wiring through a contact hole that penetrates the additional organic layer.

8. The electronic device of claim 1 , wherein the connection wiring is disposed between the first organic layer and the second organic layer.

9. The electronic device of claim 1 , wherein the thin film transistor comprises
a semiconductor pattern,
a control electrode spaced apart from the semiconductor pattern,
an upper electrode spaced apart from the control electrode,
an input electrode connected to the semiconductor pattern, and
an output electrode disposed on the same layer as the input electrode and connected to the semiconductor pattern,
wherein the semiconductor pattern comprises at least one of an oxide semiconductor pattern or a silicon semiconductor pattern.

10. The electronic device of claim 9 , wherein the insulating layers comprise:
at least one inorganic layer disposed between the base substrate and the semiconductor pattern;
a first insulating layer that covers the semiconductor pattern;
a second insulating layer that covers the control electrode and the first insulating layer,
a third insulating layer that covers the upper electrode and the second insulating layer; and
a fourth insulating layer that covers the third insulating layer, the input electrode, and the output electrode,
wherein the first organic layer comprises a same material as the fourth insulating layer.

11. The electronic device of claim 1 , further comprising
a pad area in the bendable region that includes a pad exposed by some of the insulating layers that overlap the bendable region, wherein the pad is connected to the connection wiring.

12. The electronic device of claim 11 , further comprising a circuit board connected to the pad.

13. An electronic device, comprising:
a base substrate that includes a bendable region capable of being bent about a bending axis that extends along one direction and a non-bendable region adjacent to the bendable region;
a display unit that includes
a pixel disposed on the base substrate and that includes a thin film transistor,
an organic light emitting element connected to the thin film transistor, and
a plurality of insulating layers;

an input sensing unit disposed on the pixel, and that includes
a first detection pattern disposed on the pixel,
a first detection insulating layer disposed on the pixel and that covers the first detection pattern,
a second detection pattern disposed on the first detection insulating layer, wherein the second detection pattern overlaps and is connected to the first detection pattern, and
a second detection insulating layer that covers the first detection insulating layer and the second detection pattern;

a groove formed through the insulating layers in the bendable region that exposes a part of the base substrate in the bendable region and that extends along the bending axis;
a first organic layer in the bendable region that covers a part of the exposed base substrate and the groove;
a connection wiring connected to the pixel through the bendable region; and
a second organic layer in the bendable region and that covers the connection wiring, wherein the second organic layer comprises a same material as the second detection insulating layer.

14. The electronic device of claim 13 , wherein the connection wiring comprises a same material as at least one of the first and second detection patterns.

15. The electronic device of claim 13 , wherein the first organic layer comprises a same material as the first detection insulating layer.

16. The electronic device of claim 13 , wherein the connection wiring is disposed on the first organic layer.

17. The electronic device of claim 13 , wherein the first organic layer comprises a same material as at least one of the insulating layers.

18. The electronic device of claim 13 , further comprising
an additional organic layer disposed in the bendable region between the first organic layer and the second organic layer and that includes a same material as the first detection insulating layer,
wherein the connection wiring comprises
a first wiring disposed in the bendable region between the first organic layer and the additional organic layer, and
a second wiring disposed in the bendable region between the additional organic layer and the second organic layer, wherein the second wiring is connected to the first wiring through a contact hole that penetrates the additional organic layer.

Assignees

• Samsung Display Co Ltd

Inventors

• Shim Jinbo
• Kim Kyungseop
• Park Sungkyun
• Choi Wonsuk
• Choi Jaewon
• Hong Jung-Moo

Classifications

• H10K59/8731

  multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers · CPC title

• G06F3/0445 Primary

  using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer · CPC title

• G06F3/0412 Primary

  Digitisers structurally integrated in a display · CPC title

• G06F1/1656 Primary

  Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

• G06F1/1616

  with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position · CPC title