Flexible and light-transmissible light-emitting device and method for manufacturing light-emitting device

Patent metadata

Field	Value
Publication number	US-10879442-B2
Application number	US-201916281369-A
Country	US
Kind code	B2
Filing date	Feb 21, 2019
Priority date	Aug 30, 2018
Publication date	Dec 29, 2020
Grant date	Dec 29, 2020

Abstract

A light-emitting device according to embodiments of the invention includes a film having light transmissive property to visible light; a conductor layer formed on one surface of the film; and a light-emitting element having electrodes connected to the conductor layer via bumps protruding toward the film. The curvature of the film curved on the outer edge of a contact area of the conductor layer contacting the bumps is defined by a radius of a circle contacting the conductor layer at at least three points on the outer edge of the contact area, and the radius of this circle is 13 μm or larger.

First claim

What is claimed is:

1. A light-emitting device comprising:
a first base material including a first conductor pattern formed from a resin having flexibility and provided on the front surface, and a first connection pad electrically connected to the first conductor pattern;
a light-emitting member including a first conductor member connected to the first connection pad by protruding toward the first connection pad, a first electrode electrically connected to the first conductor member, and a first semiconductor layer connected to the first electrode;
a second base material holding the light-emitting member; and
an intermediate layer retaining the first base material and the second base material,
wherein a radius of a circle contacting the first connection pad at at least three points on the outer edge of a contact area of the first connection pad contacting the first conductor member, the radius of the circle defining the curvature of the first base material curved on the outer edge of the contact area, is 13 μm or larger.

2. The light-emitting device according to claim 1 , wherein the first base material is at least one material selected from the group consisting of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), a polycarbonate (PC), polyethylene succinate (PES), a cyclic olefin resin, and an acrylic resin, the first base material has a flexural modulus of 0 to 320 kgf/mm 2 , and
the first conductor member includes a metal material and has a dynamic hardness value DHV of 3 to 150.

3. The light-emitting device according to claim 1 , wherein an amount of bite of the first conductor member into the first connection pad and the first base material at the contact area is 15 μm.

4. The light-emitting device according to claim 3 , wherein the first conductor member has a height of 10 to 60 μm.

5. The light-emitting device according to claim 1 , wherein the height (T 1 ) of the light-emitting member is higher than the thickness (T 2 ) of the intermediate layer, and the first base material has a curved shape such that the site of disposition of the light-emitting member protrudes outward, and the circumference of the light-emitting member is depressed inward.

6. The light-emitting device according to claim 1 , wherein the first base material has a second conductor pattern electrically connected to a second connection pad,
the light-emitting member includes a second conductor member connected to the second connection pad by protruding toward the second connection pad, a second electrode electrically connected to the second conductor member, and a second semiconductor layer connected to the second electrode, and
the second electrode is disposed on the same surface of the light-emitting member as the surface provided with the first electrode.

7. The light-emitting device according to claim 1 , wherein the radius of the circle is 20 μm or larger.

8. The light-emitting device according to claim 1 , wherein the radius of the circle is 25 μm or larger.

Assignees

• Toshiba Hokuto Electronics Corp

Inventors

• Takojima Naoki
• Yarimizu Yojiro
• Abe Tsuyoshi
• Tanaka Kouji

Classifications

• H10H20/0364

  of interconnections · CPC title

• H10H20/857 Primary

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• F21V23/06

  the elements being coupling devices {, e.g. connectors} · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• H01L33/62 Primary

  Electricity · mapped topic