Haptic actuator including overmolded field member and related methods

US10877563B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10877563-B2
Application numberUS-202016860504-A
CountryUS
Kind codeB2
Filing dateApr 28, 2020
Priority dateDec 27, 2018
Publication dateDec 29, 2020
Grant dateDec 29, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A haptic actuator may include a housing, a coil carried by the housing, and a field member movable within the housing responsive to the coil. The field member may include a frame having opposing first and second ends, at least one magnet carried by the frame, and a first overmolded endcap coupled to the first end of the frame. The field member may also include a second overmolded endcap coupled to the second end of the frame. The haptic actuator may include a first flexure having an inner end coupled to the first overmolded endcap, and an outer end coupled to adjacent portions of the housing. The haptic actuator may also include a second flexure having an inner end coupled to the second overmolded endcap, and an outer end coupled to adjacent portions of the housing.

First claim

Opening claim text (preview).

That which is claimed is: 1. A haptic actuator comprising: an actuator housing and at least one coil carried thereby; a field member movable within the actuator housing responsive to the at least one coil, the field member comprising a frame, at least one magnet carried by the frame, and a first overmolded endcap covering a first end of the frame; a first overmolded flexure mount carried by the actuator housing; and a first flexure having an inner end embedded into the first overmolded endcap, and an outer end embedded into the first overmolded flexure mount. 2. The haptic actuator of claim 1 , wherein the first overmolded flexure mount comprises a first flexure mounting portion and a first flange mounting portion integrally formed therewith. 3. The haptic actuator of claim 1 , wherein the field member comprises a second overmolded endcap covering a second end of the frame; and comprising a second overmolded flexure mount carried by the housing, and a second flexure having an inner end embedded into the second overmolded endcap and an outer end embedded within the second overmolded flexure mount. 4. The haptic actuator of claim 3 , wherein the second flexure mount comprises a second flexure mounting portion and a second flange mounting portion integrally formed therewith. 5. The haptic actuator of claim 3 , wherein the first end of the frame is embedded into the first overmolded endcap, and the second end of the frame is embedded into the second overmolded endcap. 6. The haptic actuator of claim 1 , wherein the frame has at least one magnet receiving opening extending therethrough; and comprising an overmolded magnet receiving holder coupled to the frame and lining the at least one magnet receiving opening; and wherein the at least one magnet is within the at least one magnet receiving opening. 7. The haptic actuator of claim 1 , wherein the at least one magnet receiving opening comprises a pair of side-by-side magnet receiving openings; and wherein the at least one magnet comprises a pair of magnets. 8. The haptic actuator of claim 1 , wherein the frame comprises metal; wherein the first flexure comprises metal; and wherein the first overmolded endcap comprises plastic. 9. An electronic device comprising: a housing and wireless communications circuitry carried thereby; a haptic actuator within the housing and comprising an actuator housing and at least one coil carried thereby, a field member movable within the actuator housing responsive to the at least one coil, the field member comprising a frame, at least one magnet carried by the frame, and a first overmolded endcap covering a first end of the frame, a first overmolded flexure mount carried by the actuator housing, and a first flexure having an inner end embedded into the first overmolded endcap, and an outer end embedded into the first overmolded flexure mount; and a controller carried by the housing and coupled to the wireless communications circuitry and the haptic actuator. 10. The electronic device of claim 9 , wherein the first overmolded flexure mount comprises a first flexure mounting portion and a first flange mounting portion integrally formed therewith. 11. The electronic device of claim 9 , wherein the field member comprises a second overmolded endcap covering a second end of the frame; and comprising a second overmolded flexure mount carried by the housing, and a second flexure having an inner end embedded into the second overmolded endcap and an outer end embedded within the second overmolded flexure mount. 12. The electronic device of claim 11 , wherein the second flexure mount comprises a second flexure mounting portion and a second flange mounting portion integrally formed therewith. 13. The electronic device of claim 11 , wherein the first end of the frame is embedded into the first overmolded endcap, and the second end of the frame is embedded into the second overmolded endcap. 14. The electronic device of claim 9 , wherein the frame has at least one magnet receiving opening extending therethrough; and comprising an overmolded magnet receiving holder coupled to the frame and lining the at least one magnet receiving opening; and wherein the at least one magnet is within the at least one magnet receiving opening. 15. The electronic device of claim 9 , wherein the at least one magnet receiving opening comprises a pair of side-by-side magnet receiving openings; and wherein the at least one magnet comprises a pair of magnets. 16. A method of making a haptic actuator comprising: assembling a field member to be moveable within an actuator housing responsive to at least one coil, the field member comprising a frame, at least one magnet carried by the frame, and a first overmolded endcap covering a first end of the frame; and mounting the field member using a first flexure having an inner end embedded into the first overmolded endcap, and an outer end embedded into a first overmolded flexure mount carried by the actuator housing. 17. The method of claim 16 , wherein the first overmolded flexure mount comprises a first flexure mounting portion and a first flange mounting portion integrally formed therewith. 18. The method of claim 16 , wherein the field member comprises a second overmolded endcap covering a second end of the frame; and wherein mounting comprises using a second flexure having an inner end embedded into a second overmolded endcap and an outer end embedded within the second overmolded flexure mount. 19. The method of claim 18 , wherein the second flexure mount comprises a second flexure mounting portion and a second flange mounting portion integrally formed therewith. 20. The method of claim 16 , wherein the frame has at least one magnet receiving opening extending therethrough; and comprising an overmolded magnet receiving holder coupled to the frame and lining the at least one magnet receiving opening; and wherein the at least one magnet is within the at least one magnet receiving opening. 21. The method of claim 16 , wherein the at least one magnet receiving opening comprises a pair of side-by-side magnet receiving openings; and wherein the at least one magnet comprises a pair of magnets.

Assignees

Inventors

Classifications

  • Details of the structure or mounting of specific components · CPC title

  • G06F3/016Primary

    Input arrangements with force or tactile feedback as computer generated output to the user · CPC title

  • for a display module assembly · CPC title

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Frequently asked questions

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What does patent US10877563B2 cover?
A haptic actuator may include a housing, a coil carried by the housing, and a field member movable within the housing responsive to the coil. The field member may include a frame having opposing first and second ends, at least one magnet carried by the frame, and a first overmolded endcap coupled to the first end of the frame. The field member may also include a second overmolded endcap coupled…
Who is the assignee on this patent?
Apple Inc
What technology area does this patent fall under?
Primary CPC classification G06F3/016. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 29 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).