Mobile device and antenna structure

Patent metadata

Field	Value
Publication number	US-10879591-B2
Application number	US-201916265430-A
Country	US
Kind code	B2
Filing date	Feb 1, 2019
Priority date	Nov 8, 2012
Publication date	Dec 29, 2020
Grant date	Dec 29, 2020

Abstract

A mobile device includes a dielectric substrate, a metal layer, a metal housing, a first nonconductive partition, a second nonconductive partition, a first connection element, and a second connection element. The dielectric substrate includes a first protruded portion. The metal layer lies on the dielectric substrate, and includes an upper element and a main element, wherein the upper element is separated from the main element by a first region. The metal housing is substantially a hollow structure, and has a first slit and a second slit, wherein a first projection of the first slit with respect to the dielectric substrate at least partially overlaps the first region, and a second projection of the second slit with respect to the dielectric substrate at least partially overlaps the first protruded portion. The mobile device is capable of operating in multiple bands.

First claim

What is claimed is:

1. A mobile device, at least comprising:
a metal housing, being substantially a hollow structure, and having a first slit and a second slit;
a dielectric substrate;
one or more connection elements;
a first feeding element, electrically coupled to the connection elements and a signal source; and
a metal layer, at least partially lying on the dielectric substrate, and electrically coupled through the connection elements to the metal housing,
wherein the dielectric substrate and the metal layer are disposed in the metal housing,
wherein at least one portion of the metal housing is configured to receive and transmit an Radio Frequency (RF) signal, and
wherein the dielectric substrate is disposed between the metal layer and the metal housing.

2. The mobile device as claimed in claim 1 , wherein the metal layer at least comprises an upper element and a main element, and a first slot is formed between the upper element and the main element.

3. The mobile device as claimed in claim 2 , wherein the first slit of the metal housing is substantially aligned with or parallel to the first slot of the metal layer.

4. The mobile device as claimed in claim 3 , wherein:
the first feeding element is electrically coupled to the upper element of the metal layer, and
the connection elements electrically couple the upper element of the metal layer to the metal housing.

5. The mobile device as claimed in claim 4 , wherein one end of the first feeding element extends across the first slot, and another end of the first feeding element is electrically coupled to the signal source.

6. The mobile device as claimed in claim 4 , wherein the metal housing at least comprises an upper cover and a middle cover, and the first slit completely or partially separates the upper cover from the middle cover.

7. The mobile device as claimed in claim 6 , wherein the metal layer further comprises a lower element, and a second slot is formed between the main element and the lower element of the metal layer.

8. The mobile device as claimed in claim 7 , wherein the second slit is substantially aligned with or parallel to the second slot of the metal layer, the mobile device further comprises a second nonconductive partition, and the second nonconductive partition at least partially disposed in the second slit of the metal housing.

9. The mobile device as claimed in claim 8 , further comprising:
a second feeding element, electrically coupled to the lower element of the metal layer, or electrically coupled through the connection elements to the metal housing.

10. The mobile device as claimed in claim 8 ,
wherein the metal housing comprises a middle cover and a lower cover, the second slit completely or partially separates the middle cover from the lower cover, and the second slit forms a projection region on the dielectric substrate.

11. The mobile device as claimed in claim 10 , wherein the first nonconductive partition and the second nonconductive partition are a ring structure surrounding the dielectric substrate and the metal layer.

12. The mobile device as claimed in claim 8 , wherein area of the second nonconductive partition is larger than or equal to area of the second slit of the metal housing.

13. The mobile device as claimed in claim 7 , wherein the second slot of the metal layer completely separates the lower element from the main element, the mobile device further comprises a conductive element, and the conductive element extends across the second slot and electrically couples the lower element to the main element.

14. The mobile device as claimed in claim 7 , wherein the second slot forms a projection region on the dielectric substrate, and the projection region penetrates or does not penetrate the dielectric substrate.

15. The mobile device as claimed in claim 4 , further comprising:
a transparent panel, wherein the first nonconductive partition is completely or partially formed by at least a portion of the transparent panel.

16. The mobile device as claimed in claim 4 , further comprising:
a baseband chipset;
an RF module; and
a matching circuit, wherein the baseband chipset, the RF module, and the snatching circuit are disposed on the dielectric substrate.

17. The mobile device as claimed in claim 4 , further comprising: one or more electronic components, disposed on the upper element of the metal layer.

18. The mobile device as claimed in claim 17 , wherein the one or more electronic components comprise a speaker, a camera, a USB (Universal Serial Bus) socket, a memory card socket, and/or an audio jack.

19. The mobile device as claimed in claim 17 , wherein the one or more electronic components are electrically coupled through one or more metal traces to the baseband chipset.

20. The mobile device as claimed in claim 4 , wherein the first slot forms a projection region on the dielectric substrate, and the projection region penetrates or does not penetrate the dielectric substrate.

21. The mobile device as claimed in claim 4 , wherein the first feeding element and the metal layer are disposed on different planes.

22. The mobile device as claimed in claim 2 , wherein the first slot of the metal layer comprises a first portion and a second portion, and the first portion is separate from the second portion.

23. The mobile device as claimed in claim 22 , wherein a length of the first portion is substantially equal to a length of the second portion.

24. The mobile device as claimed in claim 22 ,
wherein a length of the first portion is longer then a length of the second portion.

25. The mobile device as claimed in claim 2 , wherein the first slot of the metal layer completely separates the upper element from the main element, the mobile device further comprises a conductive element, and the conductive element extends across the first slot and electrically couples the upper element to the main element.

26. The mobile device as claimed in claim 25 , wherein the conductive element is a Flexible Printed Circuit Board (FPCB).

27. The mobile device as claimed in claim 1 , further comprising:
a first nonconductive partition, at least partially disposed in the first slit of the metal housing.

28. The mobile device as claimed in claim 27 , wherein area of the first nonconductive partition is larger than or equal to area of the first slit of the metal housing.

29. The mobile device as claimed in claim 1 ,
wherein the first feeding element is electrically coupled through the connection elements to the metal housing.

30. The mobile device as claimed in claim 29 , wherein the first slit forms a projection region on the dielectric substrate, one end of the first feeding element extends across the projection region, and another end of the first feeding element is electrically coupled to the signal source.

31. The mobile device as claimed in claim 29 , further comprising:
a second nonconductive partition, at least partially disposed in the second slit of the metal housing, and surrounding the dielectric substrate and the metal layer.

32. The mobile device as claimed in claim 31 , further comprising:
a second feeding element, electrically coupled through the connection elements to the metal housing.

33. The mobile device as claimed in claim 1 , wherein the f

Assignees

• Htc Corp

Inventors

• Tsai Tiao-Hsing
• Chiu Chien-Pin
• Wu Hsiao-Wei
• Kuo Chao-Chiang

Classifications

• H01Q13/106

  Microstrip slot antennas (patch antenna elements H01Q9/0407) · CPC title

• H01Q1/2266

  disposed inside the computer · CPC title

• H01Q1/243 Primary

  with built-in antennas · CPC title

• H01Q1/50

  Structural association of antennas with earthing switches, lead-in devices or lightning protectors · CPC title

• H01Q1/44

  using equipment having another main function to serve additionally as an antenna {, e.g. means for giving an antenna an aesthetic aspect}(H01Q1/27 - H01Q1/34 take precedence) · CPC title