Electronic device comprising a support substrate and an encapsulating cover for an electronic component

Patent metadata

Field	Value
Publication number	US-10892201-B2
Application number	US-202016788627-A
Country	US
Kind code	B2
Filing date	Feb 12, 2020
Priority date	Sep 18, 2017
Publication date	Jan 12, 2021
Grant date	Jan 12, 2021

Abstract

A support substrate has a face above which at least one electronic component is fixed. A peripheral area of the face includes an annular local metal layer. An encapsulating cover for the electronic component includes a peripheral wall having an end edge that is mounted above the peripheral area. The annular metal local layer includes, at the periphery thereof, a series of spaced-apart teeth with notches formed therebetween. The teeth extend as far as the peripheral edge of the support substrate.

First claim

The invention claimed is:

1. A method, comprising:
forming annular metal local layers on a face of a support substrate, the annular metal local layers surrounding locations for receiving and mounting an electronic component;
forming a plurality of notches in the annular metal local layers to define a plurality of spaced-apart teeth;
mounting a plurality of encapsulating covers to the support substrate, each encapsulating cover mounted above a corresponding one of the locations with an end edge of a peripheral wall of each encapsulating cover attached to the annular metal local layer; and
then cutting, between and at a distance from adjacent ones of the encapsulating covers, along the annular metal local layers and through the support substrate and the teeth of said annular local metal layers to obtain a plurality of individual electronic devices.

2. The method of claim 1 , wherein forming the plurality of notches comprises forming each notch to be surrounded by portions of the annular metal local layers.

3. The method of claim 1 , wherein mounting the plurality of encapsulating covers comprises aligning the end edge of the peripheral wall of each encapsulation cover with the notches.

4. A method, comprising:
forming an annular metal local layer on a face of a support substrate, the annular metal local layer surrounding a location for receiving and mounting an electronic component;
forming a plurality of notches in the annular metal local layer;
mounting an encapsulating cover to the support substrate over said location, wherein said encapsulating cover includes a front wall and a peripheral wall extending from a surface of the front wall, wherein mounting comprises attaching an end edge of said peripheral wall of the encapsulating cover to the annular metal local layer; and
cutting along said notches and at a distance from an outer peripheral surface of the peripheral wall through the annular metal local layer and the support substrate to define a plurality of teeth in the annular metal local layer that are spaced apart from each other by notches.

5. The method of claim 4 , wherein forming the plurality of notches comprises forming each notch to be surrounded by portions of the annular metal local layer.

6. The method of claim 4 , wherein mounting the encapsulating cover comprises aligning the end edge of the peripheral wall with the notches.

7. The method of claim 1 , wherein each encapsulating cover includes a front wall and said peripheral wall extending from a surface of the front wall.

8. A method, comprising:
forming annular metal local layers on a face of a support substrate, the annular metal local layers surrounding locations for receiving and mounting an electronic component;
with respect to each portion of the annular metal local layers positioned between adjacent locations, forming in said portion a plurality of notches to define a plurality of spaced-apart teeth;
mounting a plurality of encapsulating covers to the support substrate, each encapsulating cover mounted above a corresponding one of the locations with an end edge of a peripheral wall of each encapsulating cover attached to the annular metal local layer; and
then cutting, between and at a distance from adjacent ones of the encapsulating covers, along the annular metal local layers and through the support substrate and the teeth of said annular local metal layers to obtain a plurality of individual electronic devices.

9. The method of claim 8 , wherein forming the plurality of notches comprises forming each notch to be surrounded by metal of said portion of the annular metal local layers.

10. The method of claim 8 , wherein mounting the plurality of encapsulating covers comprises aligning the end edge of the peripheral wall of each encapsulation cover with the notches.

11. The method of claim 8 , wherein each encapsulating cover includes a front wall and said peripheral wall extending from a surface of the front wall.

Assignees

• Stmicroelectroncis Grenoble 2 Sas
• Stmicroelectronics Malta Ltd
• St Microelectronics Grenoble 2

Inventors

• Lopez Jerome
• Duca Roseanne

Classifications

• H10W95/00

  Packaging processes not covered by the other groups of this subclass · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W76/60 Primary

  Seals · CPC title

• H01L23/49838

  Electricity · mapped topic