Display panel, manufacturing method thereof, and display device

Patent metadata

Field	Value
Publication number	US-10886500-B2
Application number	US-201816157865-A
Country	US
Kind code	B2
Filing date	Oct 11, 2018
Priority date	Oct 19, 2017
Publication date	Jan 5, 2021
Grant date	Jan 5, 2021

Abstract

The present disclosure relates to a display panel, a manufacturing method thereof, and a display device. The display panel comprises a base substrate, a package cover plat disposed to be parallel to the base substrate, a light-emitting layer between the substrate and the package cover plate, and a main package part, which encapsulates a side surface of the base substrate and a side surface of the package cover plate.

First claim

What is claimed is:

1. A manufacturing method of a display panel, comprising:
providing a base substrate;
forming a light-emitting layer on a surface of the base substrate;
providing a package cover plate disposed to be parallel to the base substrate;
using a main package part to encapsulate a side surface of a circumferential edge of the base substrate on which the light-emitting layer is formed and a side surface of a circumferential edge of the package cover plate together, such that the light-emitting layer is located between the base substrate and the package cover plate,
wherein the main package part is formed by a non-conductive encapsulant, and the main package part is configured not to contact with the light-emitting layer,
wherein the main package part comprises a first package portion and a second package portion;
the second package portion is located between the base substrate and the package cover plate, an upper surface of the second package portion is in contact with the package cover plate, and a lower surface of the second package portion is in contact with the base substrate, and
the first package portion is respectively engaged with the side surface of the base substrate, the side surface of the package cover plate, and an outer-side surface of the second package portion;
wherein before using the main package part to encapsulate the base substrate on which the light-emitting layer is formed and the package cover plate together, and after providing the package cover plate, the manufacturing method of a display panel further comprises the following step:
encapsulating the base substrate on which the light-emitting layer is formed and the package cover plate together by an auxiliary package part, such that an upper surface of the auxiliary package part is in contact with the package cover plate and a lower surface of the auxiliary package part is in contact with the base substrate, and an outer-side surface of the auxiliary package part faces with an inner-side surface of the second package portion, and an inner-side surface of the auxiliary package part faces with a side surface of the light-emitting layer;
wherein encapsulating the base substrate on which the light-emitting layer is formed and the package cover plate together by using the auxiliary package part comprises the following steps:
providing a mold in a frame region of the surface of the base substrate on which the light-emitting layer is formed such that a mold cavity of the mold faces with the side surface of the light-emitting layer, and a package gap is provided between the mold cavity of the mold and the side surface of the light-emitting layer;
applying an encapsulant in the package gap such that a portion of the encapsulant enters the mold cavity;
covering the package cover plate on a surface of the base substrate on which the light-emitting layer is formed, so that the encapsulant is cured into an auxiliary package part such that the auxiliary package part encapsulates the base substrate and the package cover plate;
removing the mold, so that a plurality of first limiting portions are formed on the outer-side surface of the auxiliary package part;
using the main package part to encapsulate the base substrate on which the light-emitting layer is formed and the package cover plate together comprises the following steps:
applying the encapsulant on the outer-side surface of the auxiliary package part such that the encapsulant applied on the outer-side surface of the auxiliary package part is in contact with the first limiting portions, and such encapsulant encloses the side surface of the base substrate and the side surface of the package cover plate;
curing the encapsulant on the outer-side surface of the auxiliary package part to form the main package part, and a portion of the encapsulant, which is in contact with the first limiting portions, on the outer-side surface of the auxiliary package part is cured into the second limiting portions.

2. The manufacturing method of a display panel according to claim 1 , wherein after forming a light-emitting layer on the surface of the base substrate, and before providing a package cover plate, the manufacturing method of a display panel further comprises the following step:
a moisture absorbing layer is formed on a surface of the light-emitting layer facing away from the base substrate, and the moisture absorbing layer is transparent.

3. The manufacturing method of a display panel according to claim 1 , wherein using the auxiliary package part to encapsulate the base substrate on which the light-emitting layer is formed and the package cover plate together comprises the following steps:
applying the encapsulant on a surface of the frame region of the surface of the base substrate on which the light-emitting layer is formed;
covering the package cover plate on the surface of the base substrate on which the light-emitting layer is formed, so that the encapsulant is cured into the auxiliary package part such that the auxiliary package part encapsulates the base substrate and the package cover plate, and a distance between the outer-side surface of the auxiliary package part and the side surface of the base substrate is greater than 0;
after using the auxiliary package part to encapsulate the base substrate on which the light-emitting layer is formed and the package cover plate together, and before using the main package part to encapsulate the base substrate on which the light-emitting layer is formed and the package cover plate together, the manufacturing method of a display panel further comprises the following steps:
forming a moisture absorbing layer on the outer-side surface of the auxiliary package part such that the moisture absorbing layer is located between the base substrate and the package cover plate, an inner-side of the moisture absorbing layer is in contact with the outer-side surface of the auxiliary package part, the distance between the outer-side surface of the moisture absorbing layer and the side surface of the base substrate is greater than 0;
using the main package part to encapsulate the base substrate on which the light-emitting layer is formed and the package cover plate together comprises the following steps:
applying an encapsulant on the outer-side surface of the moisture absorbing layer,
curing the encapsulant applied on the outer-side surface of the moisture absorbing layer such that the encapsulant applied on the outer-side surface of the moisture absorbing layer is cured into the main package part.

4. The manufacturing method of a display panel according to claim 1 , wherein forming the light-emitting layer on the surface of the base substrate comprises the following steps:
forming an arrayed OLED light-emitting device on a surface of a display region of the base substrate; and forming a water-oxygen barrier layer on a side surface of the arrayed OLED light-emitting device and a surface of the arrayed OLED light-emitting device facing away from the base substrate, so that the light-emitting layer is obtained;
wherein the outer-side surface of the water-oxygen barrier layer faces with the inner-side surface of the second package portion, and a surface of the water-oxygen barrier layer facing away from the arrayed OLED light-emitting device faces with the package cover plate.

Assignees

• Beijing Boe Display Tech Co
• Boe Technology Group Co Ltd

Inventors

• Zhu Hongli
• Shi Haijun
• Bu Zhanchang

Classifications

• H10K71/40

  Thermal treatment, e.g. annealing in the presence of a solvent vapour · CPC title

• H10K59/874 Primary

  including getter material or desiccant · CPC title

• H10K50/8426

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H10K59/8722 Primary

  Peripheral sealing arrangements, e.g. adhesives, sealants · CPC title

• H01L27/3244

  Electricity · mapped topic