Machine tool

US10882154B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10882154-B2
Application numberUS-201916519864-A
CountryUS
Kind codeB2
Filing dateJul 23, 2019
Priority dateSep 7, 2018
Publication dateJan 5, 2021
Grant dateJan 5, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A chip antiscatter mechanism is included and configured to suppress scattering of chips generated during machining of a machining object. The chip antiscatter mechanism includes chip stirring means configured to stir the chips, by jetting a gas into a dry machining region above a table including the machining object, fluid curtain forming means configured to form a fluid curtain by jetting a fluid such as liquid or gas membranously from above to an outside of the dry machining region so as to surround the dry machining region, and to form a closed region including the dry machining region by the membranous fluid curtain, and discharging means configured to receive and discharge the fluid jetted membranously by the fluid curtain forming means.

First claim

Opening claim text (preview).

What is claimed is: 1. A machine tool comprising a spindle with a tool attached to, and a table configured to support a machining object, the machine tool configured to perform machining to the machining object by the tool while relatively moving the spindle and the table, the machine tool comprising: a chip antiscatter mechanism configured to suppress scattering of chips generated from the machining object by the machining, the chip antiscatter mechanism including: a chip stirrer configured to stir the chips, by jetting a gas into a dry machining region above the table, the dry machining region including the machining object; a fluid curtain forming nozzle configured to form a fluid curtain by jetting a fluid liquid or gas membranously from above to an outside of the dry machining region so as to surround the dry machining region, and to form a closed region by the membranous fluid curtain, the closed region including the dry machining region; a discharger including a discharging path having a flow path opening, and configured such that the fluid jetted membranously by the fluid supply directly enters the flow path opening and passes through the discharging path so as to be discharged; a cylindrical inner enclosure arranged to extend upward from an upper surface of the table so as to surround the machining object, an inside of the inner enclosure is the dry machining region; and a cylindrical outer enclosure arranged to extend upward from the upper surface of the table, so as to surround the inner enclosure and to form a space, and the space between the inner enclosure and the outer enclosure is the discharging path configured to receive and discharge the fluid jetted membranously. 2. The machine tool according to claim 1 , wherein the fluid curtain forming nozzle is configured to jet the fluid, and a fluid supply is configured to supply the fluid to the fluid curtain forming nozzle, and the fluid curtain forming nozzle is attached to the spindle. 3. The machine tool according to claim 2 , wherein the fluid curtain forming nozzle is configured to jet the fluid in an adjustable jetting direction. 4. The machine tool according to claim 1 , the discharger including: the discharging path; and a removing and collecting tank connected to the discharging path so as to receive the fluid from the discharging path. 5. The machine tool according to claim 1 , the discharger including: the discharging path; and a discharging path vacuum pump configured to generate negative pressure in the discharging path compared to the closed region. 6. The machine tool according to claim 1 , wherein a chip absorber is integrally provided at each of upper ends of the inner enclosure and the outer enclosure. 7. The machine tool according to claim 1 , the machine tool comprising: a machining region vacuum pump configured to suck and remove the chips from the dry machining region.

Assignees

Inventors

Classifications

  • using a liquid bath or a liquid curtain · CPC title

  • B23Q11/006Primary

    by sucking and blowing simultaneously · CPC title

  • B23P23/04Primary

    for both machining and other metal-working operations · CPC title

  • Arrangements for cooling or lubricating tools or work · CPC title

  • by sucking · CPC title

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Frequently asked questions

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What does patent US10882154B2 cover?
A chip antiscatter mechanism is included and configured to suppress scattering of chips generated during machining of a machining object. The chip antiscatter mechanism includes chip stirring means configured to stir the chips, by jetting a gas into a dry machining region above a table including the machining object, fluid curtain forming means configured to form a fluid curtain by jetting a fl…
Who is the assignee on this patent?
Fanuc Corp
What technology area does this patent fall under?
Primary CPC classification B23Q11/006. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 05 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).