Adhesive layer-equipped laminate, and flexible copper-clad laminate sheet and flexible flat cable using same

US10875283B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10875283-B2
Application numberUS-201515329890-A
CountryUS
Kind codeB2
Filing dateJul 21, 2015
Priority dateJul 31, 2014
Publication dateDec 29, 2020
Grant dateDec 29, 2020

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A laminate having an adhesive layer, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and also providing a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in B stage, and which is excellent in storage stability of the laminate. The laminate having an adhesive layer includes a base film and an adhesive layer formed on at least one of the surfaces of the base film, in which the adhesive layer is formed of an adhesive composition comprising a carboxyl group-containing styrene based elastomer and an epoxy resin, wherein the content of the carboxyl group-containing styrene based elastomer is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the carboxyl group-containing styrene based elastomer; and the adhesive layer is in B-stage.

First claim

Opening claim text (preview).

The invention claimed is: 1. A laminate having an adhesive layer, which comprises a base film; and an adhesive layer formed on at least one of the surfaces of the base film, wherein the adhesive layer is formed of an adhesive composition comprising (A) a carboxyl group-containing styrene-based elastomer, (B) an epoxy resin, and (C) a curing accelerator, with the proviso the adhesive composition has no epoxy resin having a glycidylamino group, wherein the content of the carboxyl group-containing styrene-based elastomer (A) is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition, the content of the epoxy resin (B) is 1 to 20 parts by mass relative to 100 parts by mass of the carboxyl group-containing styrene-based elastomer (A), the adhesive layer is in B-stage, and the carboxyl group-containing styrene-based elastomer (A) has an acid value of from 0.1 to 25 mg KOH/g. 2. The laminate having an adhesive layer according to claim 1 , wherein the adhesive layer is formed by coating a resin varnish comprising the adhesive composition and a solvent on a surface of the base film to form a resin varnish layer, and then removing the solvent from the resin varnish layer. 3. The laminate having an adhesive layer according to claim 1 , wherein the laminate has a ratio (H/L) of less than 0.05, wherein H is an elevation of an edge of the laminate and L is a side length of the laminate when the laminate having an adhesive layer is square-shaped and placed on a horizontal surface with the adhesive layer facing up. 4. The laminate having an adhesive layer according claim 1 , wherein the base film is at least one film selected from the group consisting of a polyimide film, a polyether ether ketone film, a polyphenylene sulfide film, an aramid film, a polyethylene naphthalate film, a liquid crystal polymer film, a polyethylene terephthalate film, a polyethylene film, a polypropylene film, a silicone-treated release paper, a polyolefin resin-coated paper, a TPX film, and a fluororesin film. 5. The laminate having an adhesive layer according to claim 1 , wherein the base film has a thickness from 5 to 100 μm. 6. The laminate having an adhesive layer according to claim 1 , wherein the carboxyl group-containing styrene-based elastomer (A) is obtained by modifying at least one styrene-based elastomer selected from the group consisting of styrene-butadiene block copolymers, styrene-ethylenepropylene block copolymers, styrene-butadiene-styrene block copolymers, styrene-isoprene-styrene block copolymers, styrene-ethylenebutylene-styrene block copolymers, and styrene-ethylenepropylene-styrene block copolymers with an unsaturated carboxylic acid. 7. The laminate having an adhesive layer according to claim 1 , wherein the epoxy resin (B) is a multifunctional epoxy resin having an alicyclic structure. 8. The laminate having an adhesive layer according to claim 7 , wherein the alicyclic structure is a dicyclopentadiene structure. 9. The laminate having an adhesive layer according to claim 1 , wherein the adhesive layer has a thickness of from 5 to 100 μm. 10. The laminate having an adhesive layer according to claim 1 , wherein the adhesive layer has a thickness equal to or thicker than the thickness of the base film. 11. The laminate having an adhesive layer according to claim 1 , wherein said laminate exhibits a dielectric constant lower than 3.0 and a dielectric loss tangent lower than 0.01, as measured at a frequency of 1 GHz after curing the adhesive layer. 12. A flexible copper clad laminate which comprises a laminate according to claim 1 and a copper foil bonded onto the adhesive layer of the laminate. 13. A flexible flat cable which comprises a laminate according to claim 1 and a copper wiring bonded onto the adhesive layer of the laminate. 14. The laminate having an adhesive layer according to claim 1 , wherein the base film is at least one film selected from the group consisting of a polyimide film, a polyether ether ketone film, a polyphenylene sulfide film, an aramid film, a polyethylene naphthalate film, a liquid crystal polymer film, a polyethylene terephthalate film, a polyethylene film, a polypropylene film, a silicone-treated release paper, a polyolefin resin-coated paper, a TPX film, and a fluororesin film; wherein the base film has a thickness of from 5 to 100 μm; wherein the adhesive layer has a thickness of from 5 to 100 μm that is equal to or greater than the thickness of the base film; and wherein the laminate has a ratio (H/L) of less than 0.05, in which H is an elevation of an edge of the laminate and L is a side length of the laminate when the laminate having an adhesive layer is square-shaped and placed on a horizontal surface with the adhesive layer facing up. 15. The laminate having an adhesive layer according to claim 1 , wherein the carboxyl group-containing styrene-based elastomer (A) has an acid value of from 0.5 to 23 mg KOH/g. 16. The laminate having an adhesive layer according to claim 1 , wherein the carboxyl group-containing styrene-based elastomer (A) has an acid value of 0.1 mg KOH/g to 10 mg KOH/g. 17. The laminate having an adhesive layer according to claim 1 , wherein the carboxyl group-containing styrene-based elastomer (A) has an acid value of 0.5 mg KOH/g to 10 mg KOH/g. 18. The laminate having an adhesive layer according to claim 1 , wherein the content of the curing accelerator is 1 to 10 parts by mass relative to 100 parts by mass of the epoxy resin (B). 19. The laminate having an adhesive layer according to claim 1 , wherein the content of the curing accelerator is 2 to 5 parts by mass relative to 100 parts by mass of the epoxy resin (B). 20. The laminate having an adhesive layer according to claim 1 , wherein the curing accelerator comprises a tertiary amine-based curing accelerator, tertiary amine salt-based curing accelerator, or an imidazole-based curing accelerator. 21. The laminate having an adhesive layer according to claim 1 , wherein the curing accelerator comprises a tertiary amine-based curing accelerator. 22. The laminate having an adhesive layer according to claim 1 , wherein the curing accelerator comprises a tertiary amine salt-based curing accelerator. 23. The laminate having an adhesive layer according to claim 1 , wherein the curing accelerator comprises imidazole-based curing accelerator.

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What does patent US10875283B2 cover?
A laminate having an adhesive layer, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and also providing a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in B stage, and which is excellent in storage stability of the laminate. The laminate having an adhesive …
Who is the assignee on this patent?
Toagosei Co Ltd
What technology area does this patent fall under?
Primary CPC classification B32B15/08. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 29 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).