Polishing pad and polishing method

Patent metadata

Field	Value
Publication number	US-10882157-B2
Application number	US-201615744460-A
Country	US
Kind code	B2
Filing date	May 18, 2016
Priority date	Jul 17, 2015
Publication date	Jan 5, 2021
Grant date	Jan 5, 2021

Abstract

To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to be polished. The polishing pad has a piloerection portion (1) in which a plurality of fibers (12) having a length of 2 mm or more are raised on the surface of a base (11), in which the mass of the fibers (12) is 250 g/m2 or more. The polishing pad is used for polishing an object to be polished (2) containing metal, an alloy, or a metal oxide material and having at least one of a projection portion (21) and a recessed portion (22) on the surface.

First claim

The invention claimed is:

1. A polishing pad used for polishing an object to be polished containing metal, an alloy, or a metal oxide material and having at least one of a projection portion and a recessed portion on a surface, the polishing pad comprising:
a piloerection portion in which a plurality of fibers having a length of 2 mm or more are raised on a surface of a base, wherein
a mass of the fibers is 250 g/m 2 or more; and
the fibers have a length of 10 mm or more.

2. The polishing pad according to claim 1 , wherein the mass of the fibers is 800 g/m 2 or more.

3. The polishing pad according to claim 1 , wherein a number of the fibers is 1000 fibers/cm 2 or more.

4. The polishing pad according to claim 1 , wherein the number of the fibers is 4000 fibers/cm 2 or more.

5. The polishing pad according to claim 1 , having a multilayer structure in which an elastic layer containing an elastic body is provided on a side opposite to a side in which the fibers are raised of the base.

6. The polishing pad according to claim 1 , wherein a height of the projection portion or a depth of the recessed portion is 0.1 mm or more.

7. The polishing pad according to claim 1 , wherein the length of the fibers is 5.5 times or more the height of the projection portion or the depth of the recessed portion.

8. The polishing pad according to claim 1 , wherein a projected area of the projection portion or the recessed portion in a vertical projection view when the projection portion or the recessed portion is viewed from a point of view at a position perpendicular to the surface of the object to be polished is 0.1 cm 2 or more.

9. The polishing pad according to claim 1 , wherein the polishing pad is used for polishing the object to be polished using a polishing composition comprising abrasives having an average secondary particle diameter of 5 μm or less and water.

10. The polishing pad according to claim 1 , wherein the polishing pad is used for a polishing device having a platen to which the polishing pad is attached and a rotation mechanism rotating the platen, in which sizes of the polishing pad and the platen are larger than a size of an object to be polished, the object to be polished is contacted with the polishing pad, and only a surface facing the polishing pad among a plurality of surfaces of the object to be polished is polished.

11. A polishing method comprising:
polishing an object to be polished using the polishing pad according to claim 1 .

12. A polishing method comprising:
polishing an object to be polished containing metal, an alloy, or a metal oxide material and having at least one of a projection portion and a recessed portion on a surface using the polishing pad according to claim 1 and a polishing composition containing abrasives having an average secondary particle diameter of 5 μm or less and water.

13. The polishing method according to claim 11 , comprising:
bringing the object to be polished into contact with the polishing pad, and then
polishing only a surface facing the polishing pad among a plurality of surfaces of the object to be polished using a polishing device having a platen to which the polishing pad is attached and a rotation mechanism rotating the platen and in which sizes of the polishing pad and the platen are larger than a size of the object to be polished.

14. The polishing pad according to claim 2 , wherein a number of the fibers is 1000 fibers/cm 2 or more.

15. The polishing pad according to claim 2 , wherein a number of the fibers is 4000 fibers/cm 2 or more.

16. The polishing pad according to claim 3 , wherein a number of the fibers is 4000 fibers/cm 2 or more.

Assignees

• Fujimi Inc

Inventors

• Morinaga Hitoshi
• Tamai Kazusei
• Tahara Muneaki
• Asai Maiko
• Ito Yuuichi

Classifications

• B24B37/26

  characterised by the shape of the lapping pad surface, e.g. grooved · CPC title

• B32B5/12

  characterised by the relative arrangement of fibres or filaments of {different layers, e.g. the fibres or filaments being parallel or perpendicular to each other} · CPC title

• B24B37/22

  characterised by a multi-layered structure · CPC title

• B32B2307/732

  Dimensional properties · CPC title

• B24B37/04

  designed for working plane surfaces · CPC title