Mobile device

US10873124B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10873124-B2
Application numberUS-201916550713-A
CountryUS
Kind codeB2
Filing dateAug 26, 2019
Priority dateAug 28, 2018
Publication dateDec 22, 2020
Grant dateDec 22, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A mobile device includes a metal back cover, a dielectric substrate, a grounding metal element, a first radiation element, and a second radiation element. The metal back cover has a slot. The dielectric substrate has a first surface and a second surface, and the second surface faces the slot. The grounding metal element extends onto the first surface of the dielectric substrate. The first radiation element has a feeding point, and is disposed on the first surface of the dielectric substrate. The first vertical projection of the first radiation element at least partially overlaps the slot. The second radiation element is disposed on the second surface of the dielectric substrate. The second vertical projection of the second radiation element at least partially overlaps the slot. An antenna structure is formed by the first radiation element, the second radiation element, and the slot of the metal back cover.

First claim

Opening claim text (preview).

What is claimed is: 1. A mobile device, comprising: a metal back cover, having a slot; a dielectric substrate, having a first surface and a second surface opposite to the first surface, wherein the second surface of the dielectric substrate faces the slot; a grounding metal element, coupled to the metal back cover, and extending onto the first surface of the dielectric substrate; a first radiation element, having a feeding point, and disposed on the first surface of the dielectric substrate, wherein the first radiation element has a first vertical projection on the metal back cover, the first vertical projection at least partially overlaps the slot, and a coupling gap is formed between the first radiation element and the grounding metal element; and a second radiation element, disposed on the second surface of the dielectric substrate, wherein the second radiation element has a second vertical projection on the metal back cover, and the second vertical projection at least partially overlaps the slot; wherein an antenna structure is formed by the first radiation element, the second radiation element, and the slot of the metal back cover. 2. The mobile device as claimed in claim 1 , wherein the slot is a closed slot. 3. The mobile device as claimed in claim 1 , wherein the first vertical projection of the first radiation element at least partially overlaps the second vertical projection of the second radiation element. 4. The mobile device as claimed in claim 1 , wherein the grounding metal element is a grounding copper foil. 5. The mobile device as claimed in claim 1 , wherein the first radiation element substantially has a T-shape. 6. The mobile device as claimed in claim 1 , wherein the second radiation element substantially has a T-shape. 7. The mobile device as claimed in claim 1 , further comprising: a first via element, penetrating the dielectric substrate, wherein the first via element is coupled between the first radiation element and the second radiation element. 8. The mobile device as claimed in claim 1 , further comprising: a third radiation element, coupled to the first radiation element, and disposed on the first surface of the dielectric substrate, wherein the third radiation element has a third vertical projection on the metal back cover, and the third vertical projection at least partially overlaps the slot. 9. The mobile device as claimed in claim 8 , wherein the third radiation element substantially has a rectangular shape. 10. The mobile device as claimed in claim 8 , wherein the antenna structure covers a first frequency band from 2400 MHz to 2500 MHz and a second frequency band from 5150 MHz to 5850 MHz. 11. The mobile device as claimed in claim 10 , wherein the first radiation element, the second radiation element, the third radiation element, and the slot of the metal back cover are excited to generate the first frequency band. 12. The mobile device as claimed in claim 10 , wherein the first radiation element, the second radiation element, and the third radiation element are excited to generate the second frequency band. 13. The mobile device as claimed in claim 10 , wherein a length of the slot is substantially equal to 0.5 wavelength of the first frequency band. 14. The mobile device as claimed in claim 1 , wherein the second radiation element is floating and substantially has an L-shape. 15. The mobile device as claimed in claim 1 , wherein the grounding metal element has an extension portion on the first surface of the dielectric substrate, and the extension portion substantially has a straight-line shape or an L-shape. 16. The mobile device as claimed in claim 15 , wherein the coupling gap between the first radiation element and the extension portion of the grounding metal element is smaller than 3.5 mm. 17. The mobile device as claimed in claim 15 , further comprising: a fourth radiation element, disposed on the second surface of the dielectric substrate, wherein the fourth radiation element has a fourth vertical projection on the metal back cover, and the fourth vertical projection at least partially overlaps the slot. 18. The mobile device as claimed in claim 17 , wherein the fourth radiation element substantially has an inverted T-shape. 19. The mobile device as claimed in claim 17 , further comprising: a second via element, penetrating the dielectric substrate, wherein the second via element is coupled between the extension portion of the grounding metal element and the fourth radiation element. 20. The mobile device as claimed in claim 1 , wherein a thickness of the dielectric substrate is smaller than 0.8 mm.

Assignees

Inventors

Classifications

  • Planar dipole (H01Q9/065 takes precedence; patch antenna H01Q9/0407) · CPC title

  • H01Q1/243Primary

    with built-in antennas · CPC title

  • Dielectric waveguide fed arrays · CPC title

  • Structural form of radiating elements, e.g. cone, spiral, umbrella; {Particular materials used therewith}(H01Q1/08, H01Q1/14 take precedence) · CPC title

  • Combination of fed elements with parasitic elements · CPC title

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Frequently asked questions

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What does patent US10873124B2 cover?
A mobile device includes a metal back cover, a dielectric substrate, a grounding metal element, a first radiation element, and a second radiation element. The metal back cover has a slot. The dielectric substrate has a first surface and a second surface, and the second surface faces the slot. The grounding metal element extends onto the first surface of the dielectric substrate. The first radia…
Who is the assignee on this patent?
Wistron Neweb Corp
What technology area does this patent fall under?
Primary CPC classification H01Q1/243. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 22 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).