Heatsink with retention mechanisms

Patent metadata

Field	Value
Publication number	US-10882147-B2
Application number	US-201816149100-A
Country	US
Kind code	B2
Filing date	Oct 1, 2018
Priority date	Oct 1, 2018
Publication date	Jan 5, 2021
Grant date	Jan 5, 2021

Abstract

Examples described herein include an assembly. The assembly may be a heatsink assembly or some other cooling assembly (for example, a liquid cooling assembly). The heatsink or cooling assembly may include a heatsink or some other cooling means, such as a liquid cooling device. The heatsink or cooling assembly may include a base. The heatsink itself may connect to a base or the bottom of the heatsink may form the base. The base may interface or connect to a bolster plate. The base may interface or connect to a bolster plate via apertures in the base and fasteners included on the base and the bolster plate. The heatsink or cooling assembly may include one or more apertures to accept one or more guide pins and/or retention pins on the bolster plate. The base may include retention mechanisms positioned over the apertures to attach to retention pins on the bolster plate. The retention pins may be the guide pins with retention features.

First claim

What is claimed is:

1. A system, comprising:
a heatsink assembly, including:
a heatsink with a base, the base including two apertures;
retention mechanisms positioned over the two apertures to lock onto retention pins of a bolster plate, wherein the retention mechanisms each include:
a retainer;
a lock ring positioned over the retainer; and
a push button inserted into the retainer and attached to the lock ring, wherein actuation of the push button downwards pushes the lock ring into a down position to lock the retainer onto the retention pin and actuation upwards lifts the lock ring into an up position.

2. The system of claim 1 , wherein the apertures are positioned in opposite corners of the heatsink assembly.

3. The system of claim 1 , wherein the retention mechanism includes a pin to be inserted into a retention feature fitted on the retention pins.

4. The system of claim 3 , wherein the retention feature flexes to accept heat sink assembly removal and installation.

5. A system, comprising:
a heatsink assembly, including:
a heatsink with a base, the base including two apertures;

a retention mechanism fitting to attach to guide pins, aligned with the apertures of the heatsink, wherein the retention mechanisms lock the heatsink assembly onto a bolster plate and wherein the retention fitting mechanism includes:
a lever spring;
a housing;
a first pin to connect the lever spring to the housing;
a rocker retainer; and
a second pin to connect the rocker retainer to the metal housing.

6. The system of claim 5 , wherein the rocker retainer is depressed as the heatsink assembly passes over the rocker retainer and the rocker retainer returns to a normal position after passing through the apertures.

7. The system of claim 5 , wherein the guide pins are included on a bolster plate.

8. The system of claim 7 , wherein the bolster plate includes four guide pins and two retention mechanisms are fitted to two of the guide pins.

9. The system of claim 5 , wherein in response to the addition of the heatsink assembly to the bolster plate, the heatsink assembly is fastened to the bolster plate via screws to apply pressure and thermal contact with a processing resource.

10. The system of claim 9 , wherein the screws can be tightened in any order.

Assignees

• Hewlett Packard Entpr Dev Lp

Inventors

• Potter Andrew
• Tower Daniel W
• Schulze James
• Grady John
• Ganta Sunil
• Tan Chong

Classifications

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/641 Primary

  Snap-on arrangements, e.g. clips · CPC title

• B23P19/04 Primary

  for assembling or disassembling parts · CPC title

• H05K7/2039

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• G06F1/203

  for portable computers, e.g. for laptops · CPC title