Methods for evaluating resist development

Patent metadata

Field	Value
Publication number	US-10901322-B2
Application number	US-201816605542-A
Country	US
Kind code	B2
Filing date	Apr 20, 2018
Priority date	May 12, 2017
Publication date	Jan 26, 2021
Grant date	Jan 26, 2021

Abstract

A method, including: obtaining a set of conditions for a resist development model for simulating a resist development process of a resist layer; and performing, by a hardware computer system, a computer simulation of the resist development process using the set of conditions and the resist development model to obtain a characteristic of the development of the resist layer, wherein the computer simulation separately simulates different certain different physical and chemical processes and characteristics of the resist development process.

First claim

What is claimed is:

1. A method, comprising:
obtaining a set of conditions for a resist development model for simulating a resist development process of a resist layer; and
performing, by a hardware computer system, a computer simulation of the resist development process using the set of conditions and the resist development model to obtain a characteristic of the development of the resist layer, wherein the computer simulation is configured to simulate a first physical or chemical process or characteristic of the resist development process independently from a second different physical or chemical process or characteristic of the resist development process and to separately simulate the second physical or chemical process or characteristic of the resist development process independently from the first physical or chemical process or characteristic of the resist development process.

2. The method of claim 1 , wherein the resist development model models a chemical reaction between the resist and the developer separately from diffusion of the developer and of a by-product from the chemical reaction between the resist and the developer.

3. The method of claim 2 , wherein the resist development model further models the generation of the by-product and depletion of the developer.

4. The method of claim 2 , wherein the resist development model comprises mathematical terms for modeling chemical reactions separate from mathematical terms for modeling diffusion.

5. The method of claim 1 , wherein the resist development model comprises separate variables for an amount of undissolved resist, for an amount of dissolved resist, and for developer concentration.

6. The method of claim 1 , comprising:
determining a characteristic of a diffusion in the development of the resist layer as if there were no chemical reaction in the development of the resist layer;
determining a characteristic of a chemical reaction in the development of the resist layer as if there were no diffusion in the development of the resist layer; and
determining the characteristic of the development of the resist layer based on the characteristic of the diffusion and the characteristic of the chemical reaction.

7. The method of claim 1 , comprising:
determining a characteristic of diffusion in the development of the resist layer in a first direction, as if there were no diffusion in any directions perpendicular to the first direction;
determining a characteristic of diffusion in the development of the resist layer in a second direction as if there were no diffusion in the first direction, the second direction being different from the first direction; and
determining the characteristic of the development of the resist layer based on the characteristic of the diffusion in the first direction and the characteristic of the diffusion in the second direction.

8. The method of claim 7 , wherein the second direction is perpendicular to the first direction.

9. The method of claim 1 , wherein the resist layer is a radiation-sensitive resist layer and the set of conditions comprises a solubility distribution within the resist layer arising from exposure of the resist layer.

10. The method of claim 1 , further comprising adjusting a parameter of a device manufacturing process or a device manufacturing apparatus based on the characteristic of the development of the resist layer.

11. The method of claim 10 , wherein the parameter is a parameter of a design layout to be applied to the resist layer.

12. The method of claim 10 , wherein the resist layer is configured to undergo a physical or chemical treatment during the device manufacturing process or using the device manufacturing apparatus.

13. The method of claim 1 , wherein the characteristic of the development of the resist layer is an amount, or change in amount, of resist, a displacement of material, a CD or change in CD, or an edge placement error or change in edge placement error.

14. The method of claim 1 , wherein the resist is a positive tone resist or a negative tone resist.

15. A non-transitory computer program product comprising machine-readable instructions therein, the instructions, upon execution by a computer system, configured to cause the computer system to at least:
obtain a set of conditions for a resist development model for simulating a resist development process of a resist layer; and
perform a computer simulation of the resist development process using the set of conditions and the resist development model to obtain a characteristic of the development of the resist layer, wherein the computer simulation is configured to simulate a first physical or chemical process or characteristic of the resist development process independently from a second different physical or chemical process or characteristic of the resist development process and to separately simulate the second physical or chemical process or characteristic of the resist development process independently from the first physical or chemical process or characteristic of the resist development process.

16. The computer program product of claim 15 , wherein the resist development model models a chemical reaction between the resist and the developer separately from diffusion of the developer and of a by-product from the chemical reaction between the resist and the developer.

17. The computer program product of claim 15 , wherein the resist development model comprises separate variables for an amount of undissolved resist, for an amount of dissolved resist, and for developer concentration.

18. The computer program product of claim 15 , wherein the instructions are further configured to cause the computer system to:
determine a characteristic of a diffusion in the development of the resist layer as if there were no chemical reaction in the development of the resist layer;
determine a characteristic of a chemical reaction in the development of the resist layer as if there were no diffusion in the development of the resist layer; and
determine the characteristic of the development of the resist layer based on the characteristic of the diffusion and the characteristic of the chemical reaction.

19. The computer program product of claim 15 , wherein the instructions are further configured to cause the computer system to:
determine a characteristic of diffusion in the development of the resist layer in a first direction, as if there were no diffusion in any directions perpendicular to the first direction;
determine a characteristic of diffusion in the development of the resist layer in a second direction as if there were no diffusion in the first direction, the second direction being different from the first direction; and
determine the characteristic of the development of the resist layer based on the characteristic of the diffusion in the first direction and the characteristic of the diffusion in the second direction.

20. The computer program product of claim 15 , wherein the instructions are configured to cause the computer system to adjust a parameter of a device manufacturing process or a device manufacturing apparatus based on the characteristic of the development of the resist layer.

Assignees

• Asml Netherlands Bv

Inventors

• Liu Peng

Classifications

• H10P76/2041

  Photolithographic processes · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• G03C7/388

  Processes for the incorporation in the emulsion of substances liberating photographically active agents or colour-coupling substances; Solvents therefor {(incorporation of additives other than couplers G03C1/005)} · CPC title

• G03F7/706839

  Modelling, e.g. modelling scattering or solving inverse problems · CPC title

• G03F7/705 Primary

  Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions · CPC title