High temperature compliant metallic elements for low contact stress ceramic support

US10883369B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10883369-B2
Application numberUS-201815913722-A
CountryUS
Kind codeB2
Filing dateMar 6, 2018
Priority dateMay 9, 2014
Publication dateJan 5, 2021
Grant dateJan 5, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A ceramic component retention system includes a metallic component, a ceramic component, and at least one spring element arranged between the metallic component and the ceramic component. The metallic component has a first coefficient of thermal expansion, and the ceramic component has a second coefficient of thermal expansion. The at least one spring element is configured to mechanically couple the ceramic component to the metallic component.

First claim

Opening claim text (preview).

The invention claimed is: 1. A ceramic component retention system comprising: a metallic component formed at least in part from a metallic substrate having an outer mounting surface extending along a first plane, the metallic substrate having a first coefficient of thermal expansion; a ceramic component formed at least in part from a ceramic substrate having a second coefficient of thermal expansion different from the first coefficient of thermal expansion; and at least one spring element between the metallic component and the ceramic component mechanically coupling the ceramic substrate to the outer mounting surface of the metallic substrate, the at least one spring element comprising: a retention feature mechanically connected to the outer mounting surface of the metallic substrate; a conical element mechanically coupled to the retention feature and extending from the metallic substrate in a direction perpendicular to the first plane, the conical element selected from: at least one cone spring, a plurality of Belleville washers, and combinations thereof; and a contact pad mechanically coupled to the conical element and having a length extending along a second plane parallel to the first plane; wherein the retention feature extends in the direction perpendicular to the first plane such that deflection of the conical element is limited to an elastic deformation range perpendicular to the first and second planes. 2. The ceramic component retention system of claim 1 , wherein the at least one cone spring is constructed to define a plurality of slots or to include scallop features. 3. The ceramic component retention system of claim 1 , wherein the conical element or contact pad further comprises a powder removal hole configured to allow unsintered powder to be extracted after additive manufacturing of the conical element. 4. The ceramic component retention system of claim 1 , wherein the metallic substrate defines at least one cooling air passage. 5. The ceramic component retention system of claim 1 , further comprising a gasket arranged on the contact pad.

Assignees

Inventors

Classifications

  • Ceramic matrix composites [CMC] · CPC title

  • F01D5/025Primary

    Fixing blade carrying members on shafts (attachment of a member on a shaft in general F16D1/06; for non-positive displacement pumps F04D29/00) · CPC title

  • dissimilar · CPC title

  • Members having different coefficients of expansion · CPC title

  • constructed mainly of ceramic components · CPC title

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Frequently asked questions

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What does patent US10883369B2 cover?
A ceramic component retention system includes a metallic component, a ceramic component, and at least one spring element arranged between the metallic component and the ceramic component. The metallic component has a first coefficient of thermal expansion, and the ceramic component has a second coefficient of thermal expansion. The at least one spring element is configured to mechanically coupl…
Who is the assignee on this patent?
United Technologies Corp
What technology area does this patent fall under?
Primary CPC classification F01D5/025. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Jan 05 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).