Cooking pot for a food processor, food processor and method for the production of a heating element

Patent metadata

Field	Value
Publication number	US-10874256-B2
Application number	US-201715852897-A
Country	US
Kind code	B2
Filing date	Dec 22, 2017
Priority date	Dec 23, 2016
Publication date	Dec 29, 2020
Grant date	Dec 29, 2020

Abstract

The present invention relates to a cooking pot for a food processor with a heating element, wherein the heating element includes a heating device for generating heat and a heat exchanger with a heat-absorbing side at which the heat exchanger is heatable by the heating device and a heat emission side for heating of foodstuff in the food processor. The heat exchanger includes an opening for a stirrer and a first functional layer at the heat emission side. The heat exchanger includes at least partially a metallic heat conducting layer, which is arranged with the first functional layer such that the heat generated by the heating device is transferable extensively from the heat conducting layer to the first functional layer.

First claim

The invention claimed is:

1. A cooking pot for a food processor with a heating element, wherein the heating element comprises:
a heating device for generating heat, and
a heat exchanger with a heat-absorbing side at which the heat exchanger is heatable by the heating device and a heat emission side for heating of foodstuff in the food processor,
wherein the heat exchanger comprises an opening for a stirrer and a first functional layer at the heat emission side,
wherein
the heat exchanger comprises at least partially a metallic heat conducting layer, which is arranged with the first functional layer such that the heat generated by the heating device is transferable extensively from the heat conducting layer to the first functional layer,
wherein the heating device is a heating layer, which is directly arranged at the heat conducting layer or a second functional layer of the heat exchanger, and
wherein the heating layer comprises a dielectric in order to electrically isolate an electric component of the heating device from the heat exchanger.

2. The cooking pot according to claim 1 ,
wherein
the heat conducting layer is arranged between the first functional layer and a second functional layer.

3. The cooking pot according to claim 2 ,
wherein
at least the first or the second functional layer is configured suitable for foodstuff.

4. The cooking pot according to claim 3 ,
wherein
at least the first or the second functional layer comprises a stainless steel or is consisting of stainless steel.

5. The cooking pot according to claim 1 ,
at least wherein
the opening is arranged in the centre of the heat exchanger or wherein the heat exchanger is configured disk-like.

6. The cooking pot according to claim 1 ,
wherein
a layer thickness of the first functional layer is between 30% and 70% which corresponds to a layer thickness of the heat conducting layer.

7. The cooking pot according to claim 1 ,
wherein
the heating device comprises at least one first resistance element, which is at least wired or inductively energizable for the generation of heat.

8. The cooking pot according to claim 7 ,
wherein
at the first resistance element at least sectionally a dielectric is arranged.

9. The cooking pot according to claim 1 ,
wherein
at the heat exchanger at least one first sensor element is arranged.

10. A food processor with a cooking pot and a drive for a stirrer,
wherein
the cooking pot is configured according to claim 1 .

11. A method for the production of a heating element for a cooking pot for a food processor comprising the following steps:
a) providing a heat exchanger comprising the following steps:
providing a metallic heat conduction plate and at least one first functional plate, wherein the heat conduction plate and the first functional plate each comprise at least one forming area, and
connecting at least the forming area of the heat conduction plate with the forming area of the first functional plate, wherein a heat conducting layer and at least one first functional layer with a heat emission side results such that heat is transferable extensively from the heat conducting layer to the first functional layer, and

b) arranging a heating device at the heat exchanger,
wherein the heating device is a heating layer, which is directly arranged at the heat conducting layer or a second functional layer of the heat exchanger, and
wherein the heating layer comprises a dielectric in order to electrically isolate an electric component of the heating device from the heat exchanger.

12. The method according to claim 11 ,
wherein
the provision of a heat exchanger according to step a) further comprises a provision of a second functional plate, which comprises a further forming area, which is connected with the forming areas of the heat conducting layer and the first functional plate such that a second functional plate of the heat exchanger is generated.

13. The method according to claim 12 ,
wherein
the connection of the forming areas comprises a pressing of the forming areas.

14. The method according to claim 12 ,
wherein the forming area of the heat conducting plate is arranged sandwich-like between the forming areas of the first and second functional plate.

15. The method according to claim 11 ,
wherein
the provision of the heat exchanger according to step a) further comprises the following step:
separation of the forming areas from the heat conducting plate and at least the first or second functional plate.

16. The method according to claim 11 ,
wherein
the arrangement of the heating device at the heat exchanger comprises a printing of a heat layer to the heat exchanger.

17. The method according to claim 11 ,
wherein
the provision of the heat exchanger according to step a) further comprises the following step:
provision of an opening in the heat exchanger.

18. The method according to claim 15 ,
wherein the separation of the forming areas from the heat conducting plate and one of the functional plates or both functional plates is provided at the same time.

19. The method according to claim 11 ,
wherein the method is suitable for the production of the heating element of the cooking pot, wherein the heating element comprises the heating device for generating heat and the heat exchanger with the heat-absorbing side at which the heat exchanger is heatable by the heating device and the heat emission side for heating of foodstuff in the food processor, wherein the heat exchanger comprises an opening for a stirrer and a first functional layer at the heat emission side wherein the heat exchanger comprises at least partially a metallic heat conducting layer, which is arranged with the first functional layer such that the heat generated by the heating device is transferable extensively from the heat conducting layer to the first functional layer.

Assignees

• Vorwerk Co Interholding

Inventors

• Kraut-Reinkober Stefan
• Tietz Sebastian
• Loth Jan-Martin

Classifications

• A47J36/2483

  with electrical heating means · CPC title

• A47J36/02

  Selection of specific materials, e.g. heavy bottoms with copper inlay or with insulating inlay · CPC title

• A47J43/0716 Primary

  for machines with tools driven from the lower side (A47J43/0727 - A47J43/08 take precedence) · CPC title

• H05B3/26

  heating conductor mounted on insulating base {(for transparent areas H05B3/84, H05B3/86)} · CPC title

• A47J27/004 Primary

  with integral electrical heating means (drinking cups with integral heating means A47J36/2466) · CPC title