Resin molded product and molding device

US10875227B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10875227-B2
Application numberUS-201615754722-A
CountryUS
Kind codeB2
Filing dateAug 12, 2016
Priority dateAug 26, 2015
Publication dateDec 29, 2020
Grant dateDec 29, 2020

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A transparent resin molded product and a mold for molding the product are provided in which occurrence of silver streak in the resin molded product is prevented. The resin molded product includes a design portion and a non-design portion, at least a part of the design portion is molded by transparent resin, and a gate trace (a gate arrangement position during the resin molding) is disposed in the non-design portion (runner portion). A foreign matter restraining portion for restraining foreign matters and bubbles contained in the transparent resin is disposed in the vicinity of the gate trace of the non-design portion. The foreign matters and bubbles are restrained by the foreign matter restraining portion and are prevented from flowing to the design portion, and therefore the occurrence of silver streak on the design portion can be prevented.

First claim

Opening claim text (preview).

The invention claimed is: 1. A resin molded product comprising: a design portion; a non-design portion, wherein at least a part of the design portion is molded by transparent resin, and a gate used in resin molding is arranged at the non-design portion; and a foreign matter restraining portion which is disposed in a vicinity of a gate arrangement position of the non-design portion and configured to restrain foreign matters and bubbles contained in the transparent resin, wherein the foreign matter restraining portion is disposed between the gate arrangement position and the design portion, and wherein the gate is on a first side portion of the molded product and the foreign matter restraining portion is on a second side portion at an opposite side of the molded product, and the gate and the foreign matter restraining portion are staggered, wherein a gate trace is positioned at an entrance portion of the gate on the non-design portion, and the gate trace and the foreign matter restraining portion are staggered. 2. The resin molded product according to claim 1 , wherein the foreign matter restraining portion is configured such that a thickness dimension or a width dimension of the non-design portion is partially increased. 3. The resin molded product according to claim 1 , wherein the non-design portion contains a plurality of foreign matter restraining portions. 4. The resin molded product according to claim 1 , wherein a first foreign matter restraining portion is disposed on the first side of the molded product, and a second foreign matter restraining portion is disposed on the second side at an opposite side of the molded product, and the gate, the first foreign matter restraining portion and the second foreign matter restraining portion are staggered. 5. A molding device comprising: a cavity for molding a molded product including a design portion and a non-design portion; a gate which is disposed at a position of the cavity corresponding to the non-design portion and is configured to inject resin into the cavity; a well portion which is disposed in a vicinity of the gate at the position of the cavity corresponding to the non-design portion and is configured to regulate a flow of the resin to restrain a flow of foreign matters and bubbles, wherein the well portion is disposed between the gate and the design portion, and wherein the gate is disposed on a first side of the molded product and the well position is disposed on a second side at an opposite side of the molded product, and the gate and well portion are staggered. 6. The molding device according to claim 5 , wherein the well portion is formed as a concave portion which is formed by being concaved from a cavity surface of the cavity. 7. The molding device according to claim 5 , wherein the non-design portion contains a plurality of well portions. 8. The molding device according to claim 5 , wherein a first well portion is disposed on the first side of the molded product, and a second well portion is disposed on the second side at an opposite side of the molded product, and the gate, the first well portion and the second well portion are staggered.

Assignees

Inventors

Classifications

  • B29C33/42Primary

    characterised by the shape of the moulding surface, e.g. ribs or grooves · CPC title

  • Sprue channels {; Runner channels or runner nozzles} · CPC title

  • Preventing defects on the moulded article, e.g. weld lines, shrinkage marks (preventing defects on the preformed parts or layers B29C45/14836) · CPC title

  • Gates (B29C45/2703 takes precedence) · CPC title

  • characterised by the configuration of the mould filling gate (mixing chambers situated in the mould opening B29B7/7471); accessories for connecting the mould filling gate with the filling spout · CPC title

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Frequently asked questions

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What does patent US10875227B2 cover?
A transparent resin molded product and a mold for molding the product are provided in which occurrence of silver streak in the resin molded product is prevented. The resin molded product includes a design portion and a non-design portion, at least a part of the design portion is molded by transparent resin, and a gate trace (a gate arrangement position during the resin molding) is disposed in t…
Who is the assignee on this patent?
Koito Mfg Co Ltd
What technology area does this patent fall under?
Primary CPC classification B29C33/42. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 29 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).