Heat pump device having de-icing function

US10900697B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10900697-B2
Application numberUS-201815860743-A
CountryUS
Kind codeB2
Filing dateJan 3, 2018
Priority dateJan 13, 2017
Publication dateJan 26, 2021
Grant dateJan 26, 2021

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Within a warm circuit, a first heat exchanger is in heat exchanging contact with a heat source. A second heat exchanger is in heat exchanging contact with a space to be heated. Within a cold circuit, a third heat exchanger is in heat exchanging contact with a heat sink. A fourth heat exchanger is in contact with an external region. A valve device is to connect the warm circuit with the cold circuit. An actuating device is to switch the fourth heat exchanger into a de-icing mode. The valve device enables mixing of coolant at least partially from a portion of the warm circuit into the cold circuit.

First claim

Opening claim text (preview).

What is claimed is: 1. A heat pump device comprising: a primary heat pump device having a heat source and a heat sink; a fluid-based coolant secondary device having at least a warm circuit and a cold circuit; a first heat exchanger that is in heat exchanging contact with the heat source of the primary heat pump device; a second heat exchanger that is in heat exchanging contact with a space to be heated and is connectively arranged within the warm circuit; a third heat exchanger that is in heat exchanging contact with the heat sink of the primary heat pump device; a fourth heat exchanger that is in heat exchanging contact with an external area and is connectively arranged within the cold circuit; a valve adapted to connect the warm circuit with the cold circuit to each other; a line portion in which the coolant in the warm circuit and the coolant in the cold circuit are mixed, the line portion located upstream of the fourth heat exchanger; a fan configured to cause air to pass through the fourth heat exchanger; and a controller adapted to switch into a de-icing mode depending on an icing condition of the fourth heat exchanger, wherein the valve enables the coolant from a section of the warm circuit, with which the heat source is in heat exchanging contact, to mix at least partially into the cold circuit, the controller is adapted to reduce a fan speed of the fan when switching to or in the de-icing mode, in the de-icing mode, the controller increases the fan speed of the fan before an end of the de-icing mode to remove water on a surface of the fourth heat exchanger, a part of the cold circuit is: located downstream of the fourth heat exchanger and upstream of the third heat exchanger; and branched at a branch portion into a first passage in which electrical components are provided and a second passage that bypasses the electrical components, the first passage and the second passage rejoining together at a junction portion of the part of the cold circuit, and the controller is configured to cause the coolant to flow through the first passage in the de-icing mode so that the fourth heat exchanger is directly heated by the coolant that has been heated by the electrical components in the first passage. 2. The heat pump device according to claim 1 , wherein the controller is coupled with a pump in the warm circuit and/or in the cold circuit and is adapted to at least intermittently reduce a flow rate of the coolant in a section of the warm circuit and/or the cold circuit, with which the heat source and/or correspondingly the heat sink are in heat exchanging contact, in the de-icing mode. 3. The heat pump device according to claim 1 , wherein the controller is configured to: estimate a hypothetical coolant mixing temperature, which is to be expected when switching into the de-icing mode and when the coolant from the warm circuit mixes into the cold circuit at the time when the warm circuit and the cold circuit are still separated; and take into account the hypothetical coolant mixing temperature at the time of switching into the de-icing mode. 4. A motor vehicle having a heat pump device according to claim 1 , wherein the fourth heat exchanger is arranged as an external heat exchanger. 5. The heat pump device according to claim 1 , further comprising: a detection device to detect an icing condition of the fourth heat exchanger. 6. The heat pump device according to claim 5 , wherein the detection device to detect an icing condition includes at least one of a temperature sensor, a dynamic pressure sensor, a camera, a calculation unit, or a memory unit of historically collected measured values.

Assignees

Inventors

Classifications

  • comprising means for defrosting outside heat exchangers · CPC title

  • F25B1/005Primary

    of the single unit type (F25B1/10 takes precedence) · CPC title

  • Water-cooled condensers · CPC title

  • Controlling the flow of liquid in a heat pump system (controlling the properties of the refrigerant liquid, e.g. pressure or temperature, B60H1/3204) · CPC title

  • comprising a secondary circuit · CPC title

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Frequently asked questions

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What does patent US10900697B2 cover?
Within a warm circuit, a first heat exchanger is in heat exchanging contact with a heat source. A second heat exchanger is in heat exchanging contact with a space to be heated. Within a cold circuit, a third heat exchanger is in heat exchanging contact with a heat sink. A fourth heat exchanger is in contact with an external region. A valve device is to connect the warm circuit with the cold cir…
Who is the assignee on this patent?
Denso Automotive Deutschland Gmbh, Denso Corp
What technology area does this patent fall under?
Primary CPC classification F25B1/005. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Jan 26 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).