Copolymerized high temperature bonding component

Patent metadata

Field	Value
Publication number	US-10899892-B2
Application number	US-201916724110-A
Country	US
Kind code	B2
Filing date	Dec 20, 2019
Priority date	Nov 16, 2015
Publication date	Jan 26, 2021
Grant date	Jan 26, 2021

Abstract

A method for preparing a bonding component comprises mixing a first solution comprising an organofluorine monomer unit with a second solution comprising an organosilicon monomer unit to form, in-situ, a copolymer solution comprising a copolymer of an organofluorine polymer and an organosilicon polymer based on the organofluorine monomer unit and the organosilicon monomer unit. The method further comprises depositing the copolymer solution onto a body to form a film of the copolymer, and curing the film of the copolymer.

First claim

What is claimed is:

1. A method for preparing a bonding component comprising:
mixing a first solution comprising an organofluorine monomer unit with a second solution comprising an organosilicon monomer unit to form, in-situ, a copolymer solution comprising a copolymer of an organofluorine polymer and an organosilicon polymer based on the organofluorine monomer unit and the organosilicon monomer unit;
depositing the copolymer solution onto a body to form a film of the copolymer; and
curing the film of the copolymer.

2. The method of claim 1 , wherein depositing the copolymer solution onto the body comprises performing one of a spin casting, drop casting, spray coating, dip coating or doctor blade technique.

3. The method of claim 1 , wherein curing the film of the copolymer comprises using one of temperature, UV light source, high pressure, plasma, or a combination thereof.

4. The method of claim 1 , wherein the bonding component binds dissimilar materials and is resistant to temperatures up to about 300° C.

5. The method of claim 1 , wherein the organofluorine polymer is selected from the group consisting of a fluoropolymer, a perfluoropolymer, and combinations thereof.

6. The method of claim 1 , wherein the organosilicon polymer comprises polydimethyl siloxane.

7. The method of claim 1 , wherein the organofluorine polymer and the organosilicon polymer are chemically bound as a block copolymer in the film of the copolymer.

8. The method of claim 1 , further comprising:
bonding a ceramic material to a metal material by the film of the copolymer.

9. The method of claim 1 , wherein a first amount of the organofluorine polymer is greater than a second amount of the organosilicon polymer in the copolymer.

10. The method of claim 9 , wherein the film of the copolymer has a plasma erosion resistance that is substantially similar to a plasma erosion resistance of the organofluorine polymer.

11. The method of claim 1 , wherein a second amount of the organosilicon polymer is greater than a first amount of the organofluorine polymer in the copolymer.

12. The method of claim 11 , wherein the film of the copolymer has a first mechanical property that is substantially similar to a second mechanical property of an unbound organosilicon polymer, wherein the first mechanical property and the second mechanical property comprise at least one of the following: density, Young's modulus, Poisson ratio, stiffness constant, tensile or fracture strength, specific heat, thermal conductivity, or magnetic permeability.

13. The method of claim 1 , wherein the copolymer comprises an alternating copolymer or a periodic copolymer of the organofluorine polymer and the organosilicon polymer.

14. The method of claim 1 , wherein the copolymer comprises a statistical copolymer or a branched copolymer of the organofluorine polymer and the organosilicon polymer.

15. The method of claim 1 , wherein the copolymer comprises a linear copolymer of the organofluorine polymer and the organosilicon polymer.

16. The method of claim 1 , wherein the organofluorine polymer and the organosilicon polymer are crosslinked in the film of the copolymer.

17. A method for preparing an adhesive comprising:
forming a solid three dimensional porous organosilicon polymer based network, said solid three dimensional porous organosilicon polymer based network having a surface;
contacting a solution comprising an organofluorine monomer unit with said surface, wherein the solution penetrates pores in the solid three dimensional porous organosilicon polymer based network; and
crosslinking the organofluorine monomer unit with said solid three dimensional porous organosilicon polymer based network to form a copolymer.

18. The method of claim 17 , wherein the copolymer comprises a first amount of organofluorine polymer and a second amount of organosilicon polymer,
wherein the second amount is greater than the first amount,
wherein the organofluorine polymer is selected from the group consisting of a fluoropolymer, a perfluoropolymer, and combinations thereof, and
wherein the organosilicon polymer comprises polydimethyl siloxane.

19. The method of claim 17 , wherein the adhesive binds dissimilar materials.

20. The method of claim 17 , wherein the adhesive is resistant to temperatures up to about 300° C.

Assignees

• Applied Materials Inc

Inventors

• Sun Jennifer Y
• Banda Sumanth

Classifications

• C08L27/12

  containing fluorine atoms · CPC title

• C08G77/50

  by carbon linkages · CPC title

• C08G77/385

  containing halogens · CPC title

• C08L2205/04

  containing interpenetrating networks · CPC title

• C09J127/12

  containing fluorine atoms · CPC title