Laser machining device and laser machining method

Patent metadata

Field	Value
Publication number	US-10898975-B2
Application number	US-201615753311-A
Country	US
Kind code	B2
Filing date	Aug 8, 2016
Priority date	Aug 18, 2015
Publication date	Jan 26, 2021
Grant date	Jan 26, 2021

Abstract

A laser processing device includes: a support table; a laser light source; a converging optical system; an imaging unit configured to image a front surface of an object; a candidate line setting unit configured to set a plurality of candidate lines; an operation controller configured to control operation of at least one of the support table, the laser light source, and the converging optical system such that a modified region is formed inside the object along each of the plurality of candidate lines, and a crack reaches the front surface of the object from the modified region; and a reference line setting unit configured to set a reference line determined as a line indicating a crystal orientation of the object on the basis of an image of the crack.

First claim

The invention claimed is:

1. A laser processing device comprising:
a support table configured to support an object to be processed including a substrate made of a crystalline material;
a laser light source configured to emit laser light;
a converging optical system configured to converge the light emitted from the laser light source at the object to be processed supported by the support table;
an imaging unit configured to image a front surface of the object to be processed supported by the support table;
a candidate line setting unit configured to set, for the object to be processed, a plurality of candidate lines extending in mutually different directions;
an operation controller configured to control operation of at least one of the support table, the laser light source, and the converging optical system such that a modified region is formed inside the substrate along each of the plurality of candidate lines, and a crack reaches the front surface of the object to be processed from the modified region; and
a reference line setting unit configured to set, for the object to be processed, a reference line determined as a line indicating a crystal orientation of the substrate on the basis of an image of the crack imaged by the imaging unit.

2. The laser processing device according to claim 1 , wherein
the candidate line setting unit sets, for the object to be processed, a predetermined number of the candidate lines extending in mutually different predetermined directions, and
the reference line setting unit sets, for the object to be processed, as the reference line, a candidate line having a smallest degree of deflection of the crack out of the predetermined number of candidate lines.

3. The laser processing device according to claim 2 , wherein
the candidate line setting unit sets, for the object to be processed, the predetermined number of the candidate lines extending in mutually different predetermined directions, using an orientation flat provided to the object to be processed as a reference.

4. The laser processing device according to claim 1 , wherein
the candidate line setting unit sets the plurality of candidate lines sequentially for the object to be processed, until a degree of deflection of the crack falls within a predetermined range, on the basis of the image of the crack imaged by the imaging unit, and
the reference line setting unit sets, for the object to be processed, as the reference line, one of the candidate lines of which the degree of deflection of the crack falls within the predetermined range.

5. The laser processing device according to claim 4 , wherein
the candidate line setting unit sets an initial candidate line for the object to be processed, using an orientation flat provided to the object to be processed as a reference.

6. The laser processing device according to claim 4 , further comprising
a storage unit storing in advance a relationship between an angle formed by the candidate line with respect to the crystal orientation and a degree of deflection of the crack.

7. The laser processing device according to claim 1 , wherein
the candidate line setting unit sets, for the object to be processed, the plurality of candidate lines having different angles formed with respect to a reference direction,
the reference line setting unit detects an inclination direction in which the crack of each of the plurality of candidate lines is inclined with respect to corresponding one of the candidate lines, and
the reference line setting unit sets the reference line for the object to be processed, on the basis of a first candidate line of which an inclination direction of the crack is in one side of corresponding one of the candidate lines and an angle formed with respect to the reference direction is the largest or smallest, and a second candidate line of which an inclination direction of the crack is in another side of corresponding one of the candidate lines and an angle formed with respect to the reference direction is the smallest or largest, out of the plurality of candidate lines.

8. The laser processing device according to claim 1 , further comprising
a display unit configured to display the image of the crack imaged by the imaging unit.

9. The laser processing device according to claim 1 , wherein
the operation controller controls operation of at least one of the support table, the laser light source, and the converging optical system such that a reference mark indicating the crystal orientation is formed on the object to be processed along the reference line set by the reference line setting unit.

10. The laser processing device according to claim 1 , further comprising
a line to cut setting unit configured to set, for the object to be processed, a line to cut extending in a direction parallel to the reference line set by the reference line setting unit, wherein
the operation controller controls operation of at least one of the support table, the laser light source, and the converging optical system such that the modified region is formed inside the substrate along the line to cut set by the line to cut setting unit.

11. A laser processing method comprising:
a first step of setting a plurality of candidate lines extending in mutually different directions, for an object to be processed including a substrate made of a crystalline material;
a second step of converging laser light at the object to be processed such that a modified region is formed inside the substrate along each of the plurality of candidate lines, and a crack reaches a front surface of the object to be processed from the modified region; and
a third step of setting, for the object to be processed, a reference line determined as a line indicating a crystal orientation of the substrate on the basis of a state of the crack.

12. The laser processing method according to claim 11 , wherein,
in the first step, a predetermined number of the candidate lines extending in mutually different predetermined directions are set for the object to be processed, and
in the third step, out of the predetermined number of candidate lines, a candidate line having a smallest degree of deflection of the crack is set for the object to be processed as the reference line.

13. The laser processing method according to claim 11 , wherein,
in the first step, on the basis of a state of the crack, the plurality of candidate lines is sequentially set for the object to be processed, until a degree of deflection of the crack falls within a predetermined range, and
in the third step, one of the candidate lines of which the degree of deflection of the crack falls within the predetermined range is set for the object to be processed as the reference line.

14. The laser processing method according to claim 11 , wherein,
in the first step,
the plurality of candidate lines having different angles formed with respect to a reference direction is set for the object to be processed, and
in the third step,
an inclination direction in which the crack of each of the plurality of candidate lines is inclined with respect to corresponding one of the candidate lines, is detected, and
the reference line is set for the object to be processed, on the basis of a first candidate line of which an inclination direction of the crack is in one side of corresponding one of the candidate lines and an angle formed with respect to the reference direction is the largest or smallest, and a second candidate line of which an inclination direction of the crack is in another side of corresponding one of the candidate lines and an angle formed with respect to the reference direct

Assignees

• Hamamatsu Photonics Kk

Inventors

• Okuma Junji
• SUGIMOTO Yo

Classifications

• B23K26/032

  using optical means · CPC title

• B23K26/0622

  by shaping pulses · CPC title

• B23K26/083

  Devices involving movement of the workpiece in at least one axial direction · CPC title

• B23K26/0006

  taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence) · CPC title

• B23K26/06

  Shaping the laser beam, e.g. by masks or multi-focusing · CPC title