Expandable implant and implant system

US10898199B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10898199-B2
Application numberUS-201815984003-A
CountryUS
Kind codeB2
Filing dateMay 18, 2018
Priority dateDec 16, 2010
Publication dateJan 26, 2021
Grant dateJan 26, 2021

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An embodiment of the invention includes an expandable implant to endovascularly embolize an anatomical void or malformation, such as an aneurysm. An embodiment is comprised of a chain or linked sequence of expandable polymer foam elements. Another embodiment includes an elongated length of expandable polymer foam coupled to a backbone. Another embodiment includes a system for endovascular delivery of an expandable implant (e.g., shape memory polymer) to embolize an aneurysm. The system may include a microcatheter, a lumen-reducing collar coupled to the distal tip of the microcatheter, a flexible pushing element detachably coupled to an expandable implant, and a flexible tubular sheath inside of which the compressed implant and pushing element are pre-loaded. Other embodiments are described herein.

First claim

Opening claim text (preview).

What is claimed is: 1. A system comprising: a metal wire that is coiled; a jointless monolithic cured first shape memory polymer (SMP) expandable open-cell foam, wherein the first SMP: (a)(i) is on the metal wire, and (a)(ii) includes primary and secondary states; and a second SMP including primary and secondary states; wherein: (b) in response to thermal stimulus the second SMP is configured to change from the second state to the primary state, (c) the first SMP is included in a first layer and the second SMP is included in a second layer, (d) the second SMP chemically bonds to both a metal surface of the metal wire and to the first SMP, (e) the second layer is directly between the metal wire and the first layer, and (f) the second SMP directly contacts both the metal surface and the first SMP. 2. The system of claim 1 wherein the first SMP completely surrounds the metal wire within a plane that is orthogonal to a long axis of the metal wire. 3. The system of claim 2 wherein the first SMP covers at least 50% of a total length of the metal wire. 4. The system of claim 1 comprising a pushing element detachably coupled to the metal wire. 5. The system of claim 4 comprising a flexible tubular sheath. 6. The system of claim 5 wherein the pushing element, the metal wire, the first SMP, and the second SMP are collectively included inside the flexible tubular sheath. 7. The system of claim 4 wherein the first SMP includes a thermoset SMP and the second SMP includes an additional thermoset SMP. 8. The system of claim 1 comprising a flexible tubular sheath. 9. The system of claim 8 wherein: the metal wire is included within the flexible tubular sheath; the metal wire is configured to form a helical shape after removal from the flexible tubular sheath. 10. The system of claim 1 wherein the first SMP has a first glass transition temperature (Tg) and the second SMP has a second Tg, the second Tg being unequal to the first Tg. 11. A system comprising: a metal wire that is coiled; a jointless monolithic cured first shape memory polymer (SMP) expandable open-cell foam on the metal wire, the first SMP including primary and secondary states; and a second SMP including primary and secondary states; wherein (a) in response to thermal stimulus the second SMP is configured to change from the second state to the primary state, (b) the first SMP is included in a first layer and the second SMP is included in a second layer, (c) the second SMP is chemically bonded to both a metal surface of the metal wire and to the first SMP, (d) the second layer is directly between the metal wire and the first layer, and (e) the second SMP directly contacts both the metal surface and the first SMP. 12. The system of claim 11 wherein the first SMP covers at least 50% of the metal wire. 13. The system of claim 11 comprising a pushing element detachably coupled to the metal wire. 14. The system of claim 13 comprising a flexible tubular sheath, wherein the pushing element, the metal wire, the first SMP, and the second SMP are collectively included within the flexible tubular sheath. 15. The system of claim 13 wherein the pushing element is a wire. 16. The system of claim 11 wherein the first SMP includes a thermoset SMP. 17. The system of claim 16 wherein the second SMP includes an additional thermoset SMP. 18. The system of claim 11 wherein the first SMP has a first glass transition temperature (Tg) and the second SMP has a second Tg, the second Tg being unequal to the first Tg. 19. The system of claim 11 comprising a flexible tubular sheath. 20. The system of claim 19 wherein: the metal wire is included within the flexible tubular sheath; and the metal wire is configured to form a helical shape after removal from the flexible tubular sheath.

Assignees

Inventors

Classifications

  • having a string of elements connected to each other · CPC title

  • Coils or wires · CPC title

  • Details concerning the detachment of the occluding device from the introduction device · CPC title

  • having a pre-set deployed three-dimensional shape (methods of manufacturing A61B2017/00526) · CPC title

  • within an aneurysm · CPC title

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10898199B2 cover?
An embodiment of the invention includes an expandable implant to endovascularly embolize an anatomical void or malformation, such as an aneurysm. An embodiment is comprised of a chain or linked sequence of expandable polymer foam elements. Another embodiment includes an elongated length of expandable polymer foam coupled to a backbone. Another embodiment includes a system for endovascular deliv…
Who is the assignee on this patent?
L Livermore Nat Security Llc, Texas A & M Univ Sys
What technology area does this patent fall under?
Primary CPC classification A61B17/12113. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Jan 26 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).