Heat sinks with vibration enhanced heat transfer

Patent metadata

Field	Value
Publication number	US-10890387-B2
Application number	US-201916664504-A
Country	US
Kind code	B2
Filing date	Oct 25, 2019
Priority date	Oct 25, 2018
Publication date	Jan 12, 2021
Grant date	Jan 12, 2021

Abstract

The heat sinks with vibration enhanced heat transfer are heat sinks formed from a first body of high thermal conductivity material. The first body of high thermal conductivity material is received within a thermally conductive housing such that at least one contact face of the first body of high thermal conductivity material is exposed, forming a direct contact interface with a heat source requiring cooling. The heat source requiring cooling may be a liquid heat source, including but not limited to water. The thermally conductive housing is disposed such that at least one contact face of the thermally conductive housing is in direct contact with the vibrating base. The vibrating base applies oscillating waves to the heat sink, thereby increasing heat transfer between the heat source and the heat sink.

First claim

We claim:

1. A heat sink with vibration enhanced heat transfer adapted for cooling of a liquid heat source, comprising:
a thermally conductive housing having at least one contact face and at least one wall;
a first body made of a thermal conductive phase change material disposed within the thermally conductive housing, the first body of thermal conductivity material having a first at contact face disposed for direct contact with a heat source to be cooled at one end of the housing and a second contact face located at a first contact face of the housing; and
a vibrating base, the vibrating base disposed in direct contact with an entire second contact face of the thermally conductive housing; wherein the vibrating base is configured to propagate oscillating waves through the thermally conductive housing and the second contact face of the first body of thermally conductive material to reach the first contact face disposed for direct contact with the heat source; and
at least one thermally conductive stud having opposed first and second ends, wherein the first end of the stud is affixed within the second contact face of the thermally conductive housing and in direct contact with the vibrating base and the second end is positioned within the first body.

2. The heat sink as recited in claim 1 , further comprising a plurality of thermally conductive fins mounted on at least a portion of the at least one wall of the thermally conductive housing.

3. The heat sink as recited in claim 1 , further comprising at least one internal chamber within the at least one thermally conductive stud, and a body of thermal storage capacity material within the at least one internal chamber.

4. The heat sink as recited in claim 1 , further comprising a plurality of fins mounted on at least a portion of the at least one thermally conductive stud.

5. The heat sink as recited in claim 1 , further comprising a heat source within the housing and in direct contact with the first body of thermal conductivity material, wherein the heat source is a thermally conductive material.

6. The heat sink as recited in claim 1 , wherein the first body of thermal conductivity material is a solid phase change material.

7. The heat sink as recited in claim 1 , wherein the first body of thermal conductivity material is a liquid.

8. The heat sink as recited in claim 2 , wherein the plurality of fins are constructed of a material selected from the group consisting of a first material having a first stiffness and a second material having a second stiffness less than the first stiffness, and a combination of materials having first and second stiffnesses.

9. The heat sink as recited in claim 4 , wherein the plurality of fins are constructed of a material selected from the group consisting of a first material having a first stiffness and a second material having a second stiffness less than the first stiffness, and a combination of materials having first and second stiffnesses.

10. The heat sink as recited in claim 1 , wherein the at least one thermally conductive stud is vertically disposed within the housing.

11. The heat sink as recited in claim 7 , wherein the liquid first body of thermal conductivity material has a first predetermined density and the liquid heat source has a second predetermined density lower than the first predetermined density.

12. The heat sink as recited in claim 1 , wherein the vibrating base has a level of frequency between 20 Hz and 50 Hz and an amplitude within the range of 0.3 mm and 0.7 mm.

Assignees

• Univ United Arab Emirates

Inventors

• Al Omari Salah Addin Burhan
• Elnajjar Emad

Classifications

• H10W40/77

  Auxiliary members characterised by their shape · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/735

  by melting or evaporation of solids · CPC title

• Y02E60/14

  Thermal energy storage · CPC title

• F28D2021/0029

  Heat sinks · CPC title