Protective film for electronic device and window assembly using the same

Patent metadata

Field	Value
Publication number	US-10882285-B2
Application number	US-201815899804-A
Country	US
Kind code	B2
Filing date	Feb 20, 2018
Priority date	Mar 21, 2017
Publication date	Jan 5, 2021
Grant date	Jan 5, 2021

Abstract

A protective film for an electronic device is introduced. The protective film may comprises a deformable outer layer formed with a synthetic resin; a deformable modified material layer attached with a lower surface of the deformable outer layer, wherein the deformable modified layer is configured to be hardened responsive to receipt of an external stimuli; a deformable inner layer formed with a synthetic resin, attached with a lower surface of the deformable modified material layer; and an adhesive layer adhering to a lower surface of the deformable inner layer. Further, various embodiments can be implemented according to the present disclosure.

First claim

What is claimed is:

1. A protective film for an electronic device, the protective film comprising:
a deformable outer layer formed with a synthetic resin;
a deformable modified material layer configured to be attached with a lower surface of the deformable outer layer, wherein the deformable modified layer is configured to be deformed into a curved shape corresponding to a curved shape of a window surface of the electronic device prior to hardening and hardened into the curved shape responsive to receipt of an external stimuli;
a deformable inner layer formed with a synthetic resin, attached with a lower surface of the deformable modified material layer; and
an adhesive layer adhering to a lower surface of the deformable inner layer,
wherein a bonding strength of the deformable modified material layer and the adhesive layer is increased due to placement of the deformable inner layer.

2. The protective film of claim 1 , further comprising:
a reinforced protective layer formed on an upper surface of the deformable outer layer with a material having a higher strength than the deformable outer layer.

3. The protective film of claim 2 , further comprising:
a first separation layer configured to adhere to an upper surface of the reinforced protective layer and a second separation layer configured to adhere to a lower surface of the adhesive layer in a separable form.

4. The protective film of claim 2 , further comprising:
a lipophilic coating layer configured to be located on an upper surface of the reinforced protective layer.

5. The protective film of claim 2 , further comprising:
a water and oil repellent coating layer configured to be located on an upper surface of the reinforced protective layer.

6. The protective film of claim 2 , wherein the reinforced protective layer, the deformable outer layer, the deformable modified material layer, the deformable inner layer, and the adhesive layer are formed to have a total thickness greater than 60 μm and less than 135 μm.

7. The protective film of claim 1 , wherein the external stimuli comprises ultraviolet light radiation.

8. The protective film of claim 7 , wherein the deformable modified material layer comprises an acrylic resin having a glass transition point lower than room temperature, a photo-reactive oligomer configured to be hardened by an ultraviolet light, and a photo-initiator configured to initiate an ultraviolet curing reaction.

9. The protective film of claim 8 , wherein the deformable modified material layer comprises 100 parts by weight of the acryl resin, 5˜50 parts by weight of the photo-reactive oligomer, and 1˜5 parts by weight of the photo-initiator.

10. The protective film of claim 7 , wherein the deformable modified material layer comprises an acrylic resin having a glass transition point lower than room temperature, methacryloyloxyethyl isocyanate, and photo-initiator configured to initiate an ultraviolet curing reaction.

11. The protective film of claim 1 , wherein the deformable outer layer is formed with a thickness greater than 10 μm and less than 50 μm.

12. An electronic device comprising:
a housing;
a display disposed inside the housing and including a flat part and a curved part; and
a protective film, wherein the protective film comprises:
a deformable outer layer formed with a synthetic resin;
a deformable modified material layer attached with a lower surface of the deformable outer layer, wherein the deformable modified layer is configured to be deformed into a curved shape corresponding to a curved shape of the display prior to hardening and hardened into the curved shape responsive to receipt of an external stimuli;
a deformable inner layer formed with a synthetic resin, attached with a lower surface of the deformable modified material layer; and
an adhesive layer adhering to a lower surface of the deformable inner layer,
wherein a bonding strength of the deformable modified material layer and the adhesive layer is increased due to placement of the deformable inner layer.

13. A windows assembly for an electronic device, the window assembly comprising:
a deformable outer layer formed with a synthetic resin;
a deformable modified material layer attached to a lower surface of the outer layer, to have fluidity, wherein the deformable modified layer is configured to be deformed into a curved shape corresponding to a curved shape of a display of the electronic device prior to hardening and hardened into the curved shape responsive to receipt of an external stimuli;
a deformable inner layer formed with a synthetic resin, attached to a lower surface of the deformable modified material layer;
an adhesive layer configured to be combined with a lower surface of the deformable inner layer; and
a window layer configured to be combined with a lower surface of the adhesive layer and the electronic device,
wherein the adhesive layer provides adhesive strength to a connection of the lower surface of the deformable inner layer and the window layer, and
wherein a bonding strength of the deformable modified material layer and the adhesive layer is increased due to placement of the deformable inner layer.

14. The window assembly of claim 13 , further comprising:
a reinforced protective layer formed on an upper surface of the deformable outer layer, the reinforced protected layer comprising a material having a higher strength than the deformable outer layer.

15. The window assembly of claim 14 , further comprising:
a separation layer configured to adhere to an upper surface of the reinforced protective layer in a separable form.

16. The window assembly of claim 14 , further comprising:
a lipophilic first coating layer located on an upper surface of the reinforced protective layer.

17. The window assembly of claim 13 , wherein the external stimuli comprises ultraviolet light radiation.

18. The window assembly of claim 17 , wherein the deformable modified material layer comprises an acrylic resin having a glass transition point lower than room temperature, a photo-reactive oligomer configured to be hardened by an ultraviolet light, and a photo-initiator configured to initiate an ultraviolet curing reaction.

19. The window assembly of claim 18 , wherein the deformable modified material layer comprises 100 parts by weight of the acryl resin, 5˜50 parts by weight of the photo-reactive oligomer, and 1˜5 parts by weight of the photo-initiator.

20. The window assembly of claim 17 , wherein the deformable modified material layer comprises an acrylic resin having a glass transition point lower than room temperature, methacryloyloxyethyl isocyanate, and photo-initiator configured to initiate an ultraviolet curing reaction.

Assignees

• Samsung Electronics Co Ltd
• Daehyunst Co Ltd

Inventors

• Kim Younggyun
• Shim Choontaek
• Hwang Sangil
• Oh Jeeyoung
• Lee Hoyoung
• Jeon Jaeseon
• Heo Jaehyeok

Classifications

• G02B1/14 Primary

  Protective coatings, e.g. hard coatings · CPC title

• B32B7/023

  Optical properties · CPC title

• C09J7/29

  Laminated material (metallised plastics C09J7/22) · CPC title

• B32B27/08 Primary

  of synthetic resin · CPC title

• B32B27/26

  using curing agents · CPC title