Integrated circuit with laminated magnetic core inductor including a ferromagnetic alloy

Patent metadata

Field	Value
Publication number	US-10893609-B2
Application number	US-201816007158-A
Country	US
Kind code	B2
Filing date	Jun 13, 2018
Priority date	Sep 11, 2012
Publication date	Jan 12, 2021
Grant date	Jan 12, 2021

Abstract

A structure includes a semiconductor integrated circuit comprising a multilevel wiring network and an inductor integrated into the multilevel wiring network. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic layer comprises a ferromagnetic alloy having an iron composition of about 10 atomic percent to about 90 atomic percent.

First claim

What is claimed is:

1. A microelectronic device comprising:
a semiconductor integrated circuit, wherein said semiconductor integrated circuit comprises a multilevel wiring network, wherein said semiconductor integrated circuit operates with a plurality of DC supply voltages; and
a DC to DC voltage converter which delivers at least one of said DC supply voltages for said semiconductor integrated circuit, said DC to DC voltage converter comprising an inductor, and wherein said inductor is integrated thereinto said multilevel wiring network, wherein said inductor comprises a planar magnetic core and a conductive winding, wherein said conductive winding turns around in generally spiral manner on the outside of said planar magnetic core, said planar magnetic core having a laminated configuration comprising at least one magnetic layer and at least one current rectifying layer, wherein the at least one magnetic layer comprises a ferromagnetic alloy having an iron composition of about 10 atomic percent to about 90 atomic percent,
wherein:
the at least one current rectifying layer comprises a p-type semiconductor, the p-type semiconductor having a first work function less than a second work function of the ferromagnetic alloy, and
the laminated configuration further comprises an interface metal layer disposed on said p-type semiconductor, the interface layer having a work function less than said first work function of said p-type semiconductor.

2. The microelectronic device of claim 1 , further comprising a second magnetic layer disposed on said interface metal layer, the second magnetic layer comprising the ferromagnetic alloy.

3. The microelectronic device of claim 1 , wherein the at least one current rectifying layer further comprises an n-type semiconductor, the n-type semiconductor having a first work function greater than the second work function of the ferromagnetic alloy.

4. The microelectronic device of claim 3 , wherein the work function of the interface layer is greater than said first work function of said n-type semiconductor.

5. The microelectronic device of claim 4 , further comprising a second magnetic layer disposed on said interface metal layer, the second magnetic layer comprising the ferromagnetic alloy.

6. The microelectronic device of claim 1 , wherein the at least one magnetic layer further comprises at least one additional ferromagnetic material that does not include iron.

7. The microelectronic device of claim 6 , wherein the at least one additional ferromagnetic material includes cobalt, nickel, or a combination thereof.

8. The microelectronic device of claim 1 , wherein the inductor and at least a portion of the semiconductor integrated circuit form a transformer.

9. The microelectronic device of claim 1 , wherein the inductor and at least a portion of the semiconductor integrated circuit form a power converter.

10. The microelectronic device of claim 1 , wherein the inductor and at least a portion of the semiconductor integrated circuit form a microprocessor.

11. The microelectronic device of claim 1 , wherein the at least one magnetic layer comprises an anisotropic magnetic material having a hard axis of magnetization that is at least partially aligned with an axis of the conductive winding, the conductive winding extending along the axis of the conductive winding.

12. A microelectronic device comprising:
a semiconductor integrated circuit, wherein said semiconductor integrated circuit comprises a multilevel wiring network, wherein said semiconductor integrated circuit operates with a plurality of DC supply voltages; and
a DC to DC voltage converter which delivers at least one of said DC supply voltages for said semiconductor integrated circuit, said DC to DC voltage converter comprising an inductor, and wherein said inductor is integrated thereinto said multilevel wiring network, wherein said inductor comprises a planar magnetic core and a conductive winding, wherein said conductive winding turns around in generally spiral manner on the outside of said planar magnetic core, said planar magnetic core having a laminated configuration comprising at least one magnetic layer and at least one current rectifying layer, wherein the at least one magnetic layer comprises a ferromagnetic alloy having an iron composition of about 10 atomic percent to about 90 atomic percent,
wherein:
the at least one current rectifying layer comprises an n-type semiconductor, the n-type semiconductor having a first work function greater than a second work function of the ferromagnetic alloy, and
the laminated configuration further comprises an interface metal layer disposed on said n-type semiconductor, the interface layer having a work function greater than said first work function of said n-type semiconductor.

13. The microelectronic device of claim 12 , wherein the at least one current rectifying layer further comprises a p-type semiconductor, the p-type semiconductor having a first work function less than a second work function of the ferromagnetic alloy.

14. The microelectronic device of claim 13 , wherein the work function of the interface layer is less than said first work function of said p-type semiconductor.

15. The microelectronic device of claim 14 , further comprising a second magnetic layer disposed on said interface metal layer, the second magnetic layer comprising the ferromagnetic alloy.

16. The microelectronic device of claim 12 , further comprising a second magnetic layer disposed on said interface metal layer, the second magnetic layer comprising the ferromagnetic alloy.

17. The microelectronic device of claim 12 , wherein the at least one magnetic layer further comprises at least one additional ferromagnetic material that does not include iron.

18. The microelectronic device of claim 17 , wherein the at least one additional ferromagnetic material includes cobalt, nickel, or a combination thereof.

19. The microelectronic device of claim 12 , wherein the inductor and at least a portion of the semiconductor integrated circuit form a transformer.

20. The microelectronic device of claim 12 , wherein the inductor and at least a portion of the semiconductor integrated circuit form a power converter.

21. The microelectronic device of claim 12 , wherein the inductor and at least a portion of the semiconductor integrated circuit form a microprocessor.

22. The microelectronic device of claim 12 , wherein the at least one magnetic layer comprises an anisotropic magnetic material having a hard axis of magnetization that is at least partially aligned with an axis of the conductive winding, the conductive winding extending along the axis of the conductive winding.

Assignees

• Ferric Inc

Inventors

• Sturcken Noah
• Davies Ryan
• Lekas Michael

Classifications

• H01F17/0033 Primary

  with the coil helically wound around a magnetic core · CPC title

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H05K1/165

  incorporating printed inductors · CPC title

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title

• H05K2201/1003

  Non-printed inductor · CPC title