Adsorption heat exchanger devices

Patent metadata

Field	Value
Publication number	US-10882145-B2
Application number	US-201816000947-A
Country	US
Kind code	B2
Filing date	Jun 6, 2018
Priority date	Jun 30, 2011
Publication date	Jan 5, 2021
Grant date	Jan 5, 2021

Abstract

Adsorption heat exchanger devices (11, 25) are provided for use in solid sorption refrigeration systems (1) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules (18) of the adsorbent material whereby localized bonds (19) are formed around the contact points on curing of the binder.

First claim

What is claimed is:

1. A method for making an adsorbent structure for an adsorption heat exchanger device, comprising:
applying a curable binder solution comprising a binder and solvent to a granular adsorbent material;
evaporating the solvent;
curing the binder;
breaking the granular absorbent material into clusters of bonded granules;
coating a structure of at least one cavity formed at an adsorption side of a heat exchanger structure with a pre-coat binder for bonding the clusters to said surface; and
stacking the clusters in the at least one cavity;
wherein the curable binder solution is diluted so that during said evaporating the binder becomes concentrated around contact points between the granules;
wherein first localized bonds are formed around only the contact points between the granules upon said curing such that coating an entirety of a surface of the granules is prevented, and second localized bonds are formed around contact points between the heat exchanger structure and the granules upon said curing.

2. The method as claimed in claim 1 , wherein the curable binder solution comprises a ratio of binder to solvent of 1:5 to 1:150.

3. The method as claimed in claim 1 , wherein the curable binder comprises an adhesive mixture.

4. The method as claimed in claim 1 , wherein the binder shrinks by at least 3% upon curing.

Assignees

• IBM

Inventors

• Brunschwiler Thomas J
• Goicochea Javier V
• Michel Bruno
• Ruch Patrick

Classifications

• B01J20/2803 Primary

  Sorbents comprising a binder, e.g. for forming aggregated, agglomerated or granulated products · CPC title

• F25B35/04

  using a solid as sorbent · CPC title

• Y02A30/27

  Relating to heating, ventilation or air conditioning [HVAC] technologies · CPC title

• Y10T29/4935

  Heat exchanger or boiler making · CPC title

• B01J20/3042

  Use of binding agents; addition of materials ameliorating the mechanical properties of the produced sorbent · CPC title