Photosensitive resin composition, complex, laminated structure and display device, and electronic device including the same

Patent metadata

Field	Value
Publication number	US-10889755-B2
Application number	US-201715819556-A
Country	US
Kind code	B2
Filing date	Nov 21, 2017
Priority date	Nov 22, 2016
Publication date	Jan 12, 2021
Grant date	Jan 12, 2021

Abstract

A photosensitive resin composition includes (A) a photo-conversion material; (B) a metal-containing compound; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; and (E) a solvent, wherein the metal-containing compound includes a *—S-M-S—* (M is Zn, Al, Mg, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Sr, Y, Zr, Nb, Mo, Cd, In, Ba, Au, Hg, or Tl) structure, a complex including a polymer matrix in which a photo-conversion material is dispersed, wherein the polymer matrix includes a *—S-M-S—* (M is Zn, Al, Mg, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Sr, Y, Zr, Nb, Mo, Cd, In, Ba, Au, Hg, or Tl) structure and an ester linking group, a laminated structure including the complex, and a display device and an electronic device including the laminated structure.

First claim

What is claimed is:

1. A photosensitive resin composition, comprising
(A) a photo-conversion material;
(B-1) a metal-containing compound;
(C) a photopolymerizable monomer;
(D) a photopolymerization initiator; and
(E) a solvent,
wherein the metal-containing compound comprises a moiety represented by *—S-M-S—* wherein M is Zn, Al, Mg, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Ga, Sr, Y, Zr, Nb, Mo, Cd, In, Ba, Au, Hg, or Tl, and
wherein the metal-containing compound has a weight average molecular weight of greater than or equal to about 1,000 grams per mole and less than or equal to about 15,000 grams per mole.

2. The photosensitive resin composition of claim 1 , wherein the metal-containing compound comprises a structure represented by Chemical Formula A:

wherein, in Chemical Formula A,
M is Zn, Al, Mg, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Ga, Sr, Y, Zr, Nb, Mo, Cd, In, Ba, Au, Hg, or Tl, and
L′ and L″ are the same or different, and are independently a single bond or a substituted or unsubstituted C1 to C10 alkylene group.

3. The photosensitive resin composition of claim 1 , wherein the metal-containing compound comprises a structural unit represented by Chemical Formula B:

wherein, in Chemical Formula B,
L a to L d are the same or different, and are each independently a single bond or a substituted or unsubstituted C1 to C10 alkylene group, and
R a and R b are the same or different, and are independently a hydrogen atom, a substituted or unsubstituted C1 to C10 alkyl group, or represented by Chemical Formula C:

wherein, in Chemical Formula C,
L e to L g are the same or different, and are each independently a single bond or a substituted or unsubstituted C1 to C10 alkylene group, and
R 0 is a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C7 to C20 bicycloalkyl group.

4. The photosensitive resin composition of claim 1 , wherein the metal-containing compound comprises a structural unit represented by Chemical Formula 1:

wherein, in Chemical Formula 1,
L 1 to L 10 are the same or different, and are each independently a single bond or a substituted or unsubstituted C1 to C10 alkylene group,
R 1 and R 2 are the same or different, and are independently a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C7 to C20 bicycloalkyl group, and
M is Zn, Al, Mg, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Sr, Y, Zr, Nb, Mo, Cd, In, Ba, Au, Hg, or Tl.

5. The photosensitive resin composition of claim 1 , wherein the M is Zn.

6. The photosensitive resin composition of claim 4 , wherein the R 1 and R 2 are the same or different, and are independently represented by Chemical Formula 2A or Chemical Formula 2B:

wherein, in Chemical Formula 2A and Chemical Formula 2B,
L 11 is a substituted or unsubstituted C1 to C10 alkylene group,
R 3 is a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C7 to C20 bicycloalkyl group, and
m1 is an integer of 0 or 1.

7. The photosensitive resin composition of claim 6 , wherein the R 1 and R 2 are the same or different, and are independently represented by one of Chemical Formula 2-1 to Chemical Formula 2-3:

wherein, in Chemical Formula 2-1 to Chemical Formula 2-3,
L 12 to L 15 are the same or different, and are each independently a substituted or unsubstituted C1 to C10 alkylene group,
R 4 to R 9 are the same or different, and are each independently a substituted or unsubstituted C1 to C20 alkyl group, and
m2 to m4 are the same or different, and are each independently an integer of 0 or 1.

8. The photosensitive resin composition of claim 1 , wherein the metal-containing compound is represented by Chemical Formula 3:

wherein, in Chemical Formula 3,
L 1 to L 10 and L 16 to L 25 are the same or different, and are each independently a single bond or a substituted or unsubstituted C1 to C10 alkylene group,
R 1 , R 2 , R 10 , and R 11 are the same or different, and are each independently a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C7 to C20 bicycloalkyl group,
M is Zn, Al, Mg, Ca, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Sr, Y, Zr, Nb, Mo, Cd, In, Ba, Au, Hg, or Tl,
X is F, Cl, Br, or I, and
n is an integer ranging from 1 to 100.

9. The photosensitive resin composition of claim 8 , wherein the M is Zn.

10. The photosensitive resin composition of claim 8 , wherein the R 1 , R 2 , R 10 , and R 11 are the same or different, and are each independently represented by Chemical Formula 2A or Chemical Formula 2B:

wherein, in Chemical Formula 2A and Chemical Formula 2B,
L 11 is a substituted or unsubstituted C1 to C10 alkylene group,
R 3 is a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, or a substituted or unsubstituted C7 to C20 bicycloalkyl group, and
m1 is an integer of 0 or 1.

11. The photosensitive resin composition of claim 10 , wherein the R 1 , R 2 , R 10 , and R 11 are the same or different, and are each independently represented by one of Chemical Formula 2-1 to Chemical Formula 2-3:

wherein, in Chemical Formula 2-1 to Chemical Formula 2-3,
L 12 to L 15 are the same or different, and are each independently a substituted or unsubstituted C1 to C10 alkylene group,
R 4 to R 9 are the same or different, and are each independently a substituted or unsubstituted C1 to C10 alkyl group, and
m2 to m4 are the same or different, and are each independently an integer of 0 or 1.

12. The photosensitive resin composition of claim 1 , wherein the metal-containing compound surrounds a surface of the photo-conversion material.

13. The photosensitive resin composition of claim 1 , wherein the photo-conversion material comprises a sulfur atom on a surface of the photo-conversion material and a metal in the metal-containing compound is bound to the sulfur atom on the surface of the photo-conversion material.

14. The photosensitive resin composition of claim 1 , wherein the photosensitive resin composition further comprises a carboxylic acid group-containing binder polymer.

15. The photosensitive resin

Assignees

• Samsung Electronics Co Ltd
• Samsung Sdi Co Ltd
• Samsung Display Co Ltd

Inventors

• Youn Jinsuop
• Kwon Ha Il
• Kim Misun
• Ahn Jooyeon
• Yang Hyeyeon
• LEE Bumjin
• Lee Jongmin
• Jun Shin Ae
• Han Hyunjoo

Classifications

• G03F7/032

  with binders · CPC title

• G02F1/133528

  Polarisers · CPC title

• G02F1/133509

  Filters, e.g. light shielding masks · CPC title

• G03F7/028

  with photosensitivity-increasing substances, e.g. photoinitiators · CPC title

• G03F7/027

  Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence) · CPC title