Sensor element

Patent metadata

Field	Value
Publication number	US-10876916-B2
Application number	US-201715846598-A
Country	US
Kind code	B2
Filing date	Dec 19, 2017
Priority date	Dec 26, 2016
Publication date	Dec 29, 2020
Grant date	Dec 29, 2020

Abstract

A sensor element that has high measurement precision by providing a resistance-change length ratio corresponding to a direction-specific extension length is provided. The sensor element includes an element body disposed in a sensor body to measure a temperature and a pressure and having a diaphragm deformed based on the temperature or the pressure. Additionally, the sensor element includes pressure-measuring resistors including a second resistor portion and a fourth resistor portion disposed along a diametric direction with respect to a center of an upper surface of the diaphragm and in an extension section on the upper surface of the diaphragm and a first resistor portion and including a third resistor portion disposed outside the second resistor portion or the fourth resistor portion in a compression section on the upper surface of the diaphragm to eliminate a resistance change caused by a pressure-specific temperature change.

First claim

What is claimed is:

1. A sensor element, comprising:
an element body disposed in a sensor body that is configured to measure a temperature and a pressure and having a diaphragm deformed based on the temperature or the pressure; and
pressure-measuring resistors including a second resistor portion and a fourth resistor portion disposed along a diametric direction with respect to a center of an upper surface of the diaphragm and in an extension section on the upper surface of the diaphragm and including a first resistor portion and a third resistor portion disposed outside the second resistor portion or the fourth resistor portion in a compression section on the upper surface of the diaphragm to eliminate a resistance change caused by a pressure-specific temperature change,
wherein the first resistor portion and the third resistor portion of the pressure-measuring resistors include a plurality of arcs individually disposed along a circumferential direction of the diaphragm and a plurality of straight lines disposed along a diametric direction of the diaphragm,
wherein the plurality of arcs and the plurality of straight lines are formed to allow a sum of lengths of the plurality of arcs to be equal to a product of a resistance-change offset multiple and a sum of lengths of the plurality of straight lines,
wherein the resistance-change offset multiple is selected to minimize a sum of a compressive strain amount in the diametric direction and a tensile strain amount in the circumferential direction,
wherein the element body comprises:
a hollow portion open at a central part of a lower surface of the element body and having a pressure applied thereto;
a step formed on a circumferential surface of a cylindrical wall that limits the hollow portion and is formed to correspond to a portion protruding from an outer side of the hollow portion, and
wherein the diaphragm is integrally formed with the cylindrical wall to close an upper end of the cylindrical wall,
wherein the step and a circumferential surface of the element body are formed as a rigid body,
wherein the first and second resistor portions are symmetrical with the third and fourth resistor portions relative to the center of the top of the diaphragm,
wherein the element body includes the extension section formed on the upper surface of the diaphragm with respect to the center and extending along a circumferential direction of the diaphragm between the center and a compression start boundary at which a strain of the diaphragm in a diametric direction is configured to switch from an extension state to a compression state,
wherein the compression section that is a circular band region lying outside the extension section on the upper surface of the diaphragm and extending along the circumferential direction between the compression start boundary and a compression end boundary at which a strain of the diaphragm in the diametric direction is configured to switch from the compression state to a strainless state,
wherein a circumferential section is disposed between the compression section and an exterior of the diaphragm, and a maximum compression boundary is formed along the circumferential direction between the compression end boundary and the compression start boundary,
wherein the element body includes a temperature-measuring resistor formed in the compression section on the upper surface of the diaphragm,
wherein a strain of the pressure-measuring resistors increases based on a temperature increase of the diaphragm to reduce a resistance value of the pressure-measuring resistors,
wherein the temperature-measuring resistor performs a temperature compensation to maintain the resistance value independent of the pressure,
wherein the temperature-measuring resistor has a resistor pattern that corresponds to a resistance-change length ratio to enable the temperature-measuring resistor to react to temperature via offsetting of a resistance change caused by a pressure change,
wherein the resistor pattern of the temperature-measuring resistor comprises:
a first extension that extends by a first extension length along the diametric direction from a pattern start point in the compression section on the upper surface of the diaphragm to the maximum compression boundary;
a second extension bent along the circumferential direction at an end of the first extension and that extends by a second extension length along the maximum compression boundary; and
a third extension that extends by a third extension length along the diametric direction from an end of the second extension to a pattern end point, and
wherein each of the first extension, the second extension, and the third extension consists of one.

2. The sensor element of claim 1 , wherein the resistance-change length ratio of the temperature-measuring resistor is a ratio that equalizes the second extension length and a product of the resistance-change offset multiple and a sum of the first extension length and the third extension length, and is derived from an analytical experiment that determines a correlation between a pressure change and strain rate changes in the diameter direction and circumferential direction in the diaphragm, and
wherein an amount of compressive strain in the diametric direction and an amount of tensile strain in the circumferential direction offset each other and sum to zero.

3. The sensor element of claim 2 , wherein the resistor pattern of the temperature-measuring resistor has an arc shape or a straight line shape.

4. The sensor element of claim 1 , wherein the element body includes a material selected from the group consisting of a metallic material, an alloy material, a semiconductor material that varies in resistance when a load of temperature or pressure which is a stress applied through a piezoresistive effect, and a composite material obtained by combining the semiconductor material with the metallic material or the alloy material.

5. The sensor element of claim 1 , wherein the pressure-measuring resistors include a plurality of connection lead terminals disposed on the upper surface of the diaphragm to form an electrical connection of the first to fourth resistor portions.

Assignees

• Hyundai Kefico Corp

Inventors

• Kim Chi Yeon

Classifications

• G01L9/0042

  Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms (details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively) · CPC title

• G01L19/0092

  Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature (G01L9/025, G01L9/045, G01L9/065, G01L9/085, G01L9/105, G01L9/125, G01L19/02, G01L19/04 take precedence; measuring two or more variable G01D21/02; temperature sensors with pressure compensation G01K1/26) · CPC title

• G01L9/0054

  integral with a semiconducting diaphragm · CPC title

• G01D3/036

  on measuring arrangements themselves · CPC title

• G01K7/16 Primary

  using resistive elements · CPC title